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研究生:李梓瑋
論文名稱:外凸角隅濕蝕刻行為之研究
指導教授:張家歐張簡文添
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:應用力學研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:95
中文關鍵詞:底切面米勒指標
相關次數:
  • 被引用被引用:1
  • 點閱點閱:206
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
本文探討單晶體矽的外凸角隅經過濕濕蝕刻後的底切行為,但由於前人所研究的結果有相當多互相矛盾且沒有說明決定底切面米勒指標的方法,而本文提出一套決定底切面米勒指標的方法。本文假設經過蝕刻後角隅底切面為同軸,基於這個假設利用立體投影圖、沃夫座標圖和由光學顯微鏡所量出的夾角去決定底切面的米勒指標,使用掃瞄式電子顯微鏡去驗證底切面是否為同軸,使用表面輪廓儀量測底切面與底面的夾角並與理論值做比較,使用向量方法求出夾角並與實驗值做比較。實驗結果與驗證發現我們所建立的方法是正確的,而且在相同的實驗條件下實驗結果與Beam[13]所定義的米勒指標相同,與 [21]所拍攝的SEM圖相同,更可支持本文的假設與建立決定底切面米勒指標的方法是正確的。利用本文所建立的方法找出正確的底切面,進而量測底切面蝕刻速率,即可設計出適合的蝕刻補償結構。
摘要..... I
目錄..... Ⅱ
圖目錄... IV
第一章 導論...... 1
1-1 論文回顧..... 1
1-2 研究動機..... 7
1-3 論文架構..... 10
第二章 理論...... 11
2-1 基本的蝕刻機制........ 11
2-2 如何決定蝕刻後的新生晶格面..... 13
2-3 如何利用立體投影圖與沃夫座標圖決定未知晶格面的米勒指標....... 17
2-4 利用向量方法驗證所求出米勒指標的正確性........... 21
2-5 分析 ...........24
第三章 實驗方法、分析與結果........ 31
3-1 製程規劃..... 31
3-2 製程步驟..... 33
3-3 實驗結果與分析........ 37
3-3-1 以KOH為蝕刻液蝕刻Si{100}………………………………38
3-3-2 以KOH加上過飽和IPA為蝕刻液蝕刻Si{100}……………49
3-3-3 以KOH為蝕刻液蝕刻Si{110}………………………………56
3-3-4 以KOH加上過飽和IPA為蝕刻液蝕刻Si{110}……………70
第四章 結論與未來展望..... 84
參考文獻 ..................86
附錄一 底切面是否為同軸的判斷方法........... 89
附錄二 如何利用光學顯微鏡量測底切面角度..... 94
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