(3.210.184.142) 您好!臺灣時間:2021/05/09 09:03
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:李瑞淇
研究生(外文):Jui-Chi Li
論文名稱:PCB構裝之訊號完整度模擬分析
論文名稱(外文):Simulation and Analysis of Signal Integrity in the PCB Modules
指導教授:吳俊德吳俊德引用關係
指導教授(外文):Chun-Te Wu
學位類別:碩士
校院名稱:大葉大學
系所名稱:電信工程學系碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2005
畢業學年度:93
語文別:中文
論文頁數:58
中文關鍵詞:保護線同步切換雜訊去耦合電容接地反彈雜訊共振頻率電源供應系統訊號完整度Sigrity SpeedXP Suite
外文關鍵詞:Guard trace with viasSSNDecoupling capacitor (de-cap)ground bounce (GB)resonance frequencypower delivery system (PDS)s
相關次數:
  • 被引用被引用:2
  • 點閱點閱:490
  • 評分評分:系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
在現今的高速數位系統中,隨著電子系統操作頻率的增加,訊號切換的暫態時間也越來越短,積體電路(Integrated Circuit,IC)和晶片(Chip)以外的電子電路密度越來越高,然而在電子電路快速切換及晶片針腳同步開關切換之下,將造成同步觸發雜訊(simultaneous switching noise ,SSN),或是當暫態電流從電源層(Power plane)經由貫孔接腳(Via)流到接地層(Ground plane)時,所產生的接地反彈雜訊(Ground bounce),而接地反彈雜訊將傳播在電源層跟接地層之間,使得共振頻率在二維的共振腔被激發,也造成了電源供應系統(power delivery system, PDS)的不穩定,在這兩種雜訊的干擾之下,往往會造成整個模組產生錯判的動作,相對的也造成訊號完整度(Signal integrity,SI)跟電磁干擾(Electromagnetic Interference,EMI)的問題更加的嚴重。
本篇論文利用模擬軟體,對於多層印刷電路板(multi-layer Printed Circuit Board,PCB)之訊號完整度分析。
In today’s high-speed digital systems,the operation frequency of electronic system increases , the switching time of the signal becomes shorter and the density of Integrated Circuit (IC) becomes higher. If the circuit switching fast and the current drives from the pins of the chip, it will cause severe simultaneous switching noise (SSN), When the current passes through the power/ground plane by via, it will produce ground bounce (GB), and the ground bounce noise will propagate between power and ground planes. To the worse, it will excite the resonant frequency form by the two dimensional cavity of power and ground planes and cause the instability of the whole power delivery system. In interference of the two noise, so signal integrity ( SI) and Electromagnetic Interference (EMI) problem will become more serious.
This paper is to investigate SI by using Sigrity SpeedXP Suite software for multi-layer Printed Circuit Board.
目錄
封面內頁
簽名頁
授權書.........................iii
中文摘要........................iv
英文摘要........................v
誌謝..........................vi
目錄..........................vii
圖目錄.........................ix
表目錄.........................xii

第一章 序論.................. ... 1
1.1研究動機及目標................1
1.2研究方法..................2
1.3章節概要..................3
第二章 基礎理論 ....................4
2.1微帶線...................4
  2.1.1 描述..................4
2.1.2 微帶線的特性..............4
  2.1.3 微帶線損失...............6
  2.1.4 集膚效應................7
2.1.5 傳播延遲................7
2.2 貫孔之寄生效應...............8
  2.2.1 寄生電容與電感效應...........8
  2.2.2 彎角之不連續性............10
2.3 串音雜訊.................11
2.3.1 概述.................11
  2.3.2串因雜訊之計算公式..........12
2.4 S參數.................13
第三章 保護線與貫孔在射頻印刷電路板上的應用......21
3.1問題描述.................21
3.2模擬與量測之電路.............22
3.3模擬與量測結果..............23
第四章 去耦合電容在印刷電路板上擺放的位置對於減少接地反彈雜訊..................... 34
4.1接地反彈雜訊的形成.............34
4.2去耦合電容.................35
4.3模擬參數..................36
  4.3.1針腳之短路接腳效應..........36
4.3.2 sinesquare waveform..........37
4.3.3有效頻率範圍.............38
4.4 模擬結果..................39
第五章 利用IBIS模型模擬同步切換雜訊..........49
5.1 同步切換雜訊產成的問題...........49
5.2 IBIS模型..................49
5.3 同步切換雜訊之模擬結果...........50
第六章 結論 ......................55
參考文獻........................57
[1]David M. Pozar , “Microwave Engineering,” 2nd edition, John
Wiley&Sons, 1998,pp.177-180.
