臺灣博碩士論文加值系統

本論文主要是從眾多的半導體產業公司和學術研究機構中，調查和研究有關晶圓在製造過程中所發生的一些空間性製程上的變動，而這些空間性製程變動會產生晶圓缺陷、晶圓錯誤、積體電路在操作時所產生的問題或症狀…等等，我們把晶圓空間性製程變動的問題作一整體性的資料蒐集、整理、分析，並加以描述和呈現這些觀點，對於整個半導體製程的影響，最終能將這些現象的資料彙整作為改善晶圓製程變動的索引，藉由運用其資料的結果能使半導體製程得到良率的提升，並促使晶圓製程變動能下降這是我們所期望的。

This thesis is mainly from numerous semiconductor industry's companies and academic organizations，Investigate and is it have something to do with wafer and wafer fabrication some happened spatial process variation in the course of making to study。
The wafer spatial process variation can produce wafer defect ,and wafer mistake , integrated circuit question or symptom produced while operating , we make wafer spatial process variation issue to make one materials of global search collect , put in order , analysis, describe and appear view these , The wafer process variation syndrome provide us with our study, arrangement, classification and analysis, So we use the wafer spatial process variation to find out the fountainhead of the yield variation. They also containt more information, which can offer to improve the yield and manufacturer’s productivity.

摘要Ⅰ
AbstractⅡ
誌 謝 Ⅲ
目錄 IV
圖目錄 VII
第一章 緒論 1
1.1 前言 1
1.2 研究動機 5
1.3 研究方法 6
1.4 論文架構 8
第二章 晶圓製程與晶圓測試 10
2.1 何謂晶圓 10
2.2 晶圓製程概觀 10
2.2-1 前段製程 (Front End of Line) 13
2.2-1-1 矽晶圓準備(silicon Wafer Preparation) 13
2.2-1-2 晶圓製造 (Wafer Fabrication) 13
2.2-1-3 晶圓針測/分類 (Wafer Test/Sort) 15
2.2-2 後段製程 (Back End of Line) 17
2.2-2-1 晶圓切割及封裝(Wafer Dicing and Package) 18
2.2-2-2 最後測試(Final Test) 19
2.3 積體電路測試 (IC Test) 19
2.3-1 參數測試 (Parametric Test) 20
2.3-2 晶圓測試 (Wafer Test) 20
2.3-3 封裝測試 (Package Test) 22
2.3-4 可靠性測試 (Reliability Test) 22
第三章 晶圓在製程變動上的分類 23
3.1晶圓圖在製程上的分類 23
3.2空間性及時間性變動(Spatial and Temporal Variation) 23
3.2-1 空間性變動 (Spatial variation) 23
3.2-2 時間性變動 (Temporal Variation ) 24
3.3系統性及隨機性變動(Systematic and Random Variation) 25
3.3-1 系統性變動(Systematic Variation) 25
3.3-2 隨機性變動(Random Variation) 26
第四章 空間性製程變動的分析 27
4.1 晶片內部(within die)分析 27
4.2 元件模擬參數設定 29
4.3 分析及模擬結果 31
4.4 GUI模擬空間性製程變動之設計 33
第五章 製程變動控制與良率提升 35
5.1 製程變動控制與良率關係 35
5.2 RUN TO Run Control Process 36
5.3先進製程控制(Advanced Process Control ,APC) 38
第六章 先進製程發展趨勢與結論 41
6.1晶圓製程發展趨勢 41
6.2晶圓測試發展趨勢 42
6.1結論 43
參考文獻 45

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