(3.235.108.188) 您好!臺灣時間:2021/02/28 00:45
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:王靖欣
研究生(外文):C. H. Wang
論文名稱:應用六標準差之MAIC流程改善改善TFT-LCD面板之製程品質
論文名稱(外文):Appling MAIC procedure of Six Sigma to enhance process quality of TFT-LCD panels
指導教授:陳坤盛陳坤盛引用關係
指導教授(外文):K. S. Chen
學位類別:碩士
校院名稱:國立勤益技術學院
系所名稱:生產系統工程與管理研究所
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2005
畢業學年度:93
語文別:中文
論文頁數:25
中文關鍵詞:TFT-LCD面板製程六標準差製程能力弱度指標(Cpp)管制圖
外文關鍵詞:The process of LCD panelsSix Sigmaprocess incapability indexcontrol chart.
相關次數:
  • 被引用被引用:1
  • 點閱點閱:153
  • 評分評分:系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:2
顯示器(Display)是資訊科技時代人們傳遞訊息與相互溝通的重要界面,而顯示器的發展逐漸由大體積的的陰極射線管(CRT),轉型為較為輕薄的液晶平面顯示器(LCD),其中TFT-LCD具有輕、薄、體積小及低耗電量的優點,所以廣泛的應用於日常生活的電子商品上,因此TFT-LCD面板的需求日益增加;而隨著台灣面板產業的產品生命週期逐漸趨於成熟,加上面對韓國與日本的激烈競爭下,持續降低成本是當前各面板廠商全力追求的課題,因此若是能提升TFT-LCD面板產品品質及良率,就能減少不良品與成本的浪費。所以本文將針對TFT-LCD面板探討其製造流程整理出5個重要的品質特性製程,並利用六標準差和製程能力弱度指標(Cpp)之評估模式以及運用工業統計的方法,找出影響TFT-LCD面板品質不佳之重要品質特性製程,同時分析造成品質不佳的原因,再以工業實驗設計探討最佳的製程水準並以管制圖監控製程品質,希望藉由六標準差之MAIC流程持續改善TFT-LCD面板的製程品質,以協助業者提升TFT-LCD面板產品品質,進而達到6標準差品質水準的目標。
The display is an important interface of sending message and communicating each other for people in the information technology age. The display has gradually developed from cathode ray tubes (CRTs) to liquid crystal displays (LCDs). Among them, thin film transistor - liquid crystal display (TFT-LCD) possesses some real advantages. It is thinner, smaller and lighter, and draws much less power than other display technologies. Hence, TFT-LCD panels are widely applied in daily electronic products, and the capability requirement of TFT-LCD panels is gradually increasing. Under product life cycle of TFT-LCD panels industry is gradually getting into mature period, meanwhile, Taiwan’s firms severely competes with Korea and Japan, continuous cost-down is an all-out pursuing topic for Taiwan’s panel firms currently. Suppose the quality and yield of TFT-LCD panels can be effectively enhanced, the unqualified rate and cost of TFT-LCD panels will be reduced. In this study, the manufacturing processes of TFT-LCD panels are discussed, and then five important quality characteristics of TFT-LCD process are summarized and selected. Moreover, applying the evaluating model of Six Sigma and process incapability index Cpp, and performing industrial statistic methods to find the key quality characteristics that making the quality of TFT-LCD panels bad. Meanwhile, the important factors that causing the process quality characteristics of TFT-LCD panels poor are analyzed and investigated. Next, the design of industrial experiment is used to find the corresponding best process quality characteristic level out, and then control charts are employed to monitor/control the process quality for TFT-LCD panels. The process quality of TFT-LCD panels can be continuously improved by the MAIC process of Six Sigma, and it can be utilize to assist the firms of TFT-LCD panels in the enhancement of process performance and quality. Finally, the target of 6-Sigma quality level can be reached.
第一章 前言 1
1.1研究背景與動機 1
1.2研究目的與方法 3
1.3研究流程與架構 6
第二章 薄膜型液晶面板之品質評估模式 8
第三章 六標準差之衡量 13
第四章 TFT-LCD面板製程分析、改善與控制 17
4.1分析 17
4.2改善 18
4.3 控制 19
第五章 結論 22
參考文獻 23
中文參考文獻 23
英文參考文獻 23
英文參考文獻
9.Bothe, D. R., 1992, “A capability study for an entire product”. ASQC Quality Congress Transactions, 46, 172–178.
