臺灣博碩士論文加值系統

摘要

在印刷電路板產業中，使用化學電鍍沈積法進行銅導線製備，已廣泛被採用。本研究計畫擬在玻璃基材上運用微觸印刷技術製備化學鍍沈積法所需之種晶層，再進行化學鍍沈積法在玻璃基板上獲得微米級的金屬圖案，目前已可成功的使用化學電鍍沈積法製作線寬2微米的銅圖案和線寬0.8微米的銀圖案。未來希望能改善電鍍液和金屬鍍層的品質並進一步的縮小金屬導線的線寬。此外我們使用壓印與溶膠凝膠法製作可控制粗糙度的玻璃表面以探討粗糙度對化學電鍍銅層黏著性的影響。

ABSTRACT

Autocatalytic electroless copper plating is widely applied in the printed circuit board industry. In this study, the micro-contact printing technique is applied to directly fabricate the seeding layer for electroless deposition on glass substrate. Now, we can successfully fabricate copper pattern with feature size 10µm lines and separated by 10µm on glass substrate by micro - contact printing, and silver pattern with feature size 0.8µm lines and separated by 0.8µm on glass substrate. We also use the methods of soft embossing and sol-gel to fabricate glass substrate with specific roughness which could be controlled and discuss the relations between roughness of glass substrate and the adhesion of copper layer.

目錄

中文摘要………………………………………………………… I
英文摘要………………………………………………………II
目錄……………………………………………………………… III
表目錄………………………………………………………… ……….V
圖目錄…………………………………………………………………VII
第一章 緒論…………………………………………………………….1
第二章 文獻回顧.………………………………………………………6
1.微觸印刷………………………………………………………….. .6
2.化學鍍沈積法……………………………………………………….12
3.使用微觸印刷與化學鍍製作金屬圖案…………………………...19
4.使用溶膠凝膠法(sol-gel)製作具有粗糙度的表面……………..20
第三章 實驗部分……………………………………………………..35
1.藥品器材…………………………………………………………….35
2.實驗設備…………………………………………………………….36
3.實驗步驟…………………………………………………………….38
4.表面分析技術……………………………………………………….49
第四章 結果與討論……………………………………………………57
化學鍍銅……………………………………………………………...57
基材表面粗糙度對化學鍍銅層的黏著性影響……………………...63
化學鍍銀……………………………………………………………...64
第五章 結論與未來工作…………………………………………….101
參考文獻……………………………………………………………..105

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