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研究生:王志安
研究生(外文):Zhi-An Wang
論文名稱:新三體微接觸模式及在 MCP 與 CMP 之應用
論文名稱(外文):New Three-body Microcontact Model for Rough Surfaces and It''s Applications in Mechano-Chemical Polishing and Chemical Mechanical Polishing
學位類別:碩士
校院名稱:國立虎尾科技大學
系所名稱:動力機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2005
畢業學年度:92
語文別:中文
論文頁數:127
相關次數:
  • 被引用被引用:0
  • 點閱點閱:102
  • 評分評分:
  • 下載下載:2
  • 收藏至我的研究室書目清單書目收藏:0
接觸表面間常存有顆粒,因此本論文建立一個考慮表面粗糙度與顆粒
的三體微接觸模式,以了解顆粒在兩界面間對接觸特性的影響。過去表面
和表面及表面和顆粒兩種不同的接觸模式,可利用三體微接觸程式簡化得
到。
本文也利用此新模式來分析機械化學研磨 (mechano-chemical polishing
MCP) 與化學機械研磨 (chemical-mechanical polishing CMP) 的接觸瞬閃溫度
與磨損率。同時考慮晶圓/研磨墊的真實接觸面積、相對滑動速度,晶圓表
面上的研磨漿濃度以及研磨墊的微硬度、粗糙度,對 CMP 與 MCP 製程的影
響。同時本文亦利用接觸溫度與磨損實驗驗證此理論是可行的。研究結果
顯示,研磨粒溫度主要受著研磨粒粒徑大小以及研磨墊硬度等影響,研磨
墊硬度越大或研磨粒越大均造成接觸溫度的上升。負荷與濃度則對研磨粒
接觸溫度的影響較少。在移除率方面由數值分析顯示外加壓力、磨粒大小、
滑動速度等對移除率有較顯著的影響。
Particles are often presented at contact interfaces. In this paper, a
three-body microcontact model for rough surfaces is proposed in order to
understand the effects of particles between surfaces on contact characteristics.
Both transitional surface-to-surface and particle-to-surface two-body
microcontact simulations can be obtained according to the simplification of this
model.
The new contact model was used to analysis the contact temperature and
wear properties in Mechano-chemical polishing (MCP) and
Chemical-mechanical polishing (CMP). The results show that in terms of the
real area of pad/wafer contact, contact sliding velocity, slurry particle size and
concentration of the wafer surface and micro-hardness, roughness of the Pad.
The analysis has be verificated by experiments of contact temperature and wear
test. The results indicate that the maximum flash temperature of particle
increases with the hardness of pad and particle size. The contact load and
particle volume concentration have a negligible effect in contact temperature
between workpiece and particle. The removal rate is sensitive to the applied load,
operating speed, particle size and particle concentration in the slurry.
摘要(中文) i
摘要(英文) ii
誌謝 iii
目錄 iv
表目錄 vi
圖目錄 vii
付號說明 x
第一章 緒論
1.1 前言 1
1.2 微接觸理論之文獻回顧 2
1.3 瞬閃溫度之文獻回顧 3
1.4 機械化學拋光 (MCP) 文獻回顧 5
1.5 CMP (移除率) 之文獻回顧 6
1.6 研究動機與論文架構 8
第二章 粗糙表面三體微接觸理論模式
2.1 前言 10
2.2 研磨墊與工件之接觸分析 10
2.3 研磨粒與工件及研磨粒與研磨墊之接觸分析 12
2.3.1 研磨粒與工件、研磨墊三者接觸均完全塑性變形 12
2.3.2 研磨粒與工件及研磨粒與研磨墊接觸均彈性變形 14
1. 統計研磨粒與工件之間的接觸 17
2. 作用在研磨墊與工件接觸間的研磨粒效應 18
3. 研磨粒、研磨墊及工件與外加負荷之力平衡 20
4. 研磨墊波峰與研磨粒的平均及最大接觸負荷 21
2.3.3 研磨粒與工件及研磨墊與研磨粒為完全塑性變形及彈性變形 22
1. 統計研磨粒與工件之間的接觸 23
2. 作用在研磨墊與工件接觸間的研磨粒效應 24
3. 研磨粒、研磨墊及工件與外加負荷之力平衡 25
4. 研磨墊波峰與研磨粒的平均及最大接觸負荷 26
第三章 微接觸模式於瞬閃溫度與磨損之應用
3.1 研磨墊、研磨粒與工件之瞬閃溫度模式 28
3.1.1 研磨墊與工件之瞬閃溫度 29
3.2 研磨粒與工件接觸的瞬閃溫度 30
3.2.1 研磨粒與工件及研磨墊均完全塑性變形 30
3.2.2 研磨粒與工件及研磨墊均彈性變形 30
3.2.3 研磨粒與工件接觸為完全塑性變形與研磨墊接觸為彈性變形 32
3.3 移除率的分析 33
3.3.1 移除率的決定 33
第四章 結果與討論
4.1 實驗驗證與研究方法 35
4.1.1 金屬研磨瞬閃溫度實驗驗證 35
4.1.2 CMP 移除率實驗驗證 37
4.2 CMP 製程之接觸溫度與磨損分析 37
4.3 MCP 研磨製程之接觸溫度分析 44
第五章 結論與建議 49
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