跳到主要內容

臺灣博碩士論文加值系統

(34.226.244.254) 您好!臺灣時間:2021/08/01 04:55
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

: 
twitterline
研究生:黃青峰
研究生(外文):Ching-feng Huang
論文名稱:微渠道之微加熱器及溫度感測器設計製作
論文名稱(外文):Fabrications of Micro Heaters and Micro Sensors
指導教授:謝曉星
指導教授(外文):Shou-shing Hsieh
學位類別:碩士
校院名稱:國立中山大學
系所名稱:機械與機電工程學系研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
畢業學年度:92
語文別:中文
論文頁數:62
中文關鍵詞:微渠道微加熱器微溫渡感測器
外文關鍵詞:micro-heatermicro-sensormicro-channel
相關次數:
  • 被引用被引用:0
  • 點閱點閱:331
  • 評分評分:
  • 下載下載:82
  • 收藏至我的研究室書目清單書目收藏:0
利用微機電製程技術,設計製作微加熱器及微溫度感測器於微渠道上,用以量測微渠道之熱場變化。微渠道製作係以LIGA-like製程技術中的準分子微影製程於高分子材料聚甲基丙烯酸甲酯(PMMA)上,光刻出長20 mm、寬200μm、深為100μm之微渠道。微加熱器、微溫度感測器則是採用「白金薄膜」做為之材料,透過物理薄膜沉積(PVD)之製程,將元件製作於玻璃晶片上。最後以光阻膠將兩者進行裝封,並進行測試。

實驗結果發現,以微加熱器及微溫度感測器之形狀,採用lift-off製程技術,效果不佳,易造成金屬線旁破裂;而改溼式蝕刻,則無此現象。初步測試微溫度感測器,其電阻值與溫度關係成一線性正比關係,可實際運用於未來微渠道熱場量測。
Micro-channels are very important in bio-medical and cooler research. Although many research have been conducted with micro-channels, few results have been contributed to discuss the properties of fluids inside a micro-channel. For example, the thermal distribution of the fluid in a micro-channel is only simulated with numerical analysis approach. In our research, we aim to design a device that can measure real thermal data within a micro-channel. We first applied excimer laser lithography on a PMMA substrate to fabricate a micro-channel with 20 mm length, 200μm width and 200μm depth. Micro-heater and micro-thermal sensor is than fabricated by sputtering pt thin-thim with PVD process on a glass substrate. Finally, these devices were assembled with UV-curing and than applied for further testing.
According to our experiment, lift-off process cannot be easily applied to fabricate micro-heater and micro-thermal sensor since the architecture of these devices were fragile in metal line sidewalls. Wet-lithography is than used to conquer this problem. Our primary test on this micro-thermal sensor shows that its resistance varies with thermal changes. Such mechanism can be applied to measuring thermal field in a micro-channel.
總目錄 i
圖目錄 iii
表目錄 v
中文摘要 vi
英文摘要 ……………vii

第一章 緒論 1
1-1 前言 1
1-2 背景與目的 2
1-3 文獻回顧 3

第二章 理論基礎及元件設計 5
2-1 微溫度感測器及微加熱器之基礎原理 5
2-1-1 溫度感測原理 6
2-1-2 微加熱原理 10
2-2 元件設計 11
2-2-1 微溫度感測元件設計 11
2-2-2 微加熱器元件設計 13
2-2-3 微渠道之設計 14

第三章 實驗設備 19
3-1 實驗材料 19
3-2 製程設備 21
3-2-1 黃光微影製程設備 21
3-2-2 化學製程設備 21

第四章 元件製程規劃 27
4-1 微渠道製作流程 27
4-2 微加熱器及微溫度感測器之製作流程 30
4-3 封裝製程 33

第五章 實驗結果與討論 34
5-1 製程問題及決解方法 34
5-1-1 lift-off製程問題 34
5-1-2 微加熱器問題 38
5-1-3 平坦化問題 38
5-2 實驗結果與元件測試 40
5-2-1 實驗結果 40
5-2-2 元件測試 42

