以2,2’-bis(2-hexloxyphenoxy)-5,5’-diaminobiphenyl, 2,2’-bis(3-octadecyloxyphenoxy)-5,5’-diaminobiphenyl， 和2,2’-bis(2-octadecyloxyphenoxy)-5,5’-diaminobiphenyl三種二胺單體和數種芳香族二酸酐經溶液縮合聚合成含長烷基側鏈的聚醯亞胺，並研究此系列聚醯亞胺的固有黏度、溶解度與熱性質，
首先，以2,2’-bis(3-octadecyloxyphenoxy)-5,5’-diaminobiphenyl所合成的聚醯胺酸的固有黏度範圍在0.15~0.21dL/g之間，經由DMA發現他們玻璃轉移溫度在141~180℃之間。此外，在氮氣和空氣下的10%重量損失分別是405~427℃與338~425℃之間。其中由含間位長烷基側基之二胺單體4c所合成的聚醯亞胺〈10系列〉的溶解度比含鄰位長烷基側基之二胺單體3c所合成的聚醯亞胺〈8系列〉的溶解度較差。
以2,2’-bis(2-hexloxyphenoxy)-5,5’-diaminobiphenyl二胺單體與數種芳香族二酸酐製備的聚醯亞胺具有中到高的固有黏度，黏度範圍在0.73~1.26 dL/g之間，此系列的聚醯亞胺具有好的溶解度，可溶於NMP、DMAc、THF與cyclohexanone等溶劑中，且皆可經由溶液塗佈成具有韌性之薄膜。由DSC發現它們的玻璃轉移溫度範圍分別是139~174℃之間，並經由TGA分析，在氮氣及空氣下的10%重量損失溫度分別是370~417℃與413~423℃之間。
以2,2’-bis(2-octadecyloxyphenoxy)-5,5’-diaminobiphenyl二胺單體與數種芳香族二酸酐製備的聚醯亞胺，得到低的固有黏度，黏度範圍在0.10~0.16 dL/g之間，此系列的聚醯亞胺也具有好的溶解度，可溶於NMP、DMAc、THF與cyclohexanone等溶劑中。

A series of new polyimides, containing pendant long alkyl side chain groups were prepared via the solution condensation of aromatic diahydrides with 2,2’-bis(2-hexloxyphenoxy)-5,5’-diaminobiphenyl, 2,2’-bis(3-octadecyloxyphenoxy)-5,5’-diaminobiphenyl, and 2,2’-bis(2-octadecyloxyphenoxy)-5,5’-diaminobiphenyl. The inherent viscosities, solubility properties and thermal properties of the polyimides were investigated.
First, the poly(amic acid)s derived from 2,2’-bis(3-octadecyloxyphenoxy)-5,5’-diaminobiphenyl, had inherent of 0.15~0.21 dL/g. The DMA analysis reveals that the glass transition temperatures ranged from 141~180℃. In addition, the temperatures of 10% weight loss in nitrogen and the air ranged on 405~427℃ and 338~425℃, respectively. The polyimides 10 showed lower solubility as compared to the analogous polyimides 8.
Second, a series of polyimides were prepared by reaction of long alkyl-based diamines, 2,2’-bis(2-hexloxyphenoxy)-5,5’-diaminobiphenyl with various aromatic tetracarboxylic dianhydride. The polymer were prepared with moderate to high inherent viscosities (0.73~1.26 dL/g). The obtained polyimides were readily soluble in NMP, DMAc, THF, and cyclohexanone and gave flexible and tough films via solvent casting. These polyimides showed glass transition temperature in the range of 139~174℃ (by DSC) . Decomposition temperatures for 10% weight loss in nitrogen and the air ranged on 413~423℃ and 370~417℃, respectively.
Third, a series of polyimides were prepared by reaction of long alkyl-based diamines, 2,2’-bis(2-octadecyloxyphenoxy)-5,5’-diaminobiphenyl with various aromatic tetracarboxylic dianhydride. The polymers were prepared with moderate to low inherent viscosities (0.10~0.16 dL/g). The obtained polyimides were readily soluble in NMP, DMAc, THF, and cyclohexanone and gave inflexible film.

