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研究生:劉代山
研究生(外文):Day-Shan Liu
論文名稱:金屬與磷化銦鎵蕭特基接觸之研究
論文名稱(外文):Investigation for Metals Schottky Contact to InGaP Layer
指導教授:李清庭
指導教授(外文):Ching-Ting Lee
學位類別:博士
校院名稱:國立中央大學
系所名稱:光電科學研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:英文
論文頁數:123
中文關鍵詞:蕭特基接觸金屬磷化銦鎵
外文關鍵詞:Schottky contactsMetalsInGaP
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封面
Abstract
List of Tables
List of Figures
Chapter 1 Introduction
Chapter 2 Metals Schottky Contact to the InGaP Layer
2-1 Introduction
2-2 Experimental procedure
2-3 Experimental results
2-4 Conclusions
Chapter 3 Thermal Reliability for Metals Schottky Contact to the InGaP Layer
3-1 Introduction
3-2 Experimental procedure
3-3 Experimental results
3-4 Conclusions
Chapter 4 Thermal Degradation Mechanism for Cu/Au Schottky Contacts to the InGaP
4-1 Introduction
4-2 Experimental procedure
4-3 Experimental results
4-4 Conclusions
Chapter 5 Physical Formation and Mechanisms for Cu/Au Schottky Contacts to the InGaP Layer
5-1 Introduction
5-2 Experimental procedure
5-3 Experimental results
5-4 Conclusions
Chapter 6 Failure Mechanism for Cu/Au Schottky Contacts to the InGaP Layer
6-1 Introduction
6-2 Experimental procedure
6-3 Experimental results
6-4 Conclusions
Chapter 7 Investigation of Sputtered W Film as a Diffusion Barrier between the Cu and InGaP Layer
7-1 Introduction
7-2 Experimental procedure
7-3 Experimental results
7-4 Conclusions
Chapter 8 Conclusions
References
References
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