[2]Stephen H.Hall , Garrett W.Hall , James A.McCall , “ High-Speed
Digital System Design : A Handbook of Interconnect Theory and
Design Practices” ,2000.
[3]Sol Rosenstark,“Transmission Lines in Computer Engineering,”
McGraw-Hill,1994.
[4]張盛富,戴明鳳,“無線通信之射頻被動電路設計”,全華科技,
1998,pp.3.41-3.42.
[5]謝金明,“高速數位電路設計暨雜訊防制技術”,全華科技圖書股
份有限公司,初版三刷,民國92年7月,pp4.11-4.14,pp.4.47-4.49。
[6]Terry Edwards, “Foundations for Microstrip Circuit Design”,John
Wiley & Sons Ltd,2nd Edition,1995.
[7]馮輝舜,“高頻電子連接器之電磁模擬與特性量測”,國立成
功大學機械工程學系,中華民國91年7月,pp.2.13.
[8]Clayton R.Paul, “Introduction to Electromagnetic Compatibility” ,
John Wiley & Sons Inc.,New York,1992,pp.491-544.
[9]Kai Chang, “ RF and Microwave Wireless Systems” ,John Wiley
&Sons,2000, pp.39-41.
[10]Howard W.Johnson,Martin Graham, “High-Speed Digital
Design : A Handbook of Black Magic”,1993,pp.189-192.
[11]Mark I. Montrose, “ Printed Circuit Boards Design Techniques for
EMC, Compliance”, John Wiley ,New York,2000,pp.137-141.
[12]LI zhi,Wang Qiang, SHI Changsheng, “Application of Guard
Traces with Vias in the PCB Layout”,3rd International
Symposium on Electromagnetic Compatibility, October 2002,pp.771- 774.
[13]D.Scott Britt , David M. Hockanson , Fei Sha ,James L.
Drewniak ,Todd H. Hubing , and Thomas P.Van Doren, “Effects of
Gapped Ground planes and Guard Traces on Radiated EMI”, IEEE
International Symposium on Electromagnetic Compatibility, 1997,
pp.162 -164.
[14]D.k.Cheng,"Field and Wave Electromagnetics" April 1992 ,second
edition, pp.595.
[15]Todd H.Hubing , James L.Drewniak , Thomas P.Van Doren and
David M.Hockanson , “Power Bus Decupling on Multilayer
Printed circuit Boards”, IEEE Transactions on
Electromagnetic Compatibility, Vol.37 Issue: 2, May 1995,pp155- 166.
[16]Brian Young, “Digital Signal Integrity: Modeling and Simulation
with Interconnects and Packages” , 2001 , pp.414-pp.415,pp.146-
147.
[17]Sheng-Mou Lin , Ruey-Beei Wu , “Time Domain Simulation for
Ground Bounce” , Dept.of Electrical Engineering and Graduate
Institute of Communication Engineering , National Taiwan
University , Taipei , Taiwan , R.O.C , June 2001. pp.22.
[18]Jin Zhao,Qing-lun Chen, “A New Methodology for Simultaneous
Switching Noise Simulation”, IEEE Conferce on Electronic
Components and Technology Conference ,2000,pp.155-158.
[19]Chi-Te Chen,Jin Zhao,Qinglun Chen, “A simulation Study of
Simultaneous Switching Noise”,Electronic Components and
Technology Conference, April 2001.
[20]Information on Speed software of SIGRITY can be found at
www.sigrity.com .
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
系統版面圖檔 系統版面圖檔