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研究生:黃健峰
研究生(外文):Chien-Feng Huang
論文名稱:PBGA構裝在溫度循環下之錫球應力與可靠度分析
論文名稱(外文):Reliability Analysis of Solder Balls on PBGA Packages
指導教授:張嘉隆張嘉隆引用關係
指導教授(外文):Chia-Lung Chang
學位類別:碩士
校院名稱:國立雲林科技大學
系所名稱:機械工程系碩士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2003
畢業學年度:91
語文別:中文
論文頁數:80
中文關鍵詞:熱疲勞焊錫接點等效潛變應變範圍可靠度遲滯曲線
外文關鍵詞:thermal fatigueequivalent creep strain rangereliabilityhysteresis loop.solder joint
相關次數:
  • 被引用被引用:6
  • 點閱點閱:258
  • 評分評分:
  • 下載下載:68
  • 收藏至我的研究室書目清單書目收藏:0
在熱疲勞下,電子構裝體的失效通常是由於錫球接點因潛變/疲勞所引起;所以瞭解此類焊錫接點的應力╱應變行為,是描繪它們破壞行為的第一步。本文針對mini-BGA構裝體在溫度循環負載之下,以有限元素分析軟體ANSYS進行非線性模擬分析。首先以Pao等人於1992年所做之雙層板實驗做為驗證,探討FEM模型網格大小對於數值運算收斂之影響,並整理分析數據與文獻實驗結果作比較,歸納出模型建立法則,應用於mini-BGA構裝之模擬。經由模擬驗証與實驗比較之結果,發現模擬之結果與實驗之遲滯曲線相當吻合,由此確認模擬方法之可靠性。
在mini-BGA構裝分析方面,分別以2D模型及3D模型來模擬mini-BGA構裝在溫度循環下之行為,得到錫球的應力╱應變關係與等效潛變應變範圍,再利用Shine and Fox所提出之疲勞模型,將所得之結果轉換為可靠度之數據。
The failure of electronic packages is usually caused by the fatigue damage of solder balls. In order to understand the damage mechanism, it is important to describe properly the stress/strain behavior of solder joints. In this study, the reliability analysis of solder balls on mini-BGA package under temperature cycling test is performed by nonlinear finite element software ANSYS. The solder joint on double beam model by Pao is studied to investigate the effect of mesh size on the convergence of solutions. Also the simulated results are compared with the experimental measurements to verify the model. The simulation results of hysteresis loops for double beam model are quite agreed with experimental measurements.
Both 2D and 3D model of solder balls on mini-BGA are built to simulate the nonlinear behavior of solder balls under temperature cycling test. The range of equivalent creep strain of the critical solder ball during one thermal cycle is obtained from the history of solder ball response. Then the Shine and Fox formula is used to predict the fatigue life of the solder ball.
目 錄

中文摘要 --------------------------------------------------------------------------- i
英文摘要 --------------------------------------------------------------------------- ii
誌謝 --------------------------------------------------------------------------- iii
目錄 --------------------------------------------------------------------------- iv
表目錄 --------------------------------------------------------------------------- v
圖目錄 --------------------------------------------------------------------------- vi
符號說明 --------------------------------------------------------------------------- vii
第一章 緒論--------------------------------------------------------------------- 1
1-1 前言--------------------------------------------------------------------- 1
1-2 研究動機與目的------------------------------------------------------ 3
1-3 文獻回顧--------------------------------------------------------------- 3
1-4 本文架構--------------------------------------------------------------- 5
第二章 理論基礎--------------------------------------------------------------- 6
2-1 非線性理論------------------------------------------------------------ 6
2-2 應力╱應變曲線------------------------------------------------------ 9
2-3 降伏點規範------------------------------------------------------------ 10
2-4 潛變理論--------------------------------------------------------------- 11
2-5 疲勞模型介紹--------------------------------------------------------- 13
2-6 雙層板理論------------------------------------------------------------ 14
2-7 誤差評估--------------------------------------------------------------- 17
第三章 錫球模擬驗證--------------------------------------------------------- 19
3-1 雙層板模型簡介------------------------------------------------------ 19
3-2 模擬方法--------------------------------------------------------------- 21
3-2-1 模擬分析元素介紹--------------------------------------------------- 22
3-2-2 模擬分析程序--------------------------------------------------------- 22
3-3 結果分析與討論------------------------------------------------------ 28
第四章 錫球有限元素疲勞分析--------------------------------------------- 39
4-1 mini-BGA模型介紹-------------------------------------------------- 39
4-2 2D模型分析結果----------------------------------------------------- 43
4-3 3D模型分析結果----------------------------------------------------- 50
4-4 結果分析與討論------------------------------------------------------ 60
第五章 結論--------------------------------------------------------------------- 62
5-1 結論--------------------------------------------------------------------- 62
5-2 未來展望--------------------------------------------------------------- 62
參考文獻 --------------------------------------------------------------------------- 64
簡歷 --------------------------------------------------------------------------- 66
參 考 文 獻

1.John H. Lau, 1991, “Solder Joint Reliability: Theory and Application”, Van Nostrand Reinhold, New York.
