臺灣博碩士論文加值系統

　　本文考量製程中降溫殘留應變影響下，含硬膜之可撓性薄板受到力偶彎曲之彈性力學分析，並應用於可撓性有機發光二極體及無機鍍陶瓷膜硬膜層厚度破裂條件之討論。

　　在分析中隨薄膜厚度的改變，硬膜與軟基板的Stiffness per unit area比值則為0.03∼3；而在軟膜與硬基板的Stiffness per unit area比值介於 ∼ 。硬膜的勁度隨膜厚度的增加明顯升高，對整體結構應變及破壞均造成相當大的影響；而軟膜的影響與硬基板相比較顯得微不足道。

　　對FOLED(可撓性有機發光二極體)的分析中發現，隨ITO薄膜沈積厚度減少，結構受彎曲的整體應變值降低；且FOLED中Barrier Layer材料亦為重要的影響因素，建議選用楊氏模數較高的水氧隔離層來增加結構勁度以降低ITO薄膜應變，使元件可靠度及使用壽命提高。

　　而在陶瓷多層膜的分析中，可得多氧化矽薄膜在不同使用環境的彎曲曲率半徑條件下，所能夠蒸鍍的最大厚度，使陶瓷膜在使用上避免產生裂紋以達到良好的阻隔效果；並可由對陶瓷多層薄膜分析結果，提供設計者最佳的緩衝層沈積厚度建議。

　This study consider the influence to the residual strain affected cooling process, the elastic mechanical analysis of hard film on flexible thick substrate inducing externally bending force, then apply the discussion of failure criteria on Flexible Organic Light-Emitting Diode and Inorganic ceramic films about their hard film thickness.

　As the change of film thickness in analysing, stiffness per unit area ratio of hard film and soft substrate is 0.03~3, and stiffness per unit area ratio of soft film and hard substrate is ~ . Stiffness of the hard film obviously rises with increase of the film thickness, and it causes sizable influence to strain and damage. But influence of soft film seems insignificant to compare with hard substrate.

　From the analysis of FOLED(Flexible Organic Light-Emitting Diode),one can see a tendency that the net strain distribution of bending structures was smaller for specimens with thinner ITO coating thickness, and in FOLED device ,barrier layer is also a critical factor for film net strain. Suggesting that use of moisture and oxygen barrier layer with high Young’s modulus to increase structure stiffness and then reduce ITO film strain, it can improve the reliability and life of devices.

　In the analysis of the multi-layer film of ceramics, we can obtain the largest thickness of evaporated SiOx under different bending radius of curvature, let the ceramic films avoid producing the crack in using. And from the analytic result of the ceramics multi-layer film , offer the suggestion of best buffer layers thickness for designer.

目 錄
摘要 Ⅰ
英文摘要 Ⅱ
誌謝 Ⅲ
目錄 Ⅳ
表目錄 Ⅶ
圖目錄 Ⅷ
符號說明 ⅩⅡ
第一章 緒論 1
1-1 前言 1
1-2 研究動機及目的 2
1-3 文獻回顧 3
1-4 章節提要 4
第二章 可撓性基板及其硬膜簡介 6
2-1 有機發光二極體 6
2-1-1 OLED簡介及發展優勢 6
2-1-2 FOLED結構 7
2-2 多氧化矽薄膜結構 8
2-3 可撓性基板 9
2-3-1 高分子基板 9
2-3-2 塑膠基板的缺點 11
2-3-3 含硬膜之可撓性基板受撓曲的力學問題 12
第三章 含硬膜之可撓性薄板力學理論分析 15
3-1 薄板彎曲分析的四種模式 15
3-2 2層結構的彈性力學分析 17
3-2-1 製程中降溫的熱膨脹效應 18
3-2-2 施加力偶的效應 23
3-2-3 薄膜及基板的應力及應變分佈 27
3-3 3層結構的彈性力學分析 29
3-3-1 製程中降溫的熱膨脹效應 30
3-3-2 施加力偶的效應 33
3-3-3 薄膜、緩衝層及基板的應力及應變分佈 37
第四章 FOLED多層薄板的實驗及結果分析 44
4-1 FOLED多層薄板實驗 44
4-1-1 FOLED結構 44
4-1-2 Bending Test和Fragmentation Test 45
4-1-3 實驗結果 46
4-2 3層結構力學理論分析結果 46
4-3 Barrier Layer選擇條件 49
4-3-1 層間剪應力 49
4-3-2 楊氏模數的影響 50
4-3-3 隔離層厚度的影響 51
第五章 多氧化矽多層薄板的實驗及結果分析 66
5-1 多氧化矽薄膜實驗 66
5-2 力學理論分析結果 67
5-2-1 2層結構 68
5-2-2 3層結構 69
5-3 Buffer Layer選擇條件 71
5-3-1 層間剪應力 71
5-3-2 楊氏模數的影響 72
5-3-3 緩衝層厚度的影響 73
第六章 結論 88
參考文獻 90

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