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研究生:曹凱傑
研究生(外文):Kai - Chieh
論文名稱:晶片尺寸構裝模流暨熱傳性能分析
論文名稱(外文):The Thermal and Mold Flow Analysis of Chip Scale Packages
指導教授:張嘉隆張嘉隆引用關係
指導教授(外文):Chia-lung Chang
學位類別:碩士
校院名稱:國立雲林科技大學
系所名稱:機械工程系碩士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:67
中文關鍵詞:模流分析有限元素方法CFD熱阻溢膠金線偏移
外文關鍵詞:mold flowFEMCFDthermal resistanceresin bleedingwire sweep
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本研究使用C-MOLD 與Moldflow模流軟體模擬導線架構裝TSOP及晶片尺寸構裝之微型球柵陣列構裝(μBGA)在充填過程中所產生金線偏移,與實驗量測比較,驗證模擬之正確性。探討μBGA基板上輔助開孔及晶片與基板開孔中心偏移量對構裝充填過程上下模波前差異與金線偏移之影響;為改善構裝在封膠過程之溢膠情形,比較四種不同基板設計,即有無輔助開孔及晶片與基板開孔中心偏移量不同,對下模壓力及注入速度之差異,討論下模壓力及速度對構裝溢膠之影響。
電子構裝熱性能分析,建立晶片尺寸構裝QFN之有限元素固體模型及CFD模型,模擬在自然及強制對流下之構裝溫度,與實驗量測熱阻值比較,驗證模擬之正確性。有限元素固體模型的表面熱對流係數分別以CFD擷取的構裝表面平均熱對流係數與傳統平板之熱對流係數設定,比較模擬熱阻值的正確性。執行μBGA之有限元素熱傳分析,模擬在自然及強制對流下之構裝溫度分佈,討論風速對熱阻的影響。
In this research, the C-MOLD and Moldflow software are used to simulate the wire sweep of both TSOP and μBGA packages during encapsulation, the predicted results are compared with experimental measurements to verify the accuracy of simulations. The effect of the auxiliary hole on substrate and the offset between the chip and substrate center on the wire sweep and the differences of melt-front advancements between upper and lower mold cavities during encapsulation are discussed. In order to improve the resin bleeding, the mold flow performances of four substrate designs are compared. The effect of molding pressure and velocity in lower cavity on resin bleeding is discussed.

The finite element solid model and CFD model of QFN package are built to simulate the thermal performance of the package under natural and forced convection conditions, the simulated results are compared with experimental measurements to verify the accuracy. Both the flat plate surface convection correlations and the surface convection correlations obtained from the CFD results are applied to finite element solid model to predict the thermal resistance of the package, and the results are compared with experimental measurements to discuss the accuracy. Also the thermal performance of μBGA under natural and forced convection conditions is simulated by finite element solid model.
目   錄
中文摘要-------------------------------------------------------------------------------------------i
英文摘要------------------------------------------------------------------------------------------ii
誌謝-----------------------------------------------------------------------------------------------iii
目錄---------------------------------------------------------------------------------------------- iv
表目錄--------------------------------------------------------------------------------------------vi
圖目錄-------------------------------------------------------------------------------------------vii
符號說明-----------------------------------------------------------------------------------------ix
第一章 緒論-------------------------------------------------------------------------------------1
1.1 前言----------------------------------------------------------------------------------1
1.2 電子構裝簡介---------------------------------------------------------------------2
1.3 CSP封裝-----------------------------------------------------------------------------2
1.4文獻回顧-----------------------------------------------------------------------------3
1.5研究目的-----------------------------------------------------------------------------4
第二章 研究方法-------------------------------------------------------------------------------6
2.1 電子構裝模流分析----------------------------------------------------------------6
2.1.1 轉移成型----------------------------------------------------------------------6
2.1.2 晶片的連接方式-------------------------------------------------------------7
2.1.3 金線偏移分析----------------------------------------------------------------8
2.1.4 金線偏移量的定義----------------------------------------------------------9
2.1.5 溢料---------------------------------------------------------------------------10
2.2 C-MOLD軟體模擬方法---------------------------------------------------------10
2.2.1 C-MOLD模擬分析基本假設---------------------------------------------11
2.2.2 幾何模型的建立與簡化---------------------------------------------------11
2.3 Moldflow軟體模擬方法---------------------------------------------------------12
2.4 金線偏移實驗量測--------------------------------------------------------------12
2.5 電子構裝熱性能分析-----------------------------------------------------------13
2.5.1 電子構裝熱性能分析基本假設------------------------------------------13
2.5.2 電子構裝熱性能模擬的分析程序---------------------------------------13
2.6 CFD熱流場分析模擬基本假設------------------------------------------------15
2.6.1 CFD分析程序---------------------------------------------------------------15
2.7 熱阻量測實驗--------------------------------------------------------------------17
2.7.1自然對流熱阻量測----------------------------------------------------------17
2.7.2 強制對流熱阻量測---------------------------------------------------------19
第三章 模流與熱傳理論介紹---------------------------------------------------------------23
3.1 模流分析原理--------------------------------------------------------------------23
3.1.1 連續方程式------------------------------------------------------------------23
3.1.2 動量方程式------------------------------------------------------------------23
3.1.3 能量方程式------------------------------------------------------------------23
3.1.4 硬化反應方程式------------------------------------------------------------24
3.1.5 黏滯方程式------------------------------------------------------------------24
3.2 熱傳分析基礎理論--------------------------------------------------------------25
3.2.1 熱傳導------------------------------------------------------------------------25
3.2.2 熱對流------------------------------------------------------------------------25
3.2.3 熱輻射------------------------------------------------------------------------26
3.3 熱對流係數-----------------------------------------------------------------------27
3.3.1 自然對流---------------------------------------------------------------------27
3.3.1 強制對流---------------------------------------------------------------------28
3.4 熱傳之有限元素基礎理論-----------------------------------------------------28
3.5 CFD分析基礎理論--------------------------------------------------------------30
第四章 金線偏移及模流分析結果與討論----------------------------------------------32
4.1 TSOP66 LOC構裝金線偏移分析---------------------------------------------32
4.1.1 幾何尺寸與製程參數------------------------------------------------------32
4.1.2 TSOP66 LOC構裝金線偏移分析與驗證-----------------------------34
4.2 CSP-μBGA構裝模流及金線偏移分析--------------------------------------37
4.2.1 幾何尺寸與製程參數------------------------------------------------------37
4.2.2 CSP-μBGA構裝模流及金線偏移分析---------------------------------40
第五章 熱傳性能分析結果與討論-------------------------------------------------------54
5.1 QFN構裝分析---------------------------------------------------------------------54
5.1.1 幾何尺寸與材料性質------------------------------------------------------54
5.2 QFN熱傳性能分析---------------------------------------------------------------55
5.3 QFN熱對流係數分析------------------------------------------------------------58
5.4 μBGA構裝分析-------------------------------------------------------------------61
5.4.1 幾何尺寸與材料性質------------------------------------------------------61
5.5 μBGA熱傳性能分析-------------------------------------------------------------62
第六章 結論------------------------------------------------------------------------------------64
參考文獻----------------------------------------------------------------------------------------66
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