臺灣博碩士論文加值系統

在多層電路板中，通常具有專屬的電源層/接地層(power/ground plane)作為系統電源與信號回流路徑之用。而同步切換雜訊(Simultaneous Switching Noise, SSN)是電源系統產生電磁干擾與傳播電磁干擾的主要機制。
本論文採用傳輸矩陣法(Transmission matrix method)來分析電源/接地層結構問題。利用電路串接相等於傳輸矩陣相乘的性質，傳輸矩陣法提供一個有效率的模擬方案。本法的另一優點在於可以分析任意形狀的結構。
最後，文章將以傳輸矩陣法分析電源/接地層規劃中常見的設計方式：不規則的電源層結構。由分析結果可以得到：精巧的電源層拓樸設計可以改變問題結構的阻抗特性。

In the multilayer printed circuit board, it is prevalent to use dedicated power/ground planes for power delivery network. On the network, simultaneous switching noise (SSN) is a primary source of electromagnetic interference (EMI) and signal integrity.
In this thesis, we use transmission matrix method to simulate and model SSN problem of power/ground plane structure. With this matrix model, SSN can be efficiently evaluated for both the rectangular and arbitrarily shaped power/ground plane structures.
In the end of this thesis, we use transmission matrix to analyze a familiar power/ground plane design issue: irregular shaped power plane. From the simulation results, we can conclude that a delicate topology for power plane changes the impedance characteristic of problem structure.

目錄
中文摘要…………………………………………………………… i
英文摘要………………………………………………………… ii
誌謝………………………………………………………………… iii
目錄………………………………………………………………… iv
圖目錄……………………………………………………………… v
第一章 簡介……………………………………………………… 1
第二章 研究方法………………………………………………… 6
2-1傳輸矩陣法………………………………………………… 6
2-2單元模型…………………………………………………… 7
2-3矩形電源層結構的分析……………………………… 10
2.3.1運算單元傳輸矩陣的建立…………………………… 10
2.3.2整體結構的傳輸矩陣………………………………… 16
2.3.3整體矩形結構的阻抗矩陣…………………………… 20
2-4 L形電源層結構的分析…………………………………… 21
2-5不規則形電源層結構的分析……………………………… 22
第三章 數值結果與討論………………………………………… 34
3-1 資料結構及程式流程……………………………………… 34
3-2 準確性驗證………………………………………………… 37
3-3 不規則形的討論…………………………………………… 38
第四章 結論……………………………………………………… 51
參考文獻………………………………………………………… 52
附錄A 多埠網路傳輸矩陣與阻抗矩陣回顧……………………… 53

參考文獻
[1] S. Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, “Study of the ground bounce caused by power resonance,” IEEE Trans. Electromagn. Compat., vol. 40, pp. 111-119, May 1998.
[2] T. K. Sarkar, “Accurate modeling of frequency responses of multiple planes in gigahertz packages and board,” in Proc. 9th Topical Meeting Elect. Perform. Electron. Packag., Oct. 2000, pp. 59-62.
[3] K. Lee and A. barber “Modeling and analysis of multichip module power supply planes,” IEEE Transactions on Components, Packing Technology-Part B, vol. 18, pp. 628-639, Nov. 1995.
[4] T. Okoshi, Planar Circuits for Microwaves and Lightwave. Munich, Germany: Springer-Verlag, 1984.
[5] J. Kim and M. Swaminathan, “Modeling of irregular shaped power distribution networks using transmission method,” in Proc. 9th Topical Meeting Elect. Perform. Electron. Packag., Oct. 2000, pp. 247-250.
[6] J. Kim and M. Swaminathan, “Modeling of irregular shaped power distribution planes using transmission matrix method,” IEEE transaction on advanced packaging, vol. 24, NO. 3, Aug 2001.
[7] E. Horowitz, S. Sahni, and D. Mehta, Fundamentals of data structures in C++. Kings Information, 2002.