臺灣博碩士論文加值系統

近幾年來，筆記型電腦的市場佔有率逐年增加，產品性能日益增加。面對越來越高的晶片工作時脈，如何有效作廢熱處理以避免熱集中現象，已成為散熱設計者所需面臨的艱鉅挑戰。為了節省人力物力與時間，業界普遍採用數值模擬軟體並搭配實驗的佐證，藉此來達到所欲改善的散熱設計。
本文以I-DEAS中的ESC（Electronic System Cooling）模組為工具，首先以市售某機型內含Intel P4M 1.4GHz（發熱量25.8W）筆記型電腦專用中央處理器，針對中央處理器散熱模組及筆記型電腦實驗數據進行模擬比對，以驗證吾人所建立的數值模擬模型、輸入參數及操作方法是否正確。第二部分是將中央處理器升級為Intel P4M 2.2GHz（發熱量為35W），探討有利於快速降溫之有效散熱方法。第三部分則在不更動系統內其他元件配備與設計的情形下，將桌上型專用中央處理器Intel P4 2.26GHz（發熱量為56W）植入原有之空間內，進行數值模擬，並提出進一步改良之散熱設計。結果顯示在高發熱量之情況下，熱管加大、鰭片面積加寬、風扇風量加大及採用鋁鎂合金外殼等皆屬必要措施。至於將電池外接，使散熱空間增加並作更有效之運用也是建議採行之方法。

The share of the notebook computers (NB) of the whole pc market has increased steadily in the recent years. The performance of the NB’s has also been enhanced tremendously. However, due to the high working speed of the central processing units (CPU), the accumulation of heat generated by the CPU and other electric components causes a serious problem. It thus constitutes a great challenge in the design of the NB’s. In order to save the time and the cost, the common way in the thermal design of NB’s is to employ the computational software along with conducting some necessary experiments.
In this study, a commercial software I-DEAS ESC (Electronic System Cooling) was chosen as the design tool. Attention was first given to a commercially available NB, which was equipped with an Intel P4M 1.4Gz CPU (25.8W). The system cooler including a fan, a heat sink and a heat pipe was tested, and the experiment data were compared with the numerical results. Good agreement was achieved. Therefore, the model for simulation associated with the input data and the process was verified. Secondly, the original CPU was upgraded to P4M 2.2Gz (35W) to examine the thermal and fluid fields. Several ways for reducing the CPU working temperature were discussed. In the end, a P4 2.26Gz (56W) CPU, designed for they desktop PC, was implanted in the NB, and further improvements were proposed in order to cut down the working temperature. It was shown that due to the high dissipation power of such a CPU, several ways were found to be necessary. These include enlarging the heat pipe as well as the fins, increasing the working power of the fan, and replacing the case of ABS plastic with AL-Mg alloy. One further suggestion is to remove the built-in battery so that the space left can be utilized more efficiently.

