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研究生:陳冠中
研究生(外文):Kun-Chung Chen
論文名稱:溫度-時間效應對底膠填充材料機械性質影響之研究
論文名稱(外文):Characterization of Underfill Materials Under Time-Temperature
指導教授:葉銘泉葉銘泉引用關係
指導教授(外文):Ming-Chung Yip
學位類別:碩士
校院名稱:國立清華大學
系所名稱:動力機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:中文
論文頁數:73
中文關鍵詞:底膠填充(填膠)潛變溼度擴散費克定理
外文關鍵詞:UnderfillCreepMoisture DiffusionFick's Law
相關次數:
  • 被引用被引用:3
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本文的目的在於探討封裝材料底膠填充其受到不同溫度及快慢不同應變率下後對機械性質之影響,以及黏彈/塑性材料中當操作溫度(K)大於其熔點(K)1/2時易發生的潛變行為,亦即黏彈/塑性材料在室溫(25℃)受到力量負載時也會存在有潛變行為;而在封裝工業上會使封裝產品腐蝕而造成產品可靠度下降的吸溼實驗在此作一並的探討。
由實驗結果知,底膠填充試片隨著拉伸速率之不同有著不同變化,其趨勢為拉伸速率越快,破壞應力較高,相對地,拉伸速率越慢,試片承受軸向拉伸時間越久,其破壞應變較長,除了拉伸速率快慢影響破壞應變此因素外,溫度亦是影響因素之一。濕度擴散方面,在高等級的溫溼度環境下,假設擴散係數為常數下的實驗,僅在極短的時間內其吸溼行為是遵守費氏吸溼曲線行為;實驗結果顯示在整個過程中,擴散係數可解釋為並非一固定常數而是與濃度相關。

The differences of the mechanical properties of underfill influenced in operating on several temperatures and strain rate level was investigated. As to the moisture and the creep effect on underfill was also studied to fit some suit model by experimental data.
It was observed that the fracture stress is higher at a faster strain rate or at a low temperature level, but the fracture strain is on the opposite.
The coefficient of moisture diffusion is not always keeping in a constant on the whole progress but is relative to concentration. The creep model is also found by a hyperbolic sine type power law.

一、前言…………………………………………………………………1
二、研究動機……………………………………………………………3
三、文獻回顧……………………………………………………………5
3.1 概論………………………………………………………………5
3.2 底膠填充材料組成及類型運用…………………………………5
3.3 測試方法及試片形狀影響………………………………………6
3.4 底膠填充相關研究………………………………………………7
3.5 溼度擴散相關研究………………………………………………8
四、理論基礎……………………………………………………………10
4.1 潛變理論…………………………………………………………10
4.1.1 潛變…………………………………………………………10
4.1.2 潛變變形理論及相關數學模型……………………………11
4.2 擴散理論…………………………………………………………13
4.2.1 費氏擴散定律………………………………………………13
4.2.2 擴散係數D之求法…………………………………………16
五、研究方法……………………………………………………………18
5.1 儀器簡介…………………………………………………………18
5.1.1 Instron-8848微拉伸試驗機………………………………18
5.1.2 溫度和溼度控制箱…………………………………………19
5.1.3 微氣動式夾頭………………………………………………20
5.1.4 可變換夾面夾頭……………………………………………20
5.1.5 掃描式電子顯微鏡…………………………………………20
5.2 試片準備…………………………………………………………20
5.2.1 底膠填充試片簡介…………………………………………20
5.2.2 試片尺寸及裁切……………………………………………21
5.3 實驗方法及程序…………………………………………………23
5.3.1 常溫下的靜態拉伸…………………………………………23
5.3.2 相同應變率不同溫度的拉伸試驗…………………………23
5.3.3 潛變拉伸測試………………………………………………24
5.3.4 溼度吸溼實驗分析…………………………………………24
六、結果與討論…………………………………………………………26
6.1 底膠填充試片之軸向拉伸試驗…………………………………26
6.2 應力-應變曲線關係………………………………………………26
6.3 溫度-應變率與彈性模數之關係…………………………………27
6.4 破壞斷面SEM觀測…………………………………………………28
6.5 溼度擴散實驗探討………………………………………………29
6.6 潛變實驗結果分析………………………………………………31
6.7 潛變模型…………………………………………………………31
七、結論…………………………………………………………………34
八、文獻參考……………………………………………………………36

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