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研究生:蕭冠鵬
研究生(外文):Kuan-Peng Hsiao
論文名稱:多階段再回流晶圓針測排程問題之整合性解法
論文名稱(外文):Integrated solution for multi-stage wafer probing scheduling problem with reentry
指導教授:彭文理彭文理引用關係鍾淑馨鍾淑馨引用關係
指導教授(外文):Wen-Lea PearnShu-Hsing Chung
學位類別:碩士
校院名稱:國立交通大學
系所名稱:工業工程與管理系
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:英文
論文頁數:43
中文關鍵詞:多階段再回流晶圓針測序列相依設置時間等效平行機台
外文關鍵詞:multi-stagereentrywafer probingsequential dependent setup timeidentical parallel machine
相關次數:
  • 被引用被引用:2
  • 點閱點閱:308
  • 評分評分:
  • 下載下載:38
  • 收藏至我的研究室書目清單書目收藏:2
多階段再回流晶圓針測排程問題(M-WPSP)是一種平行機台排程問題之實務類型。由於M-WPSP牽涉了涵蓋不同交期的多產品族、到臨時間、再回流、序列與批次處理,以及序列相依設置時間等等特性,使的這樣的問題比典型的平行機台排程問題更為難解。在本論文中,吾人以最小化總機台工作負荷為目標,提出了兩種策略。『順序策略』主要為依據產品製造的順序來進行分段規劃;『同步策略』則是設計來有效解決具有再回流特性之排程問題。除此之外,吾人探討五種現存而用以實行策略之插入程序,並據此發展三種改善之程序。為評量策略的效益,包含四種主要因子(產品族的凝聚程度、溫度改變的考量,交期的緊縮程度以及不同之產品到臨時間)的問題將被測試於兩種不同之工作負荷環境。為比較現存與改善之插入程序,同樣包含數個關鍵因子的測試問題將被提出討論與分析。
The multi-stage wafer probing scheduling problem (M-WPSP) with reentry, is a practical variation of the parallel-machine scheduling problem. Since the M-WPSP involves multiple product families with various job due dates, ready times, reentry, serial and batch operations, sequential dependent setup time, it is more difficult to solve than the classical parallel machine scheduling problems. In this thesis, we consider two strategies to solve the M-WPSP, where the total machine workload must be minimized. The sequential strategy schedules the jobs at the required stages according to the sequence of manufacturing operations. The parallel strategy is designed specifically for the reentrant characteristic. In additional to this, we investigate five existing insertion procedures and develop three modified insertion procedures, which are used to implement the proposed strategies and solve the M-WPSP. To evaluate the efficiency of the proposed strategies, a set of test problems involving four critical factors: the product family ratio, the temperature-change consideration, tightness of due dates, and ready time are designed to test the quality of solutions under two different workload environments. To test the performance of five existing insertion procedures and three modified insertion procedures, another set of test problems, which also involve the critical factors, are provided and analyzed under a single stage environment.
Contents
1. Introduction
2. Multi-Stage Wafer Probing Scheduling Problem
2.1 The Wafer Probing Process
2.2 The M-WPSP Description
3. Solution Strategies for M-WPSP
3.1 Sequential Strategy
The computation of slackness
The estimation of setup time
Slackness allocation (Due date assignment)
Insertion procedure
Adjusting procedure
3.2 Parallel Strategy
Simultaneous Phase
Sequential Phase
4. Performance testing
4.1 Problem design for WPSP
Product family ratio
Temperature-change factor
Tightness of due dates
Ready time factor
4.2 Comparisons for two strategies
4.3 Comparisons for existing and modified insertion procedures
5. Conclusion
Reference
Appendix
[1]Cheng TCE, Sin CCS (1990). A state-of-the-art review of parallel-machine scheduling research. Eur J Opl Res 47: 271-292.
[2]Lee CY et al (1993). Implementation of a decision support system for scheduling semiconductor test operations. J electron Manuf 3: 121-131.
[3]Liaee MM, Emmons H (1997). Scheduling families of jobs with setup times. Int J Prod Res 51: 165-176.
[4]Ovacik IM, Uzsoy R (1992). A shifting bottleneck algorithm for scheduling semiconductor testing operations. J electron Manuf 2: 119-134.
[5]Vakerie BG (2000). Hybrid flow shop scheduling with precedence constraints and time lag to minimize maximum lateness. Int J Prod Econ 64: 101-111.
[6]Suresh V (1997). A note on scheduling of two-stage flow shop with multiple processors. Int J Prod Econ 49: 77-82.
[7]Narahari Y, Khan LM (1996). Modeling reentrant manufacturing systems with inspection stations. J Manuf Sys 15: 367-378.
[8]Potvin Y, Rousseau JM (1993). A Parallel route building algorithm for the vehicle routing and scheduling problem with time windows. Eur J Opl Res 66: 331-340.
[9]Solomon MM (1987). Algorithms for the vehicle routing and scheduling problem with time window constraints, Opl Res 35: 254-265.
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