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研究生:馮勝凱
研究生(外文):Shang-Kai Feng
論文名稱:應用光學三維量測系統於覆晶錫鉛凸塊高度量測
論文名稱(外文):An improved phase-shift based 3D measurement system for flip chip solder bump inspection
指導教授:蔡篤銘蔡篤銘引用關係
指導教授(外文):Du-Ming Tsai
學位類別:碩士
校院名稱:元智大學
系所名稱:工業工程與管理學系
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2004
畢業學年度:92
語文別:中文
論文頁數:92
中文關鍵詞:三維量測覆晶凸塊高度相位移共平面檢測
外文關鍵詞:3D measurementFlip chipSolder bumpPhase shiftingCoplanarity inpection
相關次數:
  • 被引用被引用:3
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  • 下載下載:98
  • 收藏至我的研究室書目清單書目收藏:2
在覆晶封裝(Flip Chip Package,FP)製程中,三維量測對錫鉛凸塊(Solder bump)的製造相當重要。基於X射線(X-ray)或雷射掃瞄(Laser scanning)方法的精密三維量測系統,不僅建置成本高,且系統校正耗時費力。本研究針對覆晶封裝元件之品質檢測,改進一個建置成本低、量測效益高之三維光學量測系統,以快速量測覆晶凸塊高度值,並重建物體表面輪廓圖。
本研究採用顏旭男【2004】所發展以DLP(Digital Light Processing)為基之相位移三維量測系統,並加以改善。主要針對正弦條紋影像進行中值濾波以降低量測之變異,並以矩陣系統參數值取代固定之系統參數值,可隨量測位置的不同而調整此系統參數值,以有效提昇量測之精度;最後經由所量測出每顆凸塊的高度,做一共平面度的檢驗。
由於本研究採用全場量測方式(面掃瞄),量測速度快,可在1秒內完成計算一張640×480像素影像的高度量測。由覆晶凸塊的實驗結果顯示本系統在覆晶錫鉛凸塊的品質檢測上有良好功效,其量測之精度可達2微米。
In flip chip packaging processes, three-dimensional (3D) measurement is important for the quality inspection of solder bumps. Currently, 3D measurements of solder bumps are mainly performed by laser-based systems. They suffer from high equipment cost, and low inspection speed due to the physical line-scanning process. In this paper, a fast and cost-effective 3D measurement system improved from Yen and Tsai [2004] is used for the inspection of flip chip solder bumps.
The full-field 3D measurement system adopted in this research is based on a phase shift technique, in which the phase is efficiently and effectively shifted by a software-controlled grating using a digital light processing (DLP) unit. To improve the system proposed by Yen and Tsai, a 2D median filter is first applied in the projected sinusoidal fringe pattern image. The smoothing process can effectively remove optical noise and, therefore, increase the measurement repeatability. Further, the measurement accuracy of the 3D system is determined by a system parameter, which was originally a fixed value in the Yen and Tsai’s configuration. In this research, adaptive parameter values, instead of a fixed value, are employed to improve the measurement accuracy. The system parameter values are prestored in a matrix, and adaptively vary according to the measurement positions. It significantly improves the accuracy of measured heights. After the height of every solder bump is determined, two coplanarity measures of flip chip solder bumps are also proposed in this research. Experimental results from a number of flip chip samples have shown the efficacy of the improved scheme. The computing time of the proposed 3D measurement system for an image of 640×480 pixels is less than 1 seconds, and the measurement accuracy is around 2 μm.
中文摘要………………………………………………………………………. I
目錄……………………………………………………………………………. II
表目錄………………………………………………………………………… IV
圖目錄…………………………………………………………………………. V
第一章 緒論…………………………..………………………………………. 1
1.1 研究背景與動機………………………………………………... 1
1.2 研究範圍與目的………………………………………………... 2
1.3 研究方法簡介…………………………………………………... 3
1.4 論文架構………………………………………….…………….. 4
第二章 文獻回顧…………………………..…………………………………. 5
2.1 BGA與覆晶之瑕疵檢測……………………………………. …. 5
2.2 三維量測技術……………………………………….………….. 7
2.3 相位移量測技術……………………………………….……….. 9
第三章 以DLP為基之相位移三維量測技…….………. ………….………. 11
3.1 相位移量測技術……………………………………………... 11
3.2 數位相位移投射系統…………………………………………... 15
3.3 系統架構………………………………………………………... 18
3.4 系統量測流程……………..……………………………………. 21
3.5 系統參數k值校正……………………………………………... 23
3.6 正弦影像雜訊之濾除….…………………………………..…... 27
3.6.1 中值濾波器之使用…………………..…….………..….... 27
3.6.2 使用中值濾波器實驗結果…………………………..….... 30
第四章 覆晶封裝凸塊高度量測及共平面度檢測...…………………………
4.1 表面黏著技術製程簡介………………………………………... 34