致謝................................Ⅰ
目錄................................Ⅱ
圖表索引............................Ⅴ
中文摘要............................ⅩⅠ
Abstract.........................ⅩⅠⅠⅠ
第一章 緒論........................1
1.1 液晶簡介........................1
1.2 配向膜簡介.......................2
1.3 配向膜的種類………………………...4
1.4 聚醯亞胺簡介......................8
1.5 聚醯亞胺的合成方法………….......11
1.6 聚醯亞胺的改質及其應用..........14
1.7 擬進行之研究...................17
第二章 實驗.......................19
2.1 實驗藥品.....................19
2.2 實驗程序...........................24
2.2.1 單體製備....................24
2.2.2 聚醯亞胺之合成...............33
2.3 單體鑑定及聚合物之物性與化性分析......35
第三章 物性、化性分析與討論.....................37
3.1 2,2’-bis(2-hexloxyphenoxy)-5,5’-diaminobiphenyl....37
3.1.1 單體製備........................37
3.1.2 聚醯亞胺之合成..................38
3.1.3 聚醯亞胺的物性分析.......................39
3.2 2,2’-bis(2-phenoxyoctadecyloxy)-5,5’-diaminobiphenyl..41
3.2.1 單體製備...................................41
3.2.2 聚醯亞胺之合成..............................42
3.2.3 聚醯亞胺的物性分析..............................43
3.3 2,2’-bis(3-phenoxyoctadecyloxy)-5,5’-diaminobiphenyl..44
3.3.1 單體製備.......................................44
3.3.2 聚醯亞胺之合成............................45
3-3-3 聚醯亞胺的物性分析.............................46
第四章 結論.................................48
4.1 2,2’-bis(2-hexloxyphenoxy)-5,5’-diaminobiphenyl......48
4.2 2,2’-bis(2-phenoxyoctadecyloxy)-5,5’-diaminobiphenyl..49
4.3 2,2’-bis(3-phenoxyoctadecyloxy)-5,5’-diaminobiphenyl..50
參考文獻...................................................51
自述.....................................................106

1. 液晶光電研究室 網址:www.e-lcd.com.tw
2. T. Uchida, Mol. Cryst. Liq. Cryst., 1985, 123, 15; T. Uchida and H.Seki, Chap 5 in Liquid Crystals Applications and Uses, vol. 3, edit by Birendra Bahadur, World Scientific, Singapore, 1992
3. 工業技術研究院電子工業研究所，中華民國台灣薄膜電晶體液晶顯示器產業協會課程資料
4. P. M. Heigenisher and N .J. Johnstin, ACS Symp.Ser132, American Chemical Society Washington, DC, 1980, p.3
5. 林金雀，聚醯亞胺樹脂在電子相關產業之應用，化工資訊月刊， 1999, Vol.13, NO.8, 29-34
6. H. D. Stenzenberger, Brit. Polym. J, 1979, 15
7. J. V. Crivello, J. Polym. Sci, 11(6), 1973, 1185
8. N. Bilow, A. L. Landis and L. J. Miller, U. S. Patent 3,845,018, 1974
9. R. A. Meyers, Am. Chem. Sci., Polym. Prepr., Vol.10, No.1, 186-192, 1969
10. N. A .Adrova, M. I. Bessonov, L. A. Laius and A. P. Rudakov, Polyimide：A new class of thermally stable polymers(in Russian), Nauka, Leningrad1, 1968
11. 李伯毅，正型鹼性水溶液顯影感光性聚亞醯胺材料之研究，國立成功大學化工研究所碩士論文，2002
