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研究生:李明洲
研究生(外文):Ming-Chou Lee
論文名稱:射頻系統封裝模組暨縮小化雙頻印刷天線設計
論文名稱(外文):Design of RF System on Package (SOP) and Miniaturized Dual-Band Printed Antenna
指導教授:鍾世忠鍾世忠引用關係
指導教授(外文):Shyh-Jong Chung
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電信工程系所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:103
中文關鍵詞:低溫共燒陶瓷射頻前端模組系統封裝模組雙頻縮小化倒F型天線
外文關鍵詞:LTCCFront End ModuleSystem on PackageDual-BandMiniaturizeInverted F antenna
相關次數:
  • 被引用被引用:1
  • 點閱點閱:307
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  • 下載下載:2
  • 收藏至我的研究室書目清單書目收藏:0
本篇論文前段提出三個應用於802.11b之射頻前端模組,模組一之接放和發射路徑均包含了一個天線分集開關(diversity switch)、一個收發切換開關(T/R switch)及一個帶通濾波器,模組二則是在發射路徑將帶通濾波器改為低通瀘波器,以減少發射路徑整體的輸入損耗,模組三則是將模組一的結構在發射端再加上一個功率放大器。此三個模組均利用低溫共燒陶瓷(LTCC)為載板,將功率放大器、天線分集開關(diversity switch)及放發切換開關(T/R switch)放罝於載板之上,濾波器和電路匹配所需之電容和電感則設計於載板之內。後段則是提出兩種不同架構的倒F天線,首先是利用螺旋繞線的方式,再者是將耦合線當作天線的饋入,兩者皆可縮小天線尺寸並產生雙頻,且螺旋繞線之結構在印刷電路板及低溫共燒陶瓷上均獲得驗證。實作的結果也顯示了此兩種結構可以輕易設計在所需要的頻段,比起傳統的印刷倒F型天線也可以縮小約70%及47%,且場型也具有全向性場型的特性。
In front of this thesis, three RF front end-module (FEM) based on LTCC (low temperature co-fire ceramics) under 802.11b specification is designed. The first FEM contains a diversity switch, a T/R switch and a band-pass filter in both receive and transmit path. The second FEM changes the band-pass filter in the first FEM into low-pass filter in transmit path to improve the total insertion loss. The third FEM includes a power amplifier than the first FEM. They put power amplifier, diversity switch and T/R switch on the top layer of LTCC substrate and band-pass filter, capacitors and inductors of the matching circuit in it. The second part of this thesis, two different inverted F antenna structure are proposed. The first antenna uses spiral line, and the second utilizes couple line as its feed. They are both with miniaturized size, operated in dual frequencies, and implemented by printed circuit board and LTCC. The measured results also reveal that they which have less size than the conventional inverted F antenna and omni-directional pattern can easily operated in the designed frequency.
中文摘要……………………………………………………………………………….....I
英文摘要…………………………………………………………………………………II
誌謝………………………………………………………………………………...........III
目錄………………………………………………………………………….……..........IV
圖片目錄………………………………………………………………………………...VI
表索引……………………………………………………………………………………X
第一章 導論 1
第二章 射頻系統封裝模組各元件設計 3
2.1 前言 3
2.2低通濾波器設計 4
2.2.1低通濾波器設計原理 5
2.2.2 低溫共燒陶瓷低通濾波器設計 5
2.2.3模擬與量測 6
2.3交錯耦合型帶通濾波器設計 7
2.3.1交錯耦合型帶通濾波器原理 7
2.3.2三階交錯耦合型帶通濾波器設計 9
2.3.3模擬與量測 10
2.4功率放大器與切換開關驗證 11
2.4.1 功率放大器驗證 11
2.4.2 切換開關驗證 12
第三章 射頻系統封裝模組設計 29
3.1前言 29
3.2 模組一設計 29
3.1.1表面走線與內部佈線設計 29
3.1.2模擬與實作 30
3.3模組二設計 31
3.3.1表面走線和內部佈線設計 31
3.2.2模擬與實作 31
3.4 模組三設計 32
3.4.1表面走線與內部佈線設計 32
3.4.2模擬與實作 33
第四章 雙頻縮小化印刷倒F型天線 51
4.1倒F型天線理論 51
4.1.1偶極天線 51
4.1.2鏡像原理 52
4.1.3單極天線 53
4.1.4倒F型天線 54
4.2縮小化雙頻天線設計 55
4.3利用FR4多層板實作、量測與討論 56
4.4利用LTCC實作與量測 57
第五章 縮小化雙頻印刷M型天線 79
5.1 設計原理 79
5.2利用FR4進行實作 80
第六章 結論 87
參考文獻 89
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