1. “Intel Pentum 4 Processor Datasheet,”from
http://processorfinder.intel.com/scripts/list.asp?ProcFam=483
2. S. Narasimhan and J. Majdalani,“Characterization of Computer Heat Sink Models in Natural Convection,”IEEE Trans. on Comp., Packag. Tech., Vol. 25, No. 1, pp. 78-86, Sep. 2002.
3. Y. Kondo, H. Matsushima, and T. Komatsu,“Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Package,”ASME Journal of Electronic Packag.,Vol. 122,pp. 240-246,Sep. 2000.
4. H. A. El-Sheikh and S. V. Garimella,“Enhancement of Air Jet Impingement Heat Transfer Using Pin-Fin Heat Sink,” IEEE Trans. on Comp., Packag. Tech., Vol. 23, No. 2, pp. 300-308, Sep. 2000.
5. H. A. El-Sheikh and S. V. Garimella,“Heat Transfer form Pin-Fin Heat Sinks under Multiple Impingement Jets,” IEEE Trans. on Comp., Packag. Tech., Vol. 23, No. 1, pp. 113-120, Sep. 2000.
6. L. B. Y. Aldabbagh and I. Sezai,“Numerical Simulation of Three-dimensional Laminar Multiple Impingement Square Jets,”Int. J. Heat and Fluid Flow, Vol. 23,pp. 509-518, Sep. 2002.
7. L. A. Brignoi and S. V. Garimella, “Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement,”ASME. Electronic Packaging, Vol. 122, pp. 282-285,Sep. 2000.
8. J. R. Guarino and V. P. Manno“Characterization of Laminar Jet Impingement Cooling in Portable Computer Applications,” IEEE Trans. on Comp., Packag. Tech., Vol. 25, No. 3, pp. 337-346, Sep. 2002.
9. H. C. Ryu, D. Kim, and S. J. Kim,“Experimental Analysis Of Shrouded Pin Fin Heat Sinks For Electronic Equipment Cooling,”in Proc. IEEE Inter soc. Conf. Thermal Phenom.,Sep. 2002.
10. A. Horvat and I. Catton,“Numerical Technique for Modeling Conjugate Heat Transfer in an Electronic Device Heat Sink,”Int. J. Heat and Mass Tran.,Vol. 46,pp. 2155-2168,Sep. 2003.
11. 黃宏利,“數值探討熱沉散熱器之設計,”國立台灣海洋大學機械與輪機工程學系碩士學位論文,Sep 2001.
12. Z. Zhao and C. T. Avedisian,“Enhancing Forced Air Convection Heat Transfer from an Array of Parallel Plate Fins Using a Heat Pipe,”Int. J. Heat Mass Tran.,Vol. 40,No. 13,pp. 3135-3147,Sep. 1997.
13. K. S. Kim, M. H. Woo, J. W. Kim, and B. J. Back,“Heat Pipe Cooling Technology for Desktop PC CPU,”Applied Thermal Engineering, Vol. 23,pp. 1137-1144,Sep. 2003.
14. 羅玉山、周永泰、林顯群、周建安,“小型電腦軸流風扇之遮蔽效應,” 機械工程研討會論文集, Nov. 2003.
15. N. Khan, Pinjala, M. K. Iyer, T. K. Chuan, and J. Weixin,“Thermal Enhancement of Desk Top Computer by Chassis Design Optimization,”IEEE Electronics Packaging Tech. Conf.,Sep. 2000.
16. J. Y. Chang, C. W. Yu, and R. L. Webb,“Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling,”Inter Society Conference on Thermal Phenomena,Sep. 2000.
17. C. W. Yu and R. L. Webb, “Thermal Design of a Desktop Computer
System Using CFD Analysis,” 17th IEEE SEMI-THERM Symposium, Sep. 2001.
18. MAYA Heat Transfer Technologies Ltd., ”I-DEAS ESC Reference
Manual,” ESC ref9w,Sep. 2001.
19. ” ESC Flow Solver and Modeling Theory,” from
http://www.mayasim.com/expertise/papers/
20. G. E. Schneider and M. J. Raw, “Control-Volume Finite Element
Method For Heat Transfer and Fluid Flow Using Co-located Variables-1. Computational Procedure,” Numerical Heat Transfer, Vol. 11, pp. 363-390,Sep. 1987.
21. M. E. Tomas, N. R. Shimp, M. J. Raw, P. F. Galpin and G. D. Raithby,
“The Development of an Efficient Turbomachinery CFD Analsis Procedure,” AIAA/ASME/SAE/ASEE 25th Joint Propulsion Conference, Monterey, CA, July 10-12, Sep. 1989.
22. C. M. Rhie and W. L. Chow,”A Numerical Study of the Turbulent Flow
Past an Isolated Airfoil with Trailing Edge Separation,” AIAA paper 82-0998,Sep. 1982.
23. A. F. Mills, Heat Transfer, ed., New Jersey:Prentice Hall, 1999 , pp.86-92
24. A. D. Kraus, A. Aziz, and J. Welty, Extended Surface Heat Transfer, New York:Wiley,2001.
25. 黃為棟,“採空氣衝擊冷卻柱狀鰭片熱沉之個人電腦熱傳分析,”國立台灣海洋大學機械與輪機工程學系碩士學位論文,Sep. 2003.26. 林修宇,“高階個人電腦熱流場數值研究,”國立台灣海洋大學機械與輪機工程學系碩