4.2 覆晶封裝製程及其瑕疵…………………..………..…………. 36
4.3 系統架構……………………………………………..….……... 39
4.4 覆晶凸塊高度實驗結果……………………………………….. 40
4.4.1 條紋對比度閥值的選擇……………..…….………..….... 41
4.4.2 覆晶凸塊之高度計算………………..…….………..….... 45
4.4.3 程式之執行時間………………..…….………….……….. 58
4.4.4 檢測覆晶凸塊之共平面性……………………………….. 64
4.5 實驗結論與使用之建議………………………………………... 72
第五章 貢獻與後續研究………………………………….…………….……. 73
5.1 結論………….………………………………………………….. 73
5.2 未來研究方向.………………………………………………….. 74
參考文獻……………………………………………………..……………..…. 76
附錄A 不同材質系統參數k值比較…….………………………………….. 80
附錄B 系統參數k值不同時所造成量測高度之差異 81
附錄C 使用矩陣系統參數值之假設檢定驗證…….…..…………………… 83
附錄D 對正弦條紋使用中值濾波之假設檢定驗證………………………… 84
附錄E 使用固定參數值量測結果(使用白平衡板當參考平面)…………. 85
附錄F 使用矩陣參數值量測結果(使用白平衡板當參考平面)…………. 86
附錄G 使用固定參數值量測結果(使用金屬塊規當參考平面)…………. 87
附錄H 使用矩陣參數值量測結果(使用金屬塊規當參考平面)…………. 88
附錄I 程式介面的設計….……………………………...…. ………………. 89
附錄J 圖4-23中所有凸塊高度…….…………………. …………………… 91
附錄K 圖4-23中凸塊到迴歸平面高度差值………………. ………………. 92
附錄L 程式碼…….………..……………. ………….…………………. …… 93
Amkor, 2004, Enabling technologies, Available:http://www.amkor.com/enabling- tech nologies/ FlipChip/index.cfm.
Anon, R., 1999, “Microfocus X-rays for BGA/flip chip inspection,” European Semiconductor Design Production Assembly, Vol. 21, pp. 61-62.
Asundi, A., 1993, “Computer aided moiré methods, ” Optics and Lasers in Engineering, Vol. 17, pp. 107-116.
Asundi, A. and W. Zhou, 1999, “Unified calibration technique and its applications in optical triangular profilometry,” Appl. Opt., Vol. 38, pp. 3556-3561.
Brophy, C. P., 1989, “Effect of intensity error correlation on the computed phase of phase-shifting interferometry,” Optical Society of America, Vol. 7, pp. 537-541.
Greivenkamp, J. E. and J. H. Bruning, 1992, “Phase shifting interferometry,” Optical Shop Testing, D. Malacara (ed.), Wiley, New York.
Griffen, C. T., Y. Y. Hung, and F. Chen, 1995, “Three dimensional shape measurement using digital shearography,” Proc. SPIE, Vol. 2545, pp. 214-220.
Harding, K. and L. Bieman, 1998, “High speed moiré contouring methods analysis,” Proc. SPIE, Vol. 3520, pp. 27-35.
Huang, P. S., C. P. Zhang, F. P. Chiang, 2003, “High-speed 3-D shape measurement based on digital fringe projection,” Opt. Eng., Vol. 42, pp. 163-168.
Hung , Y. Y., L. Lin, H. M. Shang, B. G. Park, 2000, “Practical three-dimensional computer vision techniques for full-field surface measurement,” Opt. Eng., Vol. 39, pp. 143-149.
Ji, Z. and M. C. Leu, 1989, “Design of optical triangulation devices,” Optics and Laser Technology, Vol. 21, pp. 335-338.
Kim, D. J., W. S. Chang, S. K. Park, S. H. Baik and C. J. Kim, 1999, “A study on a 3-D profilemeter using dynamic shape reconstruction with adaptive pattern clustering of the line-shaped laser light,” Proceedings of the IEEE Region 10 Conference, Vol. 2, pp. 1371-1374.
Kuznia, C. B., J. M. Wu, C. H. Chen, B. Hoanca, L. Cheng, A. G. Weber and A. A. Sawchuk, 1999, “ Two-dimensional parallel pipeline smart pixel array cellular logic (SPARCL) processors-chip design and system implementation,” IEEE Journal, Selected Topics in Quantum Electronics, Vol. 5, pp. 376 — 386.
Liu, S., D. Erdahl, I. C. Ume, A. Achari, and J. Gamalski, 2001, “A Novel Approach for Flip Chip Solder Joint Quality Inspection: Laser Ultrasound and Interferometric System,” IEEE Transactions on Components and Packaging Technologies, Vol. 24.
Lu, M., X. He and S. Liu, 2000, “Powerful frequency domain algorithm for frequency identification for projected grating phase analysis and its applications,” Opt. Eng., Vol. 39, pp. 137-142.
Matsuyama , Y., T. Honda, H. Yamamura, H. Sasazawa, M. Nomoto, T. Ninomiya, A. Schick, L. Listl, P. Kollensperger, D. Spriegel, P. Mengel and R. Schneider, 1996, “Automated solder joint inspection system using optical 3-D image detection,” IEEE Workshop on Applications of Computer Vision, pp. 116-122.
