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研究生:梁家倫
研究生(外文):Chia-Lun Liang
論文名稱:微鏡面元件致動面之殘留應力的量測
論文名稱(外文):Residual Stress Measurement of Actuating Plane in Micromirror
指導教授:黃豐元黃豐元引用關係
指導教授(外文):Fuang-Yuan Huang
學位類別:碩士
校院名稱:國立中央大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:74
中文關鍵詞:殘留應力微鏡面微機電
外文關鍵詞:MEMSMicromirrorXRDResidual Stress
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摘 要
在微鏡面元件致動面之殘留應力的量測研究中,為了使沉積材料達到堅韌之特性,故選擇以摻雜氮的鋁薄膜來作為微鏡面致動器之鉸鍊材料。在製程方面,以反應式濺鍍法來沉積、製作支撐柱及鉸鍊材料,藉此來改善選擇性鎢沉積後,薄膜會被氫氟酸所蝕刻的問題,並藉由調整沉積時之功率和氮氣流量的比例,來探討不同氮含量的氮化鋁(AlN)薄膜其材料性質之變化,包括薄膜所產生之熱應力、片電阻值及剛性等。
此外,為瞭解AlN薄膜之組成成分、晶格間距,以X光粉末繞射分析儀來分析試片薄膜的相結構,藉由元件在釋放犧牲層前、後所測得之晶格間距,推算出薄膜所產生之殘留應力值,探討其製程參數所造成之影響。以氮氣流量20%的薄膜沉積參數來作為殘留應力量測的結果中,以1000W的電漿功率下可產生一張應力,可供元件具彎曲後回復之力,以此作為製程之依據。
Abstract
In this study, in order to make the material reaching qualities of strength and toughness, so select aluminum nitride to do the hinge of micromirror actuator. In fabrication produce, to deposition and manufacture the contact holes and hinges by reactive sputtering deposition. By this way can improve the problem of membranes etched by hydrofluoric acid after selectivity tungsten deposition. To adjust deposition power and nitrogen flow rate also can confer the change in characters of aluminum nitride membranes for different nitrogen flow rate, including the thermal stresses, sheet resistances, and hardness that cased by membrane.
Furthermore, in order to understand the compose components, and lattice space in aluminum nitride membranes, used the X-ray powder diffractometer to analyze the phase structure in membranes. Employing the lattice space that measured in front and behind of sacrifical layer released, could calculate the residual stress value that cased from membrane, investigating the influences to fabrication process. And we could get that a twenty percent nitrogen flow and 1500 watts plasma power would cause a tensile force in actuating plane material.
目 錄
摘要……………………………………………………………………Ⅰ
目錄……………………………………………………………………Ⅱ
表目錄…………………………………………………………………Ⅳ
圖目錄…………………………………………………………………Ⅴ
第一章 緒論………………………………………………………1
1.1 前言………………………………………………………1
1.2 數位微鏡面元件(DMD)……………………………… 3
1.3 研究動機與目的…………………………………………7
第二章 實驗儀器設備與原理……………………………………9
2.1 實驗儀器簡介……………………………………………9
2.2 反應式濺鍍法原理簡介…………………………………17
2.3 奈米壓痕量測系統基本架構……………………………20
2.4 X光繞射原理…………………………………………… 23
2.4.1 X光繞射基本原理……………………………… 23
2.4.2 X光繞射法於殘留應力檢測之理論…………… 25
第三章 微鏡面懸浮結構製作與實驗方法………………………28
3.1 微鏡面懸浮結構製作……………………………………28
3.1.1 元件製作流程……………………………………30
3.1.2 製程參數設定……………………………………35
3.2 金屬薄膜材料分析參數之訂定…………………………40
3.3 微鏡面元件機械性質分析………………………………42
3.4 XRD懸浮鏡面材料結構分析…………………………… 44
第四章 實驗結果與討論…………………………………………46
4.1 多晶矽摻雜之電阻率結果分析…………………………46
4.2 影響微鏡面元件製作之因素與結果……………………48
4.2.1 元件製作結果……………………………………48
4.2.2 犧牲層去除之蝕刻液選擇………………………49
4.2.3 支撐柱蝕刻率測試………………………………52
4.3 金屬薄膜材料分析結果…………………………………55
4.4 XRD殘留應力分析結果………………………………… 60
第五章 結論………………………………………………………69
參考文獻………………………………………………………………71
參 考 文 獻
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