第六章 結論與建議 44
6-1 結論 44
6-2 建議與改進 45

參考文獻 47



圖 目 錄
頁次
圖2.1 一般溫度感測器之分類 5
圖2.2 熱電堆溫度感測器之構造圖 7
圖2.3 電流型感測電壓降之電路圖 8
圖2.4 薄膜形成的分類 11
圖2.5 微溫度感測器之設計圖 12
圖2.6 微加熱元件之設計圖 14
圖2.7 微渠道之完成示意圖 15
圖2.8 微加熱器及微溫度感測器位置配置圖 16
圖2.9 第一道光罩設計圖 17
圖2.10 第二道光罩設計圖 18
圖3.1 光阻旋塗機 21
圖3.2 曝光機 22
圖3.3 超音波振盪器 23
圖3.4 高真空濺鍍機 24
圖3.5 金屬蒸鍍機 25
圖4.1 微渠道製作流程圖 29
圖4.2 微加熱器及微溫度感測器之製作流程圖 32
圖5.1 lift-off製程元件圖:(a) 微加熱器;(b) 微溫度感測器 36
圖5.2 溼蝕刻製程元件圖:(a) 微加熱器;(b) 微溫度感測器 37
圖5.3 平坦化製程示意圖 39
圖5.4 微加熱器及微溫度感測器成品圖 40
圖5.5 感測元件與接線位置圖 41
圖5.6 微溫度感測器之電阻值與溫度關係圖 43
表 目 錄
頁次
表3-1 PMMA之性質表 20
表4-1 光阻參數表 31
表4-2 濺鍍參數表 31
參考文獻
1.D. B. Tuckerman and R. F. W. Pease,“High-performance heat sinking for VLSI”, IEEE Electron Device Letters, Vol.Edl-2, No.5,126-129,1981。
2.J. C. Angus et al.,“Controlled electroplating through gelatin films”, J. Electrochem. Soc., 133(6), pp.1152-1160,1986。
3.A. Augousti, K. Grattan, A. Palmer,“A laser-pumped temperature sensor using the fluorescent decay time of alexandrite”, Lightwave Technology, Vol.5, pp.759-762, 1987。
4.J. Harley and H. Bau,“Fluid flow in micron and submicron size channels”, IEEE Tran.25-28,1989。
5.J. M. Ho, M. T. Shiu,“Optical fiber temperature sensor based on phase shift by aluminum thermal expansion”, TENCON ''93. Proceedings. Computer, Communication, pp.500-504, 1993。
6.X. Bao, D. J. Webb, D. A. Jackson, “Temperature non-uniformity in distributed temperature sensors”, Electronics Letters, Vol.29, pp.976-978, 1993。
7.T. R. Jervis,“Excimer laser surface processing of materials”, Lasers and Electro-Optics Society Annual Meeting, pp.772-773, 1993。
8.R. B. Tait, R. Humphries, J. Lorenz, “Thick film heater elements and temperature sensors in modern domestic appliances”, Industry Applications, Vol.30, pp.573-577, 1994。
9.Y. P. Kathuria, A. Tsuboi,“Excimer laser process technology for micromachining”, Micro Machine and Human Science, pp.153, Oct. 1994。
10.X. F. Peng, G. P. Peterson and B. X. Wang,“Frictional flow characteristics of water flowing through rectangular Microchannels”, Experimental Heat Transfer.249-264,1944。
11.J. R. Datta,“Heater integrated sensor system”, IEEE International Symposium. Vol.2 pp.849-854, 1995。
12.M. Malovic, D. Stankovic, M. Zlatanovic,“Dynamic characteristics of silicon resistance temperature sensors”, Microelectronics, Vol.2, pp.593-596, 1995。
13.E. C. Harvey,“New developments in excimer laser micromachining by image projection”, Microengineering Applications in Optoelectronics, 1996。
14.X. F. Peng, and G. P. Peterson,“Convective heat yransfer and flow friction for water flow in microchannel structure”, Int’l J. of Heat and Mass Transfer, Vol. 39, pp.2599-2608, 1996。
15.G. S. Yang, D. M. Aslam, “Single-structure heater and temperature sensor using a p-type polycrystalline diamond resistor”, IEEE. Vol.17, pp.250-252, 1996。
16.M. Kampik, T. Skubis, M. Klonz, “Experimental thermal converter with quartz crystal temperature sensor”, Precision Electromagnetic Measurements Digest, pp.592-593, 1996。
17.S. Mori, T. Morisawa, N. Matsuzawa, “Multi-generation device fabrication by ArF lithography”, Electron Devices Meeting, pp.933-935, 1997。
18.J. Brannon, “Excimer laser ablation and etching”, Circuits and Devices Magazine, IEEE, Vol.13, pp.11-18, 1997。
19.S. Wu, J. Mai, Y. Zohar, Y. C. Tai, and C. M. Ho,“A suspended microchannel with integrated temperature sensor for high-pressure flow studies”,IEEE Trans.87-92,1998。
20.W. A. Clayton,“Thin-film platinum for appliance temperature control”, IEEE Transactions on Industry Applications. Vol.24 No.2 March/April, 1988。
