臺灣博碩士論文加值系統

表面黏著技術(Surface Mount Technology, SMT)是製成印刷電路板所採用之技術，其目的是將表面黏著元件(Surface Mount Component, SMC)置放在印有錫膏的印刷電路板上，使元件緊密地黏著於電路板上，組成一個完整的電路。表面黏著技術製程的瓶頸在於自動取置機作業上，元件之置放路徑必須考量所有設備動作之影響，才可以達到生產作業平衡與縮短作業時間。目前業界在規劃印刷電路板元件置放排序時，大多採經驗法則或依循歷史資料；學術上也有許多採用各種方法的論述，但是對於採用何種方法較佳仍無定論。本研究針對松下MSH-3高速機，將元件置放作業區分為「印刷電路板上各元件置放作業順序」以及「置料槽架上各元件置料槽位址的指派」兩部份，並分析其作業特性，將作業延遲之產生定義為「元件取置作業延遲」與「設備轉動移動作業延遲」兩部份，建構最小延遲等待時間之元件指派模式。而為得出較佳之整體置放順序組合，乃進一步發展求解策略，提出一簡單且能被業界所接受之元件指派方法與策略，經測試後本研究所展求解策略對個案之改善率高達60%，顯示確能有效提昇現行作業效率。

The surface mount technology (SMT) is the technology for making the printed circuit board to mount the surface mount component on the printed circuit board and composes a complete circuit finally. The automatically mount machine operation is the bottleneck of surface mount technology in general. To balance the production operation and reduce operation time, it must consider the interaction influence between all equipments when setting the component placement sequence. The component sequence is maped out by following the past experience or historical material in general. This research analyzes the operation characteristics focus on the base of MSH-3 high speed mount machine. Categorizing the component placement operation as “component placement sequence on printed circuit board” and “component material position assignment on material trough”, this research construct a minimum waiting delay time model for component placement. For solving better component placement sequence promptly and simply, this research develops some strategies to find approximate solution. In view of the improvement rate, there is near 60% saving on test case, it reveals that the solving strategies of this research can promote the component placement operation efficiency.

第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 3
1.3 研究範圍與對象 4
1.4 研究方法 6
1.5 研究內容與流程 7
第二章 文獻回顧與評析 9
2.1 取置機作業文獻探討 9
2.1.1 印刷電路板之置件路徑最佳化 10
2.1.2 印刷電路板與置料槽架位置同時指派 11
2.1.3 其他 12
2.2 元件置放問題之模式 13
2.3 求解之演算法 14
2.4 演算法簡介 16
2.5 小結 19
第三章 問題描述與模式建立 20
3.1 設備描述 20
3.1.1 取置機設備說明 23
3.1.2 取置機運作方式說明 26
3.2 運作時間分析 27
3.2.1 作業時間分析 27
3.2.2 作業時間計算 30
3.3 問題描述 32
3.4 模式建立 33
3.4.1 資料需求 33
3.4.2 建立數學模式 34
第四章 求解方法 38
4.1 求解步驟 39
4.2 求解策略 40
4.3 小結 48
第五章 結果分析與比較 49
5.1 實例測試 49
5.2 結果分析 56
5.3 小結 59
第六章 結論與建議 60
6.1 結論 60
6.2 建議 62
參考文獻 63

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