關鍵層，半導體製造黃光區經常有分關鍵層與非關鍵層，為了要減少層跟層之間的偏移，會要求在同一台機台上加工；關鍵層機台限制，即產品在下線投料時，第一層關鍵層是在某一機台加工，則以後所有的相關關鍵層皆要在同一台機台上生產，不得轉至其他機台；非關鍵層則無此限制；關鍵層機台限制可增加品質的穩定度，但其限制會使原本已是瓶頸機台的微影機台，在生產管制作業更困難和複雜。
本研究以提出一個黃光區在關鍵層限制下的機台指派法則，考慮產品的迴流性及微影機台當機情況，使其達到機台負荷平均、總產出增加、縮短平均生產週期。當產品到達第一關鍵層時，計算可用機台的未來關鍵層負荷，則此產品所有關鍵層皆必須在此機台上加工；當產品到達非關鍵層時，依照機台目前負荷大小投入。經由模擬結果可知，本研究所發展方法，確實可有效平衡機台負荷、提升總產出與縮短平均生產週期時間。本研究並將所提之機台指派，配合常用的投料與派工找出在各個不同的績效值下的最佳組合。

In semiconductor manufacturing, critical layers of a wafer lot often required to be processed at the same photolithographic machine in order to meet stringent cross-layer registration requirement. Non-critical layers do not have such requirement.
In this thesis, an algorithm was developed to balance the machine loading for photolithographic area considering the mixture of critical vs. non-critical layers constraints, the re-entrant nature in a fab, and the individual machine break down probabilities. The algorithm assigns the machines for critical layers based on the loading for the machines with respect to the critical layer’s remaining life-cycle loading and assigns the machine’s for non-critical layers based on relative dynamic loading of the available machines.
Simulation results indicated better overall local balance, throughput, and in fab cycle time of this approach compare to random machine assignments and intuitive dynamic loads balancing approach. The research continued to test various common order releasing and dispatching combinations. Best machine combinations of order releasing and dispatching methods were identified.

目錄
摘要......................................... Ⅰ
英文摘要..................................... Ⅱ
致謝......................................... Ⅲ
目錄......................................... Ⅳ
圖目錄....................................... Ⅵ
表目錄....................................... Ⅶ
第一章 、緒論................................ 1
1.1 研究動機與背景：......................... 1
1.2 研究目的................................. 2
1.3 研究範圍與限制........................... 2
1.4 研究方法與步驟........................... 4
第二章 、文獻探討............................ 6
2.1 半導體製程簡介........................... 6
2.2 生產作業控制(投料與派工法則)............. 8
2.2.1 投料法則............................... 8
2.2.2 派工法則探討........................... 13
2.3 相關文獻探討............................. 15
2.4 模型建構與模擬........................... 15
2.4.1 模擬的定義............................. 16
2.4.2 模擬的角色............................. 16
第三章 、研究方法與理論分析.................. 17
3.1 衡量晶圓廠績效之指標..................... 17
3.1.1 整廠性的績效指標....................... 17
3.1.2 黃光區績效指標......................... 19
3.1.3 黃光機台關鍵指標....................... 19
3.1.4 指標的選擇............................. 20
3.2 關鍵層機台限制模式構建................... 21
3.2.1 工作站情境說明......................... 21
3.2.2 參數定義............................... 22
3.2.3 模式建構步驟........................... 22
3.3 模擬架構................................. 23
3.4 投料法則與派工法則的選擇................. 24
3.4.1 投料法則的選擇......................... 24
3.4.2 派工法則的選擇......................... 25
第四章 、模擬驗證............................ 26
4.1 系統環境說明............................. 26
4.1.1 產品基本資料........................... 26
4.1.2 工作站基本資料......................... 27
4.1.3 交期的設定............................. 28
4.1.4 投料法則與派工法則參數之設定........... 28
4.2 模擬模式與分析........................... 31
4.2.1 模擬系統的建構......................... 31
4.2.2 決定模擬穩態時間....................... 32
4.2.3 模式名稱設定........................... 32
4.2.4 群組模式下各機台負荷值實例............. 33
4.3 分析實施後的具體成效..................... 34
4.3.1 群組機台模式比較....................... 34
4.3.2 機台群組下投料與派工的搭配分析......... 40
4.3.3 分析結果彙整........................... 51
第五章 、結論與未來研究方向.................. 53
5.1 結論..................................... 53
5.2 未來研究方向............................. 53
第六章 、參考文獻............................ 54
第七章 、附錄................................ 57
附錄A........................................ 57
附錄B........................................ 80

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