臺灣博碩士論文加值系統

本研究主要探討狹長型覆晶在熱壓合製程中，其凸塊的應力分佈。在熱壓合的過程中，晶片除了受到壓頭往下的壓力外，亦需承受熱負荷而會有熱應力的產生，使得其結構的應力變化更為複雜。晶片上凸塊不均勻的應力分佈會產生不均勻的變形或殘留應力，而影響晶片上的凸塊的導電性。本研究利用有限元素軟體ABAQUS作在熱壓合的過程中凸塊的應力分佈的分析，探討相關參數的變更對凸塊的應力分佈的效應。
本研究結果顯示，在原有尺寸晶片下，輸入端凸塊的應力值會大於輸出端凸塊的應力。若改變輸入端凸塊與輸出端凸塊總面積比例為一樣時，則兩者的應力值差異會減至最小。而改變側邊凸塊行數及晶片厚度之效應則不明顯。

This research is aimed to investigate the stress distribution in the bumps on a narrow-long flip chip under thermal bonding process. In thermal bonding process, the flip chip bears not only a downward pressure from the thermal head, but also a thermal loading via heat transfer. This causes the stress variation in the bumps more complex. The non-uniform stress distribution in the bumps on the chip will bring about a non-uniform deformation and/or a residual stress distribution, and thus affects the electric conductivity of the bumps on the chip. This research analyzes the stress distribution in the bumps on a narrow-long flip chip under thermal bonding process by ABAQUS, and investigates the effects of variation of parameters on the stress distribution in the bumps.
It is shown from the computed results that the stress value of input-sided bumps is larger than that of output-sided ones. If the total area of input-sided bumps equals to that of output-sided bumps, then the stress difference in between can be reduced to the smallest. The effects of changing the column numbers of lateral sided bumps or the thickness of chip on the stress distribution are not obvious.

誌謝 I
摘 要 II
ABSTRACT III
目 錄 IV
圖 目 錄 V
表 目 錄 IX
第一章 緒論 1
1-1前言 1
1-2文獻回顧 10
1-3研究動機與目的 11
1-4論文內容簡介 11
第二章 製程介紹與基本理論 13
2-1覆晶技術(FLIP CHIP TECHNOLOGY) 13
2-1-1 TCP (TAPE CARRIER PACKAGE) 14
2-1-2 COG (CHIP ON GLASS) 16
2-1-3 COF (CHIP ON FILM) 20
2-2相關理論 21
2-2-1溫度場分析 22
2-2-2熱應力場分析 24
第三章 有限元素模擬分析 27
3-1電腦輔助工程與有限元素法 27
3-1-1電腦輔助工程(CAE) 27
3-1-2有限元素法(FEM) 28
3-2電腦模擬分析 29
3-2-1 ABAQUS模組 30
3-2-2 ABAQUS分析流程 31
3-3材料性質與模型建立 32
3-3-1模型建立 34
3-4 ABAQUS求解及元素選擇 36
3-4-1隱式(STANDARD)及顯式(EXPLICIT)求解特性 37
3-4-2分析元素之選擇 37
3-5參數改變設定 41
3-5-1 輸入端與輸出端凸塊總面積比例改變設定 41
3-5-2 側邊凸塊行數比較影響設定 42
3-5-3 IC晶片厚度改變設定 43
第四章 結果與討論 45
4-1依晶片原始尺寸模型所作之分析結果 45
4-1-1溫度變化結果 46
4-1-2應力分析結果 48
4-2輸入端與輸出端凸塊總面積比例改變效應 53
4-3側邊凸塊行數比較影響效應 56
4-4 IC晶片厚度改變效應 59
第五章 結論與未來展望 63
參考文獻 64

[1]楊省樞，“覆晶新組裝技術”，工業材料163期，pp. 162-167，2000。
[2]鐘文仁，陳佑任，IC封裝製程與CAE應用，全華科技圖書，2004。
[3]John H. Lau, “Thermal Stress and Strain in Microelectronics Packaging”, Van Nostrand Reinhold, New York, 1993.
[4]C. P. Yeh, W. X. Zhou, and K. Wyatt, “Parametric Finite Element Analysis of Flip Chip Reliability,” The International Society for Hybrid Microelectronics, Vol.19, No.2, pp.120-127,1996
[5]H.L.J Pang, T.I Tan, G.Y. Lim, and C.L. Wong, “Thermal Stress Analysis of Direct Chip Attach Electronic Packaging Assembly”, IEEE/CPMT Electronic Packaging Technology Conference, pp170-176, 1997
[6]Scott F. Popelar, “Investigation into the fracture of silicon die used in flip chip applications”, Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 41~48, 1998
[7]Q. Yao and J. Qu, “Three-Dimension Versus Two-Dimension Finite Element Modeling of Flip-Chip Packages,” Transactions of the ASME, Journal of Electronic Packaging, Vol.121,pp.196~201, 1999.
[8]袁俊誠，覆晶構裝改變凸塊氣狀、大小及排列對強度及翹曲的影響，國立台灣大學機械工程研究所碩士論文，2000。
[9]朱文豪，不同型態凸佈局對覆晶構裝平面度、熱傳及疲勞壽命之影響，國立台灣大學機械工程研究所碩士論文，2001。
[10]陳守龍，晶片強度覆晶構裝結構模擬與分析，國立台灣大學應用力學研究所碩士論文，2001。
[11]Shuidi Wang, Tao Hu, Jian Cai, and Songliang Jia, “Design And Control Of Horizontal Extension For Bumping”, ICEPT, IEEE, pp.105~109, 2003.
[12]Hsien-Chie Cheng, Cheng-Lin Ho, Kuo-Ning Chiang, and Shyh-Ming Chang, ”Process-Dependent Contact Characteristics of NCA Assemblies”, IEEE Transactions on Components and Packaging Technologies, Vol.27, No.2, pp398-410, 2004.
[13]Frank P. Incropera, David P. Dewitt, “Fundamentals of Heat and Mass Transfer”, Fifth Edition, John Wiley & Sons, Inc. 2002.
[14]R. B. Hetnarski, “Thermal Stresses I”, Elsevier Science Publishing Company , Inc., 1986.
[15]W.F. Chen ＆ D.J. Hen , Plasticity for Structural Engineers, Gau Lih Book Co. LTD., 1995
[16]K. J. Bathe, Finite Element Procedure, Prentice Hall, Inc. ,1996.
[17]愛發股份有限公司，ABAQUS實務入門引導，全華科技圖書，2005。