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研究生:張維娜
研究生(外文):Wei-Na Chang
論文名稱:BGA基板視覺檢測
論文名稱(外文):Visual Inspection of Ball Grid Array Substrates
指導教授:林錫寬
指導教授(外文):Shir-Kuan Lin
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電機與控制工程系所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:53
中文關鍵詞:視覺檢測瑕疵檢測樣板比對法影像平移
外文關鍵詞:BGAvisual inspectiontemplate-matching techniques
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在過去,傳統檢測是以人眼來檢查產品是否有瑕疵,但費時、不可靠且昂貴。 提供高速度、高品質和低成本的視覺檢測系統,在今天的工業界已經廣泛地被採用。 在論文中,我們提出一個視覺檢查方法來檢查BGA基板的表面瑕疵,其檢查方法如下:

首先, 我們需要選擇無缺陷影像並用它來做樣板影像。然後,我們將樣板影像切割成Bond finger區和Power/Ground ring兩區。把每一個Bond finger都分成三個檢測區:重要檢測區,次要檢測區,和短路檢測區。並儲存從樣板影像提取的重要參數。在樣板影像建立好以後,輸入待測影像並以樣板影像來做影像校正。在檢查過程中,把這個待測影像和樣板影像比對後,決定待測影像中物件是否有缺陷。最後實驗的結果表示我們的方法能檢查出在BGA基板檢測標準中定義的所有缺陷。
In the early days, traditional inspection was done by using eyes of human operators, and therefore time consuming ,unreliable and expensive.Visual inspection system provides high speed, high quality and low labor cost, and has been widely adopted in today's industry. In the thesis, we propose a visual inspection method to inspect the surface of BGA substrates. The inspection method we developed is described as follows.

First of all, we need to select a defect free image and use it to define a template image. Then we segment the template image into the bond finger regions and the power/ground ring region. Each single bond finger is divided into three regions : the major inspection region , the minor inspection region, and the short circuit inspection region. The parameters extracted from the template image are stored. After the template image builded, the inspected image is captured, and aligned with the template image. In the inspection process, the inspected image is inspected and compared to the template image to determine whether the object in the inspected image is defective or not. The outcome of the final experiment showed that our method could detect all defects defined in the BGA substrate criteria.
目錄
中文摘要 ii
英文摘要 ii
目錄 ii
圖例目錄 v
第一章緒論 1
1.1前言.....................1
1.2研究背景與動機.....................1
1.3研究方法簡介.....................2
1.4論文架構.....................2
第二章影像前處理方法
2.1前言.....................3
2.2影像切割方法.....................3
2.2.1灰階長條圖影像切割.....................4
2.2.2彩色空間影像切割.....................7

第三章檢測樣版的建立 9
3.1 前言.....................9
3.2 BGA基板檢測的標準.....................10
3.3 檢測區域的分割.....................13
3.3.1邊界描述演算法(Boundary Tracing Algorithm).........13
3.4 Bond finger中檢測區塊的分割 ................. 16
3.4.1建立 Bond finger重要檢測區.................20
3.4.2建立 Bond finger短路檢測區.................23
第四章影像校正 25
4.1 旋轉校正.....................25
4. 1.1霍夫轉換(Hough Transform).................25
4. 1.2座標轉換.....................29
4.1.3色彩內插法.....................30
4.2 平移校正.....................35
4.2.1區塊匹配演算法(Block Matching Algorithm)..........35
4.2.2快速三步搜尋演算法(Fast Three Step Search Algorithm,FTSS). . 36
第五章瑕疵檢測 42
5.1短路檢測.....................43
5.2表面瑕疵檢測.....................45 5.2.1檢測遮單的建立.....................46
5.2.2表面瑕疵的判定.....................48
5.3實驗結果.....................49



第六章結論、建議與未來展望 52
6.1前言.....................52
6.2具體成果.....................52
6.3建議與未來展望.....................53
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