12. F. W. Harris and S. L-C. Hsu，High Perform.Polym., 1, 1, 1999
13. Y. Oishi, M. Ishida, M. A. Kakimoto and Y. Imai, J Polym Sci Part A Polym Chem, 1992, 30, 1027
14. A. C. Misra, G. Tesoro, G. Hougham and S. M. Pendharkar, Polymer, 1993, 33, 1078
15. W. G. Kim and A. S .Hay, Macromolecules, 1993, 26, 5275
16. H. J. Jeong, M. A .Kakinoto and Y. I. Mai, J Polym Sci Part A Polym Chem, 1991, 29, 1691
17. C. P .Yang and W. T. Chen, Macromolecules, 1993, 26, 4865
18. P. A. Falcigno, S. Jasne and M .King, J Polym Sci Part A Polym Chem, 1991, 29, 1691
19. H. G. Rogers, R. A. Gaudiana, W. C. Hollinsed, P. S. Kalyanaraman, J. S. Manello, C. McGoWan, R. A. Minns and R. Sahatjian Macromolecules, 1985, 18, 1085
20. K. H. Choi, J. C. Jung, H. S. Kim, B. H. Sohn, W. C. Zin, M. Ree, Polymer, 2004, 45, 1517
21. X. Guo, J. Fang, K. Tanaka, H. Kita, K. I. Okamoto, J Polym Sci Part A Polym Chem, 2004, 42, 1432
22. S. Banerjee, M. K. Madhra, V. Kute, J Appl Polym Sci, 2004, 93, 821
23. B. Y. Myung, C. J. Ahn, T. H. Yoon, Polymer, 2004, 45, 3185
24. C. Gao, X. Wu, G. Lv, M. Ding, L Gao, Macromolecules, 2004, 37, 2754
25. Y. Yin, J. Fang, T. Watari, K. Tanaka, H. Kita, K. —I. Okamoto, J Mater Chem, 2004, 14, 1062
26. 王其仁、謝玉英，配向膜材料及應用技術，工業材料，No.166, 125-130, 2000
27. Wu Y.、Zhang Q.、Kanazawa A.、Shiono T.、Ikeda T.、Nagase Y.， Macromolecules, 1999, 32, 3951
28. 江選雅，聚醯亞胺的合成及其在LCD上的應用，化工資訊月刊， Vol.13, No.7, 43-53, 1999
29. 林俊右、李育德、太巨科技公司，低熱膨脹係數聚醯亞胺共聚物之合成與性質研究，第二十屆高分子研討會論文專輯, 99, 1997
30. Kim K-H., Jang S. and W. Harris F., Macromolecules, 2001, 34, 8925
31. S. J. Lee, J. C. Jung, S .W. Lee, M. Ree, J Polym Sci Part A Polym
Chem, 2004, 42, 3130
32. 黃銘裕，Polypyridine 之結構與物性及其在發光二極體和有機二 次電池上的應用之研究，國立清華大學化學工程研究所碩士論文，1997
33. 謝秀宜，高發光效率化合物：亞芳香基、伸乙炔基及其高分子聚
合物之製備與鑑定，國立清華大學化學研究所碩士論文，1998
34. S. I. Kim, M. Ree, T. J. Shin, J. C. Jung, J Polym Sci Part A Polym
Chem,1999, 37, 2909
35. J. H. Park, B. —H. Sohn, J. C. Jung, S .W. Lee, M. Ree, J Polym Sci
Part A Polym Chem,2001, 39, 1800
36. Y. Wu, Q. Zhang, A. Kanazawa, T. Shiono, T. Ikeda, Y. Nagase,
Macromolecules, 1999, 32, 3951
37. K, -W. Lee, S. —H. Paek, A. Lien, C. Durning, H. Fukuro,
Macromolecules, 1996, 29, 8894
38. J. H. Park, B. —H. Sohn, J. C. Jung, S .W. Lee, M. Ree, J Polym Sci
Part A Polym Chem, 2001, 39, 3622
39. J. G. Liu, Z. X. Li, J. T. Nu, H. W. Zhou, F. S. Wang, S. Y. Yang, J
Polym Sci Part A Polym Chem, 2002, 40, 1583
40. 許育仁，含側羥基之聚醯亞胺合成及其性質研究，國立台灣科技大學化學工程研究所碩士論文，2003
41.建國補習班網站資料