Pang, J. H. L., D. Y. Chong, 2001, ” Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models,” IEEE Transactions on Advanced Packaging, Vol. 24, pp. 499 — 506.
Reich, C., R. Ritter, J. Thesing, 2000, ” 3-D shape measurement of complex objects by combining photogrammetry and fringe projection,” Opt. Eng., Vol. 39, pp. 224-231.
Rideout, E. H., 1990, “Lowering test costs with 3-D solder-joint inspection,” Test and Measurement World, Vol. 10, pp. 744-1657.
Rooks, S. and T. Sack, 1995, “X-ray inspection of flip chip attach using digital tomsynthesis,” Circuit World, Vol. 21, pp. 51-55.
Ryu, Y. K. and H. S. Cho, 1997, “New optical measuring system for solder joint inspection,” Optics and Lasers in Engineering, Vol. 26, pp. 487-514.
Sansoni , G., S. Corini, S. Lazzari, R. Rodella, and F. Docchio, 1997, “Three dimensional imaging based on gray-code light projection: characterization of the measuring algorithm and development of a measuring system for industrial application, ” Appl. Opt. Vol. 36, pp. 463-4472.
Shiau, Y. R. and B. C. Jiang, 1991, “Determine a vision system’s 3D coordinate measurement capability using taguchi methods,” International Journal of Production Research, Vol. 29, pp. 1101-1122.
Sirnivasan, V., H. C. Liu, and M. Halioua, 1984, “Automated phase measuring profilometry of 3D diffuse objects, ” Appl. Opt., Vol. 23, pp. 3105-3108.
Sujan, V. A. and S. Dubowsky, 2001, “Design and Implementation of a 3-D mapping system for highly irregular shaped objects: with application to semiconductor manufacture,” Opt. Eng., Vol. 41, pp. 1406-1417.
Takasaki, H. , 1970, “Moiré topography, ” Appl. Opt. 9, pp. 1467-1472.
Techsearch, 2004, Available:http://www.techsearchinc.com/.
Tiziani, H. J., M. Wegner, D. Steudle, 2000, “Confocal principle for macro- and microscopic surface and defect analysis,” Opt. Eng., Vol. 39, pp. 32-39.
Tsukahara, H., Y. Nishiyama, F. Takahashi, T. Fuse, M. Ando and T. Nishino, 1995, “High-speed 3D inspection system for solder bumps,” Proceedings of SPIE, Vol. 2597, pp. 168-177.
Wagner, C., W. Osten and S. Seebacher, 2000, “Direct shape measurement by digital wavefront reconstruction and multiwavelength,” Opt. Eng., Vol. 39, pp. 79-85.
Yen, H. N. and D. M. Tsai, 2004, “A fast full-field 3D measurement system for BGA coplanarity inspection,” International Journal of Advanced Manufacturing Technology, (in press).
工業技術研究院電子所,2004年,覆晶錫鉛凸塊植球技術,網址:http:// www.itri.org.tw/chi/services/transferable/itri_show.jsp?idx=151。
朱建政,2002年,「BGA封裝晶片表面瑕疵檢測之研究」,碩士論文,元智大學工業工程與管理研究所。
宋新缶,2004年,「三維型貌量測探頭投術及發展趨勢」,自動化光學檢測技術,網址:http://aoiea.itri.org.tw/web/ShowDoc.aspx?dirnm=techdoc&filenm=0025.pdf。
明諅電通,2004年,「解釋 LCD & DLP 的不同」,網址:http://211.20.183.97/asp /front/BenqMain.asp?MenuHead=137&ShowType=program&FileURL=product.asp&Dataid=10671&GenMenu=&RootId=0。
悠立半導體,2004年,產品與服務,網址:http://www.ust.com.tw/c-technology.htm。
陳志松,1999年,「應用光測力學在電子構裝之量測分析」,碩士論文,台灣大學應用力學研究所。
陳彥廷,2001年,「BGA黏晶與覆晶構裝晶片之自動檢測」,碩士論文,中華大學機械與航太工程研究所。
劉立晟,2002年,「覆晶錫球陣列封裝之無鉛錫球接點可靠度測試」,碩士論文,中山大學機械與機電工程學系研究所。
劉應興,1999年,「應用線性迴歸模型(譯本)」,華泰出版社。
蕭傳議,2004年,覆晶載板市場機會,網址:http://itisdom.itri.org.tw/itri /itisnews.nsf/0/d43fb7c9dfa9268848256deb005d780f?OpenDocument。
謝坤翰,2004年,「無參考樣板之球格陣列(BGA)基板表面瑕疵檢測」,碩士論文,元智大學工業工程與管理研究所。
顏旭男,2004年,「全場光學三維量測技術於表面黏著電子封裝元件之檢測」,博士論文,元智大學工業工程與管理研究所。
藍文雄,2003年,「使用光度學立體法估測覆晶IC之錫球形狀」,碩士論文,台灣科技大學電機工程系研究所。
鐘資然,2002年,「BGA金線金球位置之自動檢測」,碩士論文,中華大學機械與航太工程研究所。
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