目錄
頁次
中文摘要……………………………………………………………………Ⅰ
英文摘要……………………………………………………………………Ⅱ
目錄…………………………………………………………………………Ⅲ
表目錄………………………………………………………………………Ⅵ
圖目錄………………………………………………………………………Ⅶ
符號說明……………………………………………………………………ⅩⅢ
第一章 緒論………………………………………………………………01
1-1 前言……………………………………………………………….01
1-2 文獻回顧………………………………………………………….02
1-3 研究動機與目的………………………………………………………05
1-4 研究方法與模擬分析…………………………………………………05
第二章 數值方法…………………………………………………………07
2-1 前言……………………………………………………………….07
2-2 數值模擬理論……………………………………………………07
2-2-1 數值方法…………………………………………………07
2-2-2 基本理論與假設…………………………………………07
2-2-3 統御方程式………………………………………………08
2-2-4 離散方程式………………………………………………10
2-3 數值模擬流程……………………………………………………12
2-3-1 前處理……………………………………………………12
2-3-2 建立有限元素定義………………………………………13
2-3-3 後處理……………………………………………………14
第三章 結果與討論………………………………………………………15
3-1 散熱模組之結果與討論…………………………………………15
3-1-1 實驗與模擬結果之比較…………………………………15
3-1-2 網格數及收斂條件之影響………………………………17
3-2 筆記型電腦全機模擬與實驗之結果和討論……………………17
3-2-1 原型全機數值模擬………………………………………17
3-2-2 實驗結果與討論…………………………………………19
3-2-3 高階中央處理器Intel P4M2.2GHz（35W）模擬改良討
論…………………………………………………………20
3-3 桌上型中央處理器Intel 2.26GHz（56W）……………….…22
3-3-1 全機數值模擬……………………………………………23
3-4 散熱模組改良模擬…………………………………………….23
3-4-1 鰭片上加裝均熱板與不同熱管之影響…………………24
第四章 結論與未來展望…………………………………………………27
4-1 結論…………………………………………………………….27
4-2 未來展望……………………………………………………….28
參考文獻……………………………………………………………………66
表目錄
頁次
表3-1 散熱模組實驗數據與模擬結果比較…………………………….30
表3-2 筆記型電腦數值模擬結果……………………………………….30
表3-3 筆記型電腦實驗數據與數值模擬結果………………………….31
表3-4 原機型與改良後數值比較……………………………………….32
表3-5 筆記型電腦採用桌上型CPU數值模擬結果………………………32
表3-6 模組九與改良後數值比較……………………………………….33
圖目錄
頁次
圖2-1 網格示意圖………………………………………………………34
圖2-2 單個元素的示意圖………………………………………………34
圖3-1 散熱模組實際外觀………………………………………………35
圖3-2 散熱模組簡圖……………………………………………………35
圖3-3 散熱模組數值模擬模型…………………………………………36
圖3-4 熱管k值對溫度之影響………………………………………….36
圖3-5 散熱模組流場分布圖1………………………………………….37
圖3-6 散熱模組流場分布圖2………………………………………….37
圖3-7 散熱模組固體溫度分布圖………………………………………38
圖3-8 散熱模組網格數相關性比較……………………………………38
圖3-9 散熱模組收斂條件與固體溫度…………………………………39
圖3-10 散熱模組收斂條件與CPU處理時間…………………………….39
圖3-11 筆記型電腦數值模型（1）…………………………………….40
圖3-11 筆記型電腦數值模型（2）…………………………………….40
圖3-12 筆記型電腦模組一流場分布圖（1）………………………….41
圖3-13 筆記型電腦模組一流場分布圖（2）………………………….41
圖3-14 筆記型電腦模組一主機板及晶片溫度分布圖…………………42
圖3-15 筆記型電腦模組一CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………42
圖3-16 筆記型電腦模組一機殼溫度分布圖……………………………43
圖3-17 恆溫恆濕槽………………………………………………………43
圖3-18 筆記型電腦測量概況……………………………………………44
圖3-19 筆記型電腦模組二 主機板及晶片溫度分布圖……………….44
圖3-20 筆記型電腦模組二 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖……………………………………………………..45
圖3-21 筆記型電腦模組二 機殼溫度分布圖………………………….45
圖3-22 筆記型電腦中央處理器規格表…………………………………46
圖3-23 筆記型電腦模組五 主機板及晶片溫度分布………………….46
圖3-24 筆記型電腦模組五 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖.…………………………………………………….47
圖3-25 筆記型電腦模組五 機殼溫度分布圖………………………….47
圖3-26 筆記型電腦模組六 主機板及晶片溫度分布………………….48
圖3-27 筆記型電腦模組六 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………48
圖3-28 筆記型電腦模組六 機殼正面溫度分布圖…………………….49
圖3-28 筆記型電腦模組六 機殼反面溫度分布圖…………………….49
圖3-29 筆記型電腦模組七 主機板及晶片溫度分布………………….50
圖3-30 筆記型電腦模組七 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………50
圖3-31 筆記型電腦模組七 機殼正面溫度分布圖…………………….51
圖3-31 筆記型電腦模組七 機殼反面溫度分布圖…………………….51
圖3-32 筆記型電腦模組八 主機板及晶片溫度分布………………….52
圖3-33 筆記型電腦模組八 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………52
圖3-34 筆記型電腦模組八 機殼正面溫度分布圖…………………….53
圖3-34 筆記型電腦模組八 機殼反面溫度分布圖…………………….53
圖3-35 桌上型電腦中央處理器規格表…………………………………54
圖3-36 筆記型電腦模組九 主機板及晶片溫度分布………………….54
圖3-37 筆記型電腦模組九 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………55
圖3-38 筆記型電腦模組九 機殼正面溫度分布圖…………………….55
圖3-38 筆記型電腦模組九 機殼反面溫度分布圖…………………….56
圖3-39 筆記型電腦模組十 主機板及晶片溫度分布………………….56
圖3-40 筆記型電腦模組十 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………57
圖3-41 筆記型電腦模組十 機殼正面溫度分布圖…………………….57
圖3-41 筆記型電腦模組十 機殼反面溫度分布圖…………………….58
圖3-42 筆記型電腦模組十一 主機板及晶片溫度分布……………….58
圖3-43 筆記型電腦模組十一 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………59
圖3-44 筆記型電腦模組十一 機殼正面溫度分布圖………………….59
圖3-44 筆記型電腦模組十一 機殼反面溫度分布圖………………….60
圖3-45 筆記型電腦模組十二 主機板及晶片溫度分布……………….60
圖3-46 筆記型電腦模組十二 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………61
圖3-47 筆記型電腦模組十二 機殼正面溫度分布圖………………….61
圖3-47 筆記型電腦模組十二 機殼反面溫度分布圖………………….62
圖3-48 筆記型電腦模組十二 均熱板溫度分布圖（1）………………62
圖3-48 筆記型電腦模組十二 均熱板溫度分布圖（2）………………63
圖3-48 筆記型電腦模組十二 均熱板溫度分布圖（3）………………63
圖3-49 筆記型電腦模組十三 主機板及晶片溫度分布……………….64
圖3-50 筆記型電腦模組十三 CD-R、HDD、Floppy、Battery、PCMIC
溫度分布圖………………………………………………………64
圖3-51 筆記型電腦模組十三 機殼正面溫度分布圖………………….65
圖3-51 筆記型電腦模組十三 機殼反面溫度分布圖………………….65
符號說明
一般符號
ρ 密度
時間
卡式座標下之平均速度向量
壓力
Static enthalpy
動量方程式之源項
能量方程式之源項
卡式座標下之變數
有效之動粘滯係數
層流場之動粘滯係數
紊流場之動粘滯係數
能量方程式之有效擴散係數
層流場之普朗特數
紊流場之普朗特數
次表面面積
H在次表面的離散值
有限體積各個面的總和
T 溫度
TCPU 中央處理器之溫度
Tout 散熱模組出風口處之溫度
Tamb. 環境溫度
TVIA 顯示晶片之溫度
Tchip 電源轉換晶片
TSOUTH 南橋晶片之溫度
THDD 硬碟之溫度
TCD-R 光碟機之溫度
TBATT. 電池之溫度
TMAX. 最高溫度
TMIN. 最低溫度
VMAX. 最大速度
下標
i , j 三維方向指標
ip 積分點（integration point）

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