臺灣博碩士論文加值系統

在多層化的IC元件製作上，隨著尺寸的逐年縮小，全域性平坦化愈趨重要。化學機械研磨是目前唯一可達全域性平坦化的技術。在本論文中，將自行合成新材質的 (PS@CeO2) 研磨複合粒子，並將其在化學機械研磨上的應用結果來做探討。
以氧化鈰為研磨砥粒的漿料比其他傳統的研磨液具有高移除率及高選擇比的特性。但是其形狀因為比較不具規則性，所以在研磨時易造成刮傷。而有機顆粒因其形狀呈球型，而且粒徑分布相當集中、分散性佳等特性，所以在化學機械研磨上為另一種新的應用。在實驗上，將聚苯乙烯顆粒作為複合粒子的核心，氧化鈰作為殼層，利用逐層自組裝法(LBL)來製作殼核型複合粒子，逐層自組裝法(LBL)是利用粒子表面電位的特性來合成複合物。產物則是利用粒徑電位分析儀、 XRD 、 TEM 來做分析。
最後利用氫氧化鈉水溶液來調整研磨液的pH值，及改變固含量來做化學機械研磨的程序。由AFM結果發現，我們利用(PS@CeO2) 研磨複合粒子可以得到不錯的表面平坦化。另一方面，增加固含量對於移除率也會造成影響，對Oxide及Nitride的選擇比為四比一。此結果對於殼核型複合奈米顆粒在CMP應用上，會有著相當大的發展空間。

The progressively decreasing feature size increases the need for global surface planarization of the various thin film layers that constitute the integrated circuit (IC). Chemical Mechanical Polishing (CMP) is the only method achieveing the global planarization requirement. The purpose for this study is to synthesize a new abrasive (PS@CeO2) for Chemical Mechanical Polishing (CMP).
The CMP slurry based on Cerium dioxide has higher removal rate, higher selectivity than other kinds of slurry, but it’s irregular form causes the scratch for the wafer during polishing. The organic particles are new materials which are spherical with a narrow size distribution and good disperion. Polystyrene was used as the core of composite and Cerium oxide (CeO2) was the shell. Core–shell composite has been synthesized with layer-by-layer (LBL) technique. LBL technique was an effective method to synthesize the composite according to their charge character of the particles’ surface. The products were analyzed by Zetasizer Nano particle analyzer series, X-ray diffraction (XRD) and transmission electron microscopy (TEM).
We used NaOH solution to adjust the pH of slurry and prepared different solid content for the Oxide CMP process. The results showed that good surface planerization was obtained by using Core–shell composite (PS@CeO2) in CMP. The more solid content in the slurry increased the removal rates. The Selectivity ratio is 4:1 between Oxide and Nitride CMP. The findings are significant for the nano-particles in Core–shell composite application.

總目錄
中文摘要………………………………………………………………..Ⅰ
英文摘要………………………………………………………………..Ⅱ
總目錄………………………………………………………………......Ⅲ
圖目錄……………………………………………………………..…....Ⅵ
表目錄…………………………………………………………………..Ⅸ


第一章 序論
1-1 前言…………………………………………………………..1
1-2 化學機械研磨技術的原理…………………………………..2
1-3 平坦化製程介紹……………………………………………..4
1-4 研磨液的分類……………………………………………..…8
1-5 研究目的…………………………………………………….12
第二章 基本理論
2-1 乳化聚合…………………………………………………….14
2-1-1 界面活性劑性質………………………………………..14
2-1-2 乳液的臨界微胞濃度…………………………………..16
2-1-3 微胞的形成……………………………………………..18
2-1-4 起始劑對乳化聚合的影響……………………………..20
2-1-5 乳化聚合反應三階段理論……………………………..20
2-1-6 界面活性劑的加溶作用………………………………..22
2-2 核-殼型(core-shell)複合奈米粒子的製備………………..24
2-2-1 高分子被覆……………………………………………..24
2-2-2 無機物被覆……………………………………………..26
2-2-3 生物巨分子被覆………………………………………..27
第三章 實驗部分
3-1 漿料合成實驗部分………………………………………….31
3-1-1 藥品及儀器設備………………………………………..31
3-1-2 核心粒子聚合流程及步驟……………………………..34
3-1-3 核-殼型複合粒子反應流程及步驟…………………....36
3-1-4 固含量的計算…………………………………………..38
3-1-5 粒徑分析量測原理……………………………………..38
3-1-6 Zeta Potential量測原理…………………………….40
3-2 研磨實驗部分……………………………………………….42
3-2-1 樣品製備…………………………………………...…...42
3-2-2 化學機械研磨的程序…………………………………..43
3-2-3 CMP研磨後的分析…………………………………….48
3-2-4 CMP移除率…………………………………………….49
3-2-5 砥粒特性分析…………………………………………..49
第四章 結果及討論
4-1 核心粒子聚合實驗部分…………………………………….51
4-1-1 改變SDS濃度對粒徑的影響………………………….52
4-1-2 改變單體克數對粒徑的影響…………………………..52
4-1-3 改變起始劑（KPS）濃度對粒徑的影響……………......53
4-1-4 PS乳液中的粒徑分佈………………………………….55
4-2 核-殼型粒子合成實驗部分………………………………...58
4-2-1 溶液中自組裝法………………………………………..58
4-2-2 TEM的粒徑影像…………………………………….59
4-2-3 核-殼粒子Zeta分析………………………………….61
4-2-4 XRD分析……………………………………………….62
4-3 研磨實驗部分……………………………………………….63
4-3-1 固定pH=9.8(Oxide CMP)改變固含量………………...64
4-3-2 固定pH=11.0(Oxide CMP)改變固含量……………….65
4-3-3 固定pH=10.0(Nitride CMP)改變固含量……………...65
4-3-4 pH=6.7對Oxide和Nitride的選擇比………………...66
4-3-5 AFM表面形貌分析結果………………………………67
第五章 結論…………………………………………………………..70
參考文獻………………………………………………………………..72
誌謝……………………………………………………………………..76

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