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研究生:張晏碩
研究生(外文):Y. S. Chang
論文名稱:以銅錳基銲材真空硬銲鑽石之研究
論文名稱(外文):Vaccum Brazing Diamond of using Cu-Mn-Based Alloys.
指導教授:黃 燕 飛蔡 丕 椿
指導教授(外文):Y. F. HwangP. C. Tsai
學位類別:碩士
校院名稱:國立臺北科技大學
系所名稱:製造科技研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:99
中文關鍵詞:真空硬銲鑽石硬銲低溫銲料潤濕性擴展力化學性鍵結
外文關鍵詞:Vaccum BrazingDiamond BrazingLower Melting Point MetalsWettabilitySpreading abilityChemical Banding
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本研究之目的是為應用活性金屬真空硬銲的原理,開發研究鑽石硬銲之低溫銲料。研究中以矽、錳為主要的活性金屬,並以一定重量百分比熔煉成低熔點之61Cu-37Mn-2Si (wt﹪, M0)、63Cu-37Mn (wt﹪, M1)、63Cu-32.5Mn-4.5Si (wt﹪, M2)、60Cu-35.5Mn-4.5Si ((wt﹪, M3)、59Cu-33Mn-8Si (wt﹪, M4)等銅基預合金為主要的銲材金屬,然後依其液相形成溫度選擇各種不同的硬銲溫度、相同的持溫時間,以真空硬銲方式將鑽石顆粒硬銲在金屬基材上。本研究分別針對各預合金硬銲前之液相形成溫度、組成相及其化學組成、顯微結構、微硬度等進行一系列的分析,並探討經不同溫度硬銲,硬銲合金之化學組成、顯微結構、微硬度、潤濕角及擴展力等變化情形。
研究結果顯示各預合金其熔點溫度分別為M0-928℃、M1-882℃、M2-843℃、M3-834℃、M4-834℃,因此本實驗根據其各熔點高低選取適合的硬銲溫度參數,而由EPMA與X-ray分析中分別可得知未硬銲前之各銲材預合金其顯微結構、各相之原子百分比與化學組成,另外可由微硬度檢測得知銲料硬銲前各相的硬度值大小。至於在硬銲後的分析方面,在經X-ray繞射、EPMA分析,潤濕角量測、擴展力計算、拉曼分析、微硬度檢測後,其可觀察到各預合金之化學組成的變化、鑽石顆粒與銲材合金經高溫硬銲後元素分佈情形與鑽石顆粒是否石墨化、所產生各相顯微組織中各元素的原子百分比、鑽石鍍膜與各銲材預合金潤濕與擴展力的情況及銲料硬銲後各相的硬度值大小等重要結果。而在完成所有的測試後,本研究發現到M3銲材合金其具有最低之液相形成溫度834℃,且合金中所含之Si及Mn在硬銲期間皆有擴散至鑽石顆粒附近,產生化學性鍵結,形成硬度相當高之Mn5SiC化學層而將鑽石顆粒穩固地抓持,並且銲材合金也與基材有產生良好的結合性,更重要的是其對鑽石鍍膜的潤濕性及擴展力最佳且並未使鑽石顆粒產生石墨化。
在比較各銲材合金研究成果後,我們發現到M3銲材合金的特性最符合低溫銲料、低成本、良好鑽石顆粒穩固性及不繡鋼具良好結合性之硬銲要求,相信此銲材合金在未來製作鑽石工具時將成為重要的參考資訊。

In this study, four kinds of Cu-Mn based brazing alloys were developed with the active element Si addition. The compositions of the brazing alloys were identified according to their microstructure phase diagrams. Besides, the melting points of these developed brazing alloys were evaluated through the DSC analysis.
The brazing temperatures were identified in accordance with the compositions and melting points mentioned above. Two brazing experiments were then performed: First, braze diamond grits onto 304 stainless steel substrate using the developed brazing alloys as filler metals. Second, place the brazing alloys on top of CVD diamond films and heat them to the brazing temperatures.
Then, by means of chemical etching technique, the researcher removed the diamond grits from the matrix. The surface of the diamond grits removed was then analyzed by scanning electron microscopy and X-ray diffractometry.
In addition, the performances of the brazing alloys on top of diamond films were evaluated via wettability observation, scanning electron microscopy(SEM), X-ray diffractometry(XRD), Raman analysis, and microhardness tests.
The results of the study show that the M3 brazing alloy has the lowest melting point(834°C), smallest wetting angle and best spreading ability. It is also observed that silicon and manganese both diffused to the vicinity of diamond. The intermetallic layer was formed between diamond grits and brazing alloys. The intermetallic layer was identified as Mn7C3 for M0, M1 alloys and Mn5SiC for M2, M3, M4 alloys. The findings will hopefully contribute to the manufacture of diamond tools.

