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研究生:蘇亮綱
研究生(外文):Liang-kang Su
論文名稱:利用TESTSPC提升測試設備綜合效率及使用率(OEE)/(OEU)
論文名稱(外文):A Study of Applying Test SPC to Promote Test Operation OEE and OEU
指導教授:徐世輝徐世輝引用關係
指導教授(外文):Shey-huei Sheu
學位類別:碩士
校院名稱:國立臺灣科技大學
系所名稱:工業管理系
學門:商業及管理學門
學類:其他商業及管理學類
論文種類:學術論文
論文出版年:2005
畢業學年度:93
語文別:中文
論文頁數:75
中文關鍵詞:設備綜合效率設備綜合使用率出貨量統計製程品管隨批抽測
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本研究主要係針對具有因龐大的設備投資導致成本過高的半導體測試產業為研究對象,結合製程統計品管(SPC,Statistic Process Control)的觀念與作法來追求生產設備綜合效率的最佳化,進而在營運成本,產品測試品質上臻於完美的境界。

本研究所考慮的參數有:設備綜合效率(OEE),(OEU),隨批品保抽測的百分比 (L/A %),出貨量(NUB,Net Unit Built),客戶風險指標 (DPPM,Defect Per Million of units)。其基本的作法是以有效地管理測前生產作業上的所有變異數,如操作人員紀律的要求,硬體設備重要參數的衡量管理,測式程式的完整性來取代測後的隨批品保抽測,因為一般而言,隨批品保抽測及壞品重測是兩個主耍的無附加價值的作業。

本研究所有的資料均是由實際的生產記錄蒐集而來。透過真實的TEST SPC導入、實際的證驗 其對OEE的影響。
The purpose of this research is about implementation of the SPC concept to fine tune the semi-conductor test operation for chasing the optimum Overall Equipment Efficiency, as well as Overall Equipment Utilization (OEU), then eventually achieve the state of art performance in both of cost & quality.
Parameters mainly considered in this paper include: Overall Equipment Efficiency (OEE), Lot acceptance %, Net Unit Built (NUB),Defect Piece Per Million (DPPM). The essential idea is to control variables like human being discipline, equipment hard ware,test program integrity prior to test to substitute the QA lot acceptance which is performed at right after 100% final test. Capacity consumed for L/A check as well as retest for securing the yiled are believed as the two of major resources of Non Value Added operations.

In this study, data are collected from the real operation informations. Real practices of Test SPC kick-off are demonstrated & assessed to show up the impact to OEE result.
目錄

中文摘要...........................................................I
英文摘要..........................................................II
誌謝.............................................................III
目錄..............................................................IV
圖目錄............................................................VI
表目錄..........................................................VIII

第一章 緒論

1.1 研究背景與動機..................................................1
1.2 研究目的與範圍..................................................3
1.3 研究方法與步驟..................................................4
1.4 論文架構.......................................................5

第二章 文獻回顧與探討

2.1 國內半導體封裝測試業之發展情況....................................6
2.2 研究對象......................................................15
2.3 生產效率文獻回顧...............................................18
2.4 統計製程管制SPC...............................................22

第三章 模式發展與建構

3.1 研究架構......................................................28
3.2 測試作業流程..................................................29
3.3 半導體測試的成效分析...........................................36
3.4 問題分析及改善模式.............................................38

第四章改善模式的導入確認與評估

4.1 TEST SP的導入................................................46
4.2 測試OEE的驗證.................................................53
4.3 推廣及成效....................................................68

第五章 結論與未來展望

5.1 研究結論......................................................73
5.2 後續研究建議..................................................74

參考文獻.........................................................75
[1] Konopka J., Improving Output in Semiconductor Manufacturing Environment, Ph.D. Dissertation. Arizona Graduate College (1996)

[2] Leachman R., Closed-Loop Measurement of Equipment Efficiency and Equipment Capacity. , IEEE Transaction on Semiconductor Manufacturing, p84-97. (1997)

[3] Nakajima S., “Introduction to TPM”, Total Productive Maintenance Productive Press, Cambridge, M.A. (1988)

[4] Willie Benitez, Deo Marrero, Doug Mirizzi P.E. and Dale Ohmart, Test SPC:A PROCESS TO IMPROVE TEST SYSTEM INTEGRITY,Texas Instruments Application Specific Products-Semiconductor division.

[5] Dale H.Besterfield,Carol Besterfield-Michina,Glen H. Besterfield and Mary Besterfield-Sacre, Total Quality Management,International Edition,.p461~451.

[6] Ames, V. et al., Semiconductor Manufacturing Productivity: Overall EquipmentEffectiveness Guidebook., Revision 1.0. SEMATECH. (1995)

[7] Texas Instruments OEE / OEU training material (2004)

[8] Jose Remond, Test Quality Assuurance, W/W TI Test operation review meeting. (2005)
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