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研究生:許敬恭
論文名稱:數位廣播電波間隙補強器整合設計與研究
論文名稱(外文):Design and Analysis for DAB Gap-Filler Integrated System
指導教授:林漢年林漢年引用關係
學位類別:碩士
校院名稱:大葉大學
系所名稱:電信工程學系碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:115
中文關鍵詞:數位廣播電波間隙補強器低雜訊放大器驅動放大器功率放大器射頻電路表面黏著元件
外文關鍵詞:Digital Audio Broadcasting (DAB)Gap-FillerLow Noise Amplifier (LNA)Driver Amplifier (DA)Power Amplifier (PA)Radio Frequency Circuit (RF Circuit)Surface Mounted Device (SMD)
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本研究主要針對數位廣播(DAB)傳輸訊號在建築物造成電波死角所需改善問題,去設計訊號傳輸中繼器,即所謂電波間隙補強器(Gap-Filler)。此中繼器除了可提供在大樓之間改善電波死角的功能外,也可作為訊號強度的中繼補強。
本文針對數位廣播的BandⅢ(170∼240MHz)頻段下設計電波間隙補強器,吾人將電波間隙補強器分為低雜訊放大器、驅動放大器與功率放大器三部份來設計,最後將其串接起來並選擇適當的功率發射元件及其所需的接收和發射天線來搭配使用。文中設計的低雜訊放大器與驅動放大器所使用的主動元件為飛利浦(Philips)公司生產的BFG425W,功率放大器使用BFG21W,搭配射頻電路設計軟體(Microwave Office 2000)並依據射頻電路(RF Circuit)的相關觀念下去做所需的阻抗匹配,此頻段作阻抗匹配時大量採用表面黏著元件(SMD)的集總元件(Lump Element),並將全部電路製作於FR4印刷電路板上,最後將整體的電路利用網路分析儀,量測其整體的S參數。

This thesis is aimed at designing a DAB signal repeater, which is also known as gap-filler, for solving the problem of the dead zone of electromagnetic wave caused by buildings structures. In addition to improving DAB signal coverage, this gap-filler also can relay and supply the signals which are shielded by the buildings structures.
A gap-filler for digital radio (DAB) frequency range between 170MHz and 240MHz is being designed. The gap filler circuit is divided into three components, low noise amplifier (LNA), driver amplifier (DA) and power amplifier (PA). Finally, these three individual circuit components are integrated to form a gap-filler system with appropriate transmitting power. External receiving antenna and transmitting antenna are chosen to match with the amplifier system. The active device used in the low noise amplifier and driver amplifier are respectively BFG25W and BFG21W manufactured by Philips Company. For designing the amplifier, Microwave Office 2000 is being utilized to analyze and simulate the circuit and then make the impedance matching according to the theory of RF circuit. During this study, a large number of surface mounted devices of lump elements is being used for making the impedance matching for the frequency range. All circuit made in the printed circuit board and measured its S parameter by the network analyzer.

封面內頁
簽名頁
授權書.........................iii
中文摘要........................iv
英文摘要........................v
誌謝..........................vi
目錄..........................vii
圖目錄.........................x
表目錄.........................xvi
第一章 緒論
1.1 前言........................1
1.2 研究動機及方法...................3
1.3 論文架構......................4
第二章 射頻電路基礎理論
2.1散射參數( Scattering Parameters )..........6
2.2反射係數與功率增益方程式..............8
2.2.1 反射係數....................8
2.2.2 功率增益方程式.................10
2.3穩定性..................13
2.4射頻電路雜訊...............18
2.5 1dB增益壓縮點與效率...........22
2.5.1 1dB增益壓縮點............22
2.5.2 效率.................23
2.6 失真..................24
2.6.1 互調失真...............25
2.6.2 三階護調失真.............28
第三章 功率放大器設計概論
3.1功率放大器的種類..............30
3.1.1 A類功率放大器............30
3.1.2 B類功率放大器............32
3.1.3 AB類功率放大器...........35
3.1.4 C類功率放大器............36
3.1.5 D、E、F類功率放大器.........38
3.2 直流偏壓網路................38
3.3 最佳負載求取方法..............40
3.3.1 負載調整法..............41
3.3.2 軟體模擬法..............43
3.4 阻抗匹配網路................45
第四章 電波間隙補強器模擬與製作
4.1 低雜訊放大器( Low Noise Amplifier ) ....48
4.2 驅動放大器( Driver Amplifier ) .......57
4.2.1 一級驅動放大器............58
4.2.2 二級驅動放大器............66
4.3 功率放大器( Power Amplifier ) .......74
4.3.1 主動直流偏壓功率放大器設計......75
4.3.2 改良主動直流偏壓功率放大器設計....85
4.4 電波間隙補強器實測.............91
第五章 結論......................96
參考文獻........................98
附錄A.........................102
附錄B.........................110
附錄C.........................114

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