21.H. Okuno, T. Tominaka, S. Fujishima, T. Mitsumoto, “Thermal induced stress on the membrane in integrated gas sensor with micro-heater”, IEEE Vol.1, pp.1075-1077, 1998。
22.G. L. Solbrekken, C. P. Chiu, “Single temperature calibration method for die level temperature sensors”, Thermal and Thermomechanical Phenomena in Electronic Systems, pp.88-95, 1998。
23.C. Stanescu,“A new architecture for low voltage temperature sensors”, Semiconductor Conference, Vol.1, pp.171-174, 1998。
24.Z. Bendekovic, P. Biljanovic, D. Grgec, “Polysilicon temperature sensor”, Electrotechnical Conference, Vol.1, pp.362-366, 1998。
25.L. Jiang, M. Wong, Y. Zohar,“A micro-channel heat sink with integrated temperature sensors for phase transition study”, IEEE.159-164,1999。
26.J. S. Han, T. Kadowaki, K. Sato, M. Shikida,“Thermal analysis of fingerprint sensor having a microheater array”, IEEE. pp.199-205,1999。
27.L. Jiang, M. Wong, Y. Zohar,“Phase change in microchannel heat sink with integrated temperature sensors”, Journal of Microelectromechanical system. Vol.8 No.4 358-365, 1999。
28.T. Berden, M. Sommer,“Excimer laser machining of a polymer multilayer for optoelectronics”, Lasers and Electro-Optics Society, IEEE, Vol.2, pp.691-692, 1999。
29.Y. P. Kathuria,“Excimer laser processing in nano-technology”, Micromechatronics and Human Science, pp.169-172, 1999。
30.M. Baroncini, P. Placidi, G. C. Cardinali, L. Dori and S. Nicoletti, “Characterization of an embedded micro-heater for gas sensors applications”,IEEE. pp.164-167, 2001。
31.M. Baroncini, P. Placidi, A. Scorzoni, G. C. Cardinali, L. Dori, S. Nicoletti, “Characterization of an embedded micro-heater for gas sensors applications”, VLSI Technology, Systems, and Applications, pp.164-167, 2001。
32.L. Jiang, M. Wong, Y. Zohar,“Forced convection boiling in a microchannel heat sink”, IEEE. pp.80-87, 2001。
33.G. Betta, A. Pietrosanto, A. Scaglione, “An enhanced fiber-optic temperature sensor system for power transformer monitoring”, Instrumentation and Measurement, IEEE, Vol.50, pp.1138-1143, 2001。
34.C. H. Liao, M. C. Wang, A. Shih, S. C. Lee,“Excimer laser annealing process for polysilicon TFT on glass and plastic substrates”, Lasers and Electro-Optics, Vol.2, pp. II-292 - II-293, 2001。
35.J. D. Sternhagen, C. E. Wold et al.,“A novel integrated acoustic gas and temperature sensor”, IEEE Vol.2, pp.301-306, 2002。
36.T. Nenov, Z. Nenova,“Multifunctional temperature sensor”, Microelectronics, pp.257-260, 2002。
37.I. M. Filanovsky, S. T. Lim,“Temperature sensor applications of diode-connected MOS transistors”, Circuits and Systems, IEEE, Vol.2, 2002。
38.M. A. P. Pertijs, G. C. M. Meijer, J. H. Huijsing, “Non-idealities of temperature sensors using substrate pnp transistors”, IEEE, Vol.2, pp.1018-1023, 2002。
39.P. C. Peng, H. Y. Teng, S. Chi,“Accurate temperature sensor system based on linear-cavity fiber laser array”, IEEE, Vol.1, pp.183-186, 2002。
40.J. A. Covington, F. Udrea, J. W. Gardner, “Resistive gas sensor with integrated MOSFET micro hot-plate based on an analogue SOI CMOS process”, Proceedings of IEEE , Vol.2, pp.1389-1394, 2002。
41.M. Datta, M. Dagenais,“High coupling efficiency actively aligned laser modules using micro-heaters and pre-compensastion”, Electronic Components and Technology Conference, pp.1312-1317, 2003。
42.J. Jiang, C. L. Callender,“All-polymer photonic devices using excimer laser micromachining”, Photonics Technology Letters, Vol.16, pp.509-511, 2004。
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top