臺灣博碩士論文加值系統

中文摘要
隨著半導體產品效能日益提升，其發熱功率及散熱需求也不斷升高，以Intel Pentium 4 系列CPU為例，其解熱功率皆高於110W以上，傳統之氣冷式散熱器不但無法適應未來CPU的高功率，更會發出擾人的噪音。因此，國際各大知名CPU製造商如Intel、AMD及Apple等，皆大量投入經費用以研究與發展有效地液態冷卻方式來處理CPU的高溫。目前市面上之液冷裝置仍是以機械式幫浦為動力源，不但佔空間，且容易發生故障，此外也有管路老舊破損造成流體洩露及價格昂貴之問題。有鑑於此，配合目前產品結構的輕量化，微型化及模組化，高散熱效率之微型散熱裝置，將是未來CPU及其他半導體元件散熱的主流及趨勢。
本研究提出電滲方式驅動液式散熱裝置之新型設計，取代傳統泵浦之驅動功能，而新型設計之散熱裝置著重於微機電製程技術，採用微型散熱流道，以期具有高散熱效率並可改善現行散熱器之缺點；為評估設計之可行性，此研究係使用數值模擬方式進行分析，評估參數包含外加電場強度、 流體離子濃度及微流道幾何等。建構電滲驅動式散熱裝置之設計藍圖及探討各項設計參數之影響，作為未來技術之參考依據。
關鍵字：散熱裝置、電滲、微流道

Abstract
With the improvement of CPU efficiency day by day, the heat power generated and its following heat dissipation demand are rising constantly. For instance, Intel Pentium 4 serial CPU, it thermal power generated is always higher than 110W. The traditional air cooling type of heat sink is not only unable to adapt to the high power of CPU, but brings out the noise. Water-cooling devices for CPU on the market are still using mechanical pump as the driving force, which not only take the more space, but also are apt to out of function. Moreover, it has the problem on damage of pipeline causing fluids leakage and cost an arm and a leg. So, the heat sink must meet the market trend of light, micro-scale, modularization, and high thermal dissipation.
The procedures executed in the project are set forth as follows. The innovative design of heat sink driven by electroosmotic manner would proposed as a replacement of traditional types. It could be employed in the new design MEMS technology, in which it used the micro channel for the consideration of high thermal dissipation efficiency to overcome the drawbacks existed in the current water-cooling devices. In order to examine the feasibility of new design, the preliminary study was conducted a series of numerical analysis. The parameters addressed in the analysis included electric field intensity, ion concentration of working fluid, and dimensions of micro channel. A complete design drawings and design specifications for a robust and small electroosmotic driving heat sink could be provided as a reference for future purpose.
Keywords: heat sink, electroosmotic, micro channel,

目錄
頁次
誌謝 ii
中文摘要 iii
英文摘要 iv
目錄 v
表目錄 viii
圖目錄 ix
符號說明 xii
第一章 序論
1-1 前言 1
1-2 研究動機及目的 3
1-3 文獻回顧 5
1-3-1 微流道散熱器 6
1-3-2 電滲理論及形成機制 8
1-3-3 電滲應用及電滲流CFD 9
1-4 論文架構 10
第二章 理論推導與數值方法 13
2-1 微流道電滲流 13
2-2 基本假設 17
2-3 統御方程式 18
2-4 設計方法 21
2-4-1 CAD設計 22
2-4-2 CAE分析 24
2-5 研究設備 26
2-6 分析結果與文獻數據比較 27
第三章 分析模型建構及邊界條件設定 29
3-1 模型建構 29
3-2 邊界條件 30
3-3 參數設定 31
3-3-1 電場強度參數 32
3-3-2 流體離子濃度參數 33
3-4 電滲流CFD驗證 33
第四章 參數研究與分析結果 35
4-1 分析過程與3D可視化結果 35
4-1-1 模型一之散熱設計分析 37
4-1-1-1 平行微流道之電場強度參數影響 39
4-1-1-2 模型一之流體離子濃度參數影響 42
4-1-2 模型二之散熱設計分析 47
4-1-2-1 模型二之電場強度參數影響 50
4-1-2-2 模型二之流體離子濃度參數影響 55
4-1-3 分析參數與散熱效率之研究 60
4-2 模型二之流道幾何參數影響 62
4-2-1 流道寬度參數影響 62
4-2-2 流道長度參數影響 66
4-2-3 流道密度參數影響 70
4-3 幾何參數與散熱效率 74
第五章 結論與未來展望 76
5-1 結論 76
5-2 成果與未來展望 76
參考文獻 78
自傳

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