10.Boyles, R. A., 1994, “Process capability with asymmetric tolerances”. Communications in Statistics: Computation and Simulation, 23, 615-643.
11.Chan, L. K., Cheng, S. W., and Spiring, F. A., 1988, “A new measure of process capability: Cpm”. Journal of Quality Technology, 20(3), 162-175.
12.Chen, K. S., 1998. “Estimatio of the process incapability index”. Communications in Statistics-Theory and methods, 27, 1263-1274.
13.Chen, K. S., Pearn, W. L., and Lin. P. C., 1999, “A new generalization of Cpm for processes with asymmetric tolerances”. International Journal of Quality & safety Engineering, 6(4), 383-398.
14.Chen, K. S., Huang, M. L. and Li, R. K., 2001, “Process Capability Analysis for an Entire Product”. International Journal of Production Research, 39 (17), 4077-4087.
15.Chen, K. S., Huang, M. L., and Hung, Y. H., 2002, “Integrated process capability analysis with an application in backlight module”. Microelectronics Reliability, 42, 2009-2014.
16.Chen, K. S., Pearn, W. L., and Lin, P. C., 2003, “Capability Measures for Processes with Multiple Characteristics”. Journal of Quality and Reliability Engineering International, 19, 101–110.
17.Chen, J. P., and Chen, K. S., 2004, “Comparison of Two Process Capabilities Using Cpm”. Journal of Quality Technology, 36(3), 329-335.
18.Cheng, S. W., 1994-1995, “Practical Implementation of The process Capability Indices”. Quality Engineering, 7, 239-259.
19.Goh, T. N., 2002, “A Strategic Assessment of Six Sigma”. Journal of Quality and Reliability Engineering International, 18, 403-410.
20.Greenwich, M., and Jahr-Schaffrath, B. L., 1995, “A process incapability index”. International Journal of Quality & Reliability Management, 12, 58-71.
21.Ham, C. H., and Lee, Y. H., 2002, “Intelligent Integrated Plant Operation System for Six Sigma”. Annual Reviews in Control; 26, 27-43.
22.Hoerl, R. W., 2001, “Six Sigma Black Belts: What Do They Need to Know?”. Journal of Quality Technology, 33(4), 391-407.
23.Huang, M. L., and Chen, K. S., Hung, Y. H., 2002, “Integrated Process Capability Analysis with an Application in Backlight”. Microelectronics & Reliability, 42, 2009-2014.
24.Huang, M. L., and Chen, K. S., 2003, “Process Capability Analysis for Multi Process Product With bilateral specifications”. International Journal of Advance Manufacturing Technology, 21, 801-806.
25.Kane, V. E., 1986, “Process capability indices”. Journal of Quality Technology, 18(1), 41-52.
26.Kevin Linderman., Roger G. Schroeder., Srilata Zaheer.,and Adrian S. Choo., 2003, “Six Sigma: a goal-theoretic perspective”. Journal of Operations Management, 21, 193-203.
27.Michael, 2002,.Lean Six Sigma, McGraw-Hill, New York
28.Montgomery, D. C., 2001, Introduction to statistical quality control.4th ed, NY:John Wiley & Sons Inc, New York.
29.Pande, P. S., Neuman, R. P., Gavanagh, R. R., 2000, The Six Sigma Way, McGraw-Hill, New York.
30.Pearn, W. L., and Chen, K. S., 1992, “New generalization of the process capability index Cpk”. Journal of applied Statistics, 25(6), pp.801-810.
31.Pearn, W. L., and Chen, K. S., 1997, “Capability indices for non-normal distributions with an appicatuin in electrolytic capacitor manufacturing”. Quality & Reliability Engineering International, 37, 1853-1858.
32.Pearn, W. L., Chen, K. L., and Chen, K. S., 2002, “A Practical Implementation of the Incapability Index Cpp”. International Journal of Industrial Engineering, 9, 372-383.
33.Pearson, E. S., and H.O. Hartley eds, 1966, Biometrika Tables for Statisticians 3rd ed., by permission of the Biometrika Trustees.
34.Peter et al.,2000, The Six Sigma Way, McGraw-Hill, New York.
35.Syrcos, G.. P., 2003, “Die casting process optimization using Taguchi method”. Journal of Materials Processing Technology, 135, 68-74.
36.Wyper, Bill and Harrison, Alan, 2000, “Deployment of Six Sigma methodology in human resource function: a case study”. Total Quality Management, 11, NOS4&5, 720-727.
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
系統版面圖檔 系統版面圖檔