[1]Diebold, A.C. “Overview of metrology requirements based on the 1994National Technology Roadmap for semiconductor,” Advanced Semiconductor Manufacturing Conference and Workshop, 1995.ASMC 95 Proceedings. IEEE/SEMI 1995. 13-15 Nov. 1995 Page(s):50-60.
[2]Stanley, K.J.; Stanley, T.D.; Maia, J. “Realizing 300 mm fab productivity improvements through integrated metrology,” Simulation Conference, 2002. Proceedings of the Winter, Volume 2, 8-11 Dec. 2002 Page(s): 1369 -1376 vol.2.
[3]TSMC, “AEC/APC Challenges-Today and in the Future,” 2004.
[4]Y.-C. Su, F.-T. Cheng, Y.-C. Lin, M.-H. Hung, R.-C. Lin, and H.C. Huang “Intelligent Prognostics System Design and Implementation1,” 2004.
[5]林彥璋 「一個適用於半導體業網路式診斷應用之介面的通用型嵌入式裝置」,國立成功大學製造工程研究所碩士論文,2004.[6]Y.-C. Su, F.-T. Cheng, G.-W. Huang, M.-H. Hung, and T. Yang, "A Quality Prognostics Scheme for Semiconductor and TFT-LCD Manufacturing Processes," in Proc. of The 30th Annual Conference of the IEEE Industrial Electronics Society (IECON 2004), Busan, Korea, November 2004.
[7]P.-F. Tsai, J.-Z. Chu, S.-S. Jang, S.-S. Shieh. “Developing a robust model predictive control architecture through regional knowledge analysis of artificial neural networks,” Journal of Process Control, Vol.13 no.5, 2003.
[8]Zurada J.M. “Introduction to Artificial Neural Systems,” St. Paul, MN: West Publishing, 1992.
[9]Web site of the Center for Intelligent Maintenance Systems (IMS). http://www.imscenter.net
[10]J. Lee, “E-Manufacturing/E-Business: Transformation, Needs, Issues, and Collaborative Research Opportunities,” 2001. http://www.uwm.edu/CEAS/ims
[11]M. Koc and J. Lee, “A System Framework for Next-Generation E-Maintenance System,” 2001.
[12]NSF Workshop, NSF I/UCR Center, Oct. 1-2,2001.
[13]黃國偉 「半導體機台網路式預防保養功能架構之設計與實作」,國立成功大學製造工程研究所碩士論文,2003.[14]李柏甫 「TFT-LCD濺鍍製程之智慧型診斷系統發展」,國立成功大學製造工程研究所碩士論文,2004.[15]S.-F. Lee, and C.-J. Spanos, “Prediction of wafer state after plasma processing using real-time tool data,” IEEE Trans. Semiconductor Manufacturing, Vol. 8, pp. 252-261, Aug 1995.
[16]B. Kim and K. Kim, “Prediction of profile surface roughness in CHF3 /CF4 plasma using neural network,” Appl. Surf. Sci. 222(2004)17-22.
[17]B. Kim, D.-W. Lee, K.-Y. Park, S.-R. Choi and S. Choi, “Prediction of plasma etching using a randomized generalized regression neural network,” Vacuum 76(2004)37-43.
[18]顧尚芳 「生產系統中利用製程不良率評估設備預防維護之研究」,中原大學工業工程學系碩士論文,2003.[19]Benyong Zhang and Gary S. May “Towards Real-Time Fault Identification in Plasma Etching Using Neural Network,” IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 1998.
[20]Tsung-Nan Tsai, Shih-Yaug Liu, and Taho Yang, “A SMT Reflow Soldering Process Diagnosis System Using Neurofuzzy Approach,” International Journal of Fuzzy Systems, Vol.3, No.4, Dec. 2001.
[21]Huang S, and Zhang H., “Neural Network in Manufacturing: A Survey,” IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp.177-190, 1993.
[22]楊博文 「鉻鉬鋼鑽孔擴孔量預測模式之探討」,國立屏東科技大學機械工程學碩士論文,2002.[23]Byungwhan Kim, and Gary S. May, “An Optimal Neural Network Process Model for Plasma Etching,” IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 7, NO. 1, FEBRUARY 1994.
[24]Hogg and Tanis, “Probability and Statistical Inference,” Prentice Hall, NJ:07458, 1997.
[25]W.-J. Conover, “Practical Nonparametric Statistics,” New York, Wiley, 1980.
[26]Anderson, T.W, “An Introduction to Multivariate Statistical Methods,” 1984.
[27]陳業統 「多變量製程能力指標在評估環境風險上之研究」,國立成功大學統計學系碩士論文,2003.[28]Y. L. Huang, T. F. Edgar, D. M. Himmmelblau, and I. Trachtenberg, “Constructing a reliable neural network model for a plasma etching process using limited experimental data,” IEEE Trans. Semicond. Manuf., Vol. 3, pp. 333-344, Aug 1994.
[29]F. Nadi, A. M. Agogino, and D. A. Hodges, “Use of influence diagram and neural networks in modeling semiconductor manufacturing processes,” IEEE Trans. Semicond. Manuf., Vol. 4, no. 1, Feb 1991.
[30]M. T. Mocella, J. A. Bondur, and T. R. Turner, “Etch process characterization using neural network methodology: A case study,” in SPIE proc. Process Module Metrology, Control, and Clustering, Vol. 1594, 1992, pp. 232-242.
[31]C. D. Himmel, and G. S. May, “Advantages of plasma etch modeling using neural networks over statistical techniques,” IEEE Trans. Semicond. Manuf., Vol. 6, pp. 103-111, May 1993.
[32]葉怡成 「應用類神經網路」,儒林圖書公司,1997.
[33]葉怡成 「類神經網路模式應用與實作」,儒林圖書公司,2003.
[34]張斐章,張麗秋,黃浩倫 「類神經網路理論與實務」,東華書局,2003.
[35]Simon Haykin, “Neural Networks, A Comprehensive Foundation,” Prentice Hall, NJ:07458, 1999.
[36]Grady Booch, James Rumbaugh, Ivar Jacobson, “The Unified Modeling Language User Guide,” ADDISON-WESLEY, April 2000.
[37]Gary B. Shelly, Thomas J. Cashman, Harry J. Rosenblatt, “Systems Analysis and Design,” Thomson Learning, 2001
[38]ISMI, “Data Quality Proof of Concept Test Method,” 2005.
[39]Ming Lu, S. M. AbouRizk and U. H. Hermann, “Sensitivity Analysis Of Neural Networks In Spool Fabrication Productivity Studies,” 2002.
[40]Honh Xiao, “Introduction to Semiconductor Manufacturing Technilogy,” PRENTICE HALL, 2001
[41]Borland C++ Bulider 6.0, Borland Corporation. http://www.borland.com/cbuilderx
[42]Matlab 7.0, The MathWork Corporation. http://www.mathworks.com/
[43]陳順宇 「多變量分析」,二版,華泰書局,2000.
[44]陳順宇 「迴歸分析」,三版,華泰書局,2000.
[45]羅華強 「類神經網路,MATLAB的應用」,清蔚科技,2001.
[46]張智星 「MATLAB程式設計與應用」,清蔚科技,2000.