2.John H. Lau, 1995,” Ball Grid Array Technology”, McGraw-Hill Inc., New York.
3.John H. Lau and Yi-Hsin Pao, 1997, “Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies”, McGraw-Hill Inc., New York.
4.Peter M. Hall, 1984,“Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-7, No. 4, pp. 314-327.
5.H. D. Solomon, 1986, “Creep, Strain Rate Sensitivity and Low Cycle Fatigue of 60/40 Solder”, General Electric Corporate Research and Development Center, Schenectady, New York, USA.
6.Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor and Ron Cooper, 1992, “Measurement of Mechanical Behavior of High Lead-Tin Solder Joints Subjected to Thermal Cycling”, Transactions of the ASME, Journal of Electronic Packaging, June, Vol. 114, pp. 135-144.
7.Yi-Hsin Pao, Ratan Govila, Scott Badgley and Edward Jih, 1993, “An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints”, Transactions of the ASME, Journal of Electronic Packaging, March, Vol. 115, pp. 1-8.
8.Yi-Hsin Pao, Scott Badgley, Edward Jih, Ratan Govila and J. Browning, 1993, “Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints”, Transactions of the ASME, Journal of Electronic Packaging, June, Vol. 115, pp. 147-152.
9.G. Z. Wang, Z. N. Cheng, K. Becker and J. Wilde, 2001, “Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys”, Transactions of the ASME, Journal of Electronic Packaging, September, Vol. 123, pp. 247-253.
10.Robert Darveaux, 1997, “Solder Joint Fatigue Life Model”, Proceedings of TMS Annual Meeting, Orlando, FL, pp. 213-218.
11.Robert Darveaux, 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation”, IEEE Electronic Components and Technology Conference, pp. 1048-1058.
12.W. W. Lee, L. T. Nguyen and G. S. Selvaduray, 1999, “Solder joint fatigue models: review and applicability to chip scale packages”, Microelectronics Reliability, USA.
13.B. Nagaraj and M. Mahalingam, 1998, “Package-to-Board Attach Reliability-Methodology and Case Study on OMPAC Package”, Transactions of the ASME, Journal of Electronic Package, September, Vol. 120, pp. 290-295.
14.W. Engelmaier, 1983, “Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. CHMT-6, No.3, pp.52-57.
15.John H. Lau, C. W. Seetoh and Z. P. Wang, 2000, “CBGA Solder Joint Reliability Evaluation Base on Elastic-Plastic-Creep Analysis”, Transactions of the ASME, Journal of Electronic Packaging, vol. 122, pp. 255-261.
16.H. C. Cheng, K. N. Chiang and M. H. Lee, 1998 , “An Effective Approach for Three Dimensional Finite Element Analysis of Ball Grid Array Typed Packages”, Transactions of the ASME, Journal of Electronic Packaging, June, Vol. 120, pp. 129-134.
17.黃肇達, 1999, “晶片尺寸構裝組裝後可靠度評估”, 電腦與通訊, 第80期,pp.37-43.
18.徐仕明. 1999, “以有限元素法結合田口氏品質工程研究BGA構裝在功率循環作用下之可靠度分析”, 國立成功大學工程科學系碩士論文.
19.林勇志, 2000, “CSP封裝產品在循環熱應力作用下之可靠度分析”, 國立成功大學機械工程學系碩士論文.
20.吳迎龍, 2002, “晶片堆疊效應對球柵陣列構裝錫球熱疲勞壽命影響之分析”, 中華大學機械與航太工程研究所碩士論文.
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