1.D. M. Allen,A. Lecheheb,Micro electro-doscharge machining of ink jet nozzles : optimum selection of material and machining parameters , Journal of Materials Processing Technology,58,pp53-66,1996.
2.T, Masuzawa,M. Fujino,K. Kobayashi and T.Suzuki,Wire Electro-Discharge Grinding for Micro-Machining,Annals of the CIRP,34,1,pp.431-434,1985.
3.W. Ehrfeld and H. Lehr,Deep X-Ray Lithography for the production of three-dimensional microstructures from metals,polymers and ceramics,Radiat .Phys.Chem Vol.45 No.3 pp349-365,1995.
4.K. Kagaya,Y. Oishi,K.Yada,Micro-electrodischarge machining using water as a working Fluid-I: Micro-hole Drilling,Precision Engineering,8,3,pp.156-162.,1986.
5.Seong.S.Choi,Jung,D.W.Kim,M.A.Yakshin,J.Y.Park,Y.Kuk,Frabrication and microelectron gun arrays using laser micromachining,Microelectronic Engineering,41/42,pp167-170,1998.
6.R.K Kupka,F. Bouamrance,Cremers,Smegtert,Smegtert,Mircofabrication : LIGA-X and applications,Applied Surface Science,164,pp97-110,2000.
7.T, Masuzawa,An Approach to Micromachining through Machine Tool Technology,Annals of the CIRP,34,1,pp.419-425,1985.
8.T. Masuzawa,M. Yamamoto and M. Fujino,A Micropunching System Using Wire-EDM,Proc. of Int‘l Symposium for Electromachining (ISEM-9),pp.86-89,1989.
9.Domoiniek Reynaerts,Paul-Henri’s Heeren,Hendrik Van Brussel,Microstructuring of silicon by elelctro - discharge machining(EDM) Part I : theory,Sensors and actuators,A60,pp212-218,1997.
10.倉藤尚雄、鳳誠三郎著,鄒大鈞譯,“放電加工”,復漢出版社。
11.楊錫杭、黃廷合編著,“微機械加工概論”,全華出版社。
12.陳建良著,”結合微細放電與高頻抖動研磨之微孔加工研究”,國立中央大學碩士論文,民國92年.13.王阿成著,”結合微放電與微超音波振動研磨改善微細孔精度的研究”,國立中央大學博士論文,民國92年.