臺灣博碩士論文加值系統

以p20為基材，次磷酸鈉為鍍液的還原劑，比較真空及一般熱處理爐下進行不同冷卻方式、不同熱處理時間的條件較下鍍膜硬化機構及耐腐蝕性之性質。以XRD、SEM、微小硬度機及浸漬實驗等方法，觀察鍍層表面型態、硬度變化、和元素分佈，探討硬化機構與耐腐蝕之性能。
由分析結果顯示鍍層經熱處理後會析出Ni3P相，在400℃處理溫度下，Ni基地結晶性會影響Ni3P的析出，Ni基地結晶性差，有利於Ni3P相析出而獲得較高之硬度。且Ni3P析出相晶體之c/a值越小時，硬度值越高。在耐腐蝕方面，鍍膜經400℃熱處理0.5小時後，其耐腐蝕性最佳，其原因為Ni基地組織尚未完全結晶，含有部分非晶形組織，故較耐腐蝕。另外鍍膜以真空熱處理後之腐蝕重量損失速率較為平緩，而一般熱處理的重量損失在浸漬18小時後有急劇增加的趨勢。由硬度與耐腐蝕性之分析可得，鍍膜經一般熱處理0.5小時水冷後所得之硬度及耐腐蝕性兼備。

In this study, we adopt P20 as substrate and sodium hypophosphite as reducing agent in the coating liquid to produce electroless Nickel layer. In our research, we used XRD, SEM, Vicker’s hardness apparatus, and soak experiment to analyze layer’s surface pattern, hardness variation and elements distribution to find out the harden mechanism and corrosion prevention of Nickel layer in the different vacuum degree, cooling mode and heat treatment time.
By the experiment results, we could find the coating layer precipitated Ni3P phase by 400℃ heat treatment. In this treatment temperature, the precipitated of Ni3P was affected by Ni matrix, that is to say, Ni3P could precipitate easily to get better hardness of the layer when the crystallization of the Ni matrix was poor. And when the c/a specific value of Ni3P crystal was more and more low, the hardness of the layer was more and more high.
In the corrosion-resisting of the Ni layer, the corrosion-resisting of the Ni layer was the best through 0.5hr heat treatment time at 400℃ because the Ni matrix still contain the part of amorphousness; and further, the weight loss rate of the layer was relatively mild in the vapor heat treatment, and it had rapidly raise after 18hr of soak in the general heat treatment.
By the analysis of the relation between the hardness and corrosion-resisting of Ni layer, we could find out the coating layer had gotten good hardness and corrosion-resisting by the general heat treatment 0.5hr and water cooling.

中文摘要I
英文摘要II
誌謝III
目錄IV
表目錄VII
圖目錄VIII
一、緒論1
二、文獻探討2
2.1 發展沿革2
2.2近年來無電鍍鎳研究的方向及分類2
2.2.1無電鍍鎳觸媒的開發2
2.2.2反應行為及鍍浴穩定性2
2.2.3 新材料的開發3
2.2.4 電子陶瓷接點界面電性研究3
2.2.5與無電鍍鎳有關的研究3
2.2.6無電鍍鎳研究的分類4
2.3無電鍍鎳膜備製與反應機制4
2.4鍍膜組織與結構7
2.5 析出硬化8
2.6 晶格常數計算公式10
2.7鍍膜特性11
2.7.1硬度與熱處理溫度之關係11
2.7.2鍍膜析鍍後產生之應力11
2.7.3良好的耐腐蝕性12
2.7.4均一性之優異應用12
2.7.5擁有磁電性12
2.7.6延展性13
2.7.7磨耗性13
2.7.8鍍膜的物理性質14
2.8影響鍍膜硬化之因素15
2.9影響鍍膜耐腐蝕性之因素15
三、研究方法與步驟20
3.1研究架構20
3.2基材成分21
3.3鍍浴成分21
3.4 製程參數設定201
3.5研究步驟22
3.6鍍膜檢測24
3.6.1硬度24
3.6.2表面型態25
3.6.3 X-Ray25
3.6.4 耐腐蝕性25
3.6.5 膜厚25
四、結果與討論27
4.1鍍膜硬化機構27
4.2 鍍膜成分與厚度28
4-3鍍膜表面狀態29
4-4鍍膜組織與硬度之關係30
4-4.1 Ni基地結晶性之影響30
4-4.2 Ni3P析出相晶體之c/a值大小31
4-5鍍膜成分與硬度之關係32
4-6氧化膜與鍍膜硬度之關係33
4-7熱處理參數與鍍膜硬度之關係35
4-7-1熱處理時間36
4-7-2冷卻方式37
4-7-3熱處理真空度39
4-8鍍膜耐腐蝕性分析40
4-8-1 熱處理時間41
4-8-2 冷卻方式43
4-8-3處理爐真空度44
4-9 腐蝕造成之鍍膜破壞47
4-10鍍膜硬度與耐蝕性之匹配選取49
五、結論51
六、參考文獻52

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