中文摘要 i
英文摘要 iii
誌謝 v
目錄 vi
表目錄 ix
圖目錄 xi
第一章 緒論 1
第二章 文獻回顧 3
2.1硬銲作業 3
2.1.1 硬銲製程中銲材型式 3
2.2鑽石工具壽命及切削性與銲材之關聯性 4
2.2.1 潤濕、擴展力與結合 4
2.2.2 殘留應力的處理 6
2.2.3 其他特性 6
2.3鑽石顆粒選取 9
2.4活性金屬的功用 10
2.5活性元素對銲材金屬機械性質之影響 13
2.6硬銲與燒結氣氛的影響 14
2.7硬銲溫度、時間的影響 15
2.8銲材金屬對鋼鐵基材及鑽石顆粒之擴展力與潤濕性 17
第三章 實驗設備與方法 21
3.1實驗目的及實驗流程圖 21
3.2實驗材料 23
3.3實驗設備建構及真空硬銲處理 23
3.4試片製作與電解腐蝕 25
3.5顯微結構觀察與EPMA成份分析 26
3.6 XRD分析 26
3.7熱重分析 26
3.8潤濕性及擴展力分析 26
3.9微硬度HV試驗 27
第四章 實驗結果與討論 28
4.1銲材金屬之熱重分析 28
4.1.1 銲材金屬之熔解曲線圖 28
4.1.2 銲料金屬之凝固曲線圖 28
4.2銲材金屬未硬銲前之X-ray繞射分析 30
4.3銲材金屬硬銲前之顯微組織分析 30
4.3.1 M0預合金SEM、EPMA顯微組織 30
4.3.2 M1預合金SEM、EPMA顯微組織 33
4.3.3 M2預合金SEM、EPMA顯微組織 34
4.3.4 M3預合金SEM、EPMA顯微組織 35
4.3.5 M4預合金SEM、EPMA顯微組織 37
4.4硬銲鑽石表面SEM顯微組織分析 38
4.4.1 使用M0銲料 38
4.4.2 使用M1銲料 39
4.4.3 使用M2銲料 40
4.4.4 使用M3銲料 41
4.4.5 使用M4銲料 42
4.5銲料對鑽石鍍膜的潤濕性 44
4.5.1 M0銲料對鑽石鍍膜的潤濕性 44
4.5.2 M1銲料對鑽石鍍膜的潤濕性 44
4.5.3 M2銲料對鑽石鍍膜的潤濕性 45
4.5.4 M3銲料對鑽石鍍膜的潤濕性 45
4.5.5 M4銲料對鑽石鍍膜的潤濕性 45
4.6各銲料與鑽石膜之潤濕角與擴展力分析 47
4.7硬銲後之顯微組織及X-ray繞射分析 50
4.7.1 M0銲料 50
4.7.1.1 M0銲料硬銲後X-ray繞射分析 50
4.7.1.2 M0銲料於不鏽鋼上硬銲後表面處顯微組織 51
4.7.1.3 M0銲料於不鏽鋼上硬銲後鑽石處顯微組織 53
4.7.2 M1銲料 54
4.7.2.1 M1銲料硬銲後X-ray繞射分析 54
4.7.2.2 M1銲料於不鏽鋼上硬銲後表面處顯微組織 56
4.7.2.3 M1銲料於不鏽鋼上硬銲後鑽石處顯微組織 58
4.7.2.4 M1銲料於鑽石鍍膜上硬銲後鑽石膜處顯微組織 59
4.7.3 M2銲料 61
4.7.3.1 M2銲料硬銲後X-ray繞射分析 61
4.7.3.2 M2銲料於不鏽鋼上硬銲後表面處顯微組織 62
4.7.3.3 M2銲料於不鏽鋼上硬銲後鑽石處顯微組織 64
4.7.3.4 M2銲料於鑽石鍍膜上硬銲後表面處顯微組織 66
4.7.3.5 M2銲料於鑽石鍍膜上硬銲後鑽石膜處顯微組織 67
4.7.4 M3銲料 69
4.7.4.1 M3銲料硬銲後X-ray繞射分析 69
4.7.4.2 M3銲料於不鏽鋼上硬銲後表面處顯微組織 70
4.7.4.3 M3銲料於不鏽鋼上硬銲後鑽石處顯微組織 72
4.7.4.4 M3銲料於鑽石鍍膜上硬銲後表面處顯微組織 73
4.7.4.5 M3銲料於鑽石鍍膜上硬銲後鑽石膜處顯微組織 75
4.7.5 M4銲料 76
4.7.5.1 M4銲料硬銲後X-ray繞射分析 76
4.7.5.2 M4銲料於不鏽鋼上硬銲後表面處之顯微組織 78
4.7.5.3 M4銲料於不鏽鋼上硬銲後鑽石處之顯微組織 80
4.7.5.4 M4銲料於鑽石鍍膜上硬銲後表面處顯微組織 82
4.7.5.5 銲料於鑽石鍍膜上硬銲後鑽石膜處顯微組織 83
4.8各銲料整體及硬銲前後之金相硬度分析 85
第五章 結論、建議與未來發展 88
參考文獻 90
附錄 97
作者簡介 …99

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