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研究生:林子仁
研究生(外文):Tzu-Jen Lin
論文名稱:球柵陣列構裝錫球熱疲勞可靠性暨網格模型分析
論文名稱(外文):Solder Ball Thermal Fatigue and Mesh Model Analysis of Ball Grid Array Packages
指導教授:張嘉隆張嘉隆引用關係
學位類別:碩士
校院名稱:國立雲林科技大學
系所名稱:機械工程系碩士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2005
畢業學年度:93
語文別:中文
論文頁數:78
中文關鍵詞:網格模型球柵陣列構裝無鉛錫球潛變非彈性應變能量密度累積潛變應變
外文關鍵詞:lead free solderBall Grid Array Packagecreepinelastic strain energy densityaccumulated creep strainmesh model.
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現今電子產品走向輕、薄、小、高功率、多功能的趨勢,電子構裝的發展亦朝相同趨勢;近來由於構裝腳數的增加,BGA (Ball Grid Array)形式的封裝方式漸為主流,錫球在熱負載下因基板及印刷電路板 (PWB, Print Wire Board)間材料性質不匹配,產生的錫球非彈性行為,是Board Level可靠度的重要關鍵。
本論文針對含鉛錫球之WL-CSP及無鉛錫球之TF-BGA兩種晶片尺寸級球柵陣列構裝進行錫球熱疲勞可靠度模擬分析,並探討錫球網格模型收斂之情形,求得較可靠的分析模型;研究中利用有限元素分析軟體ANSYS,錫球材料設為彈性-塑性-潛變模式,模擬構裝體經溫度循環負載( Thermal Cycling Loading ) 錫球的非彈性行為,使用非彈性應變能量密度及累積潛變應變為參考基準的錫球熱疲勞壽命公式預測錫球熱疲勞壽命,與實驗數據比較,驗證分析模型的正確性,並改變構裝產品的幾何與材料參數求得較佳的參數設計,最後探討以薄片( Slice )模型模擬錫球非彈性行為的可行性。
The development of electronic product is toward lighter, thinner, shorter, higher power, and more functions, and the development of electronic package follows the same trend. The BGA (Ball Grid Array) package, designed for more I/O pins, is more popular nowadays. The solder ball induces high inelastic strain under thermal loading due to the thermal expansion mismatch between the package and PWB (Print Wire Board). The inelastic behavior of solder ball under thermal loading is the important issue of board level reliability.
In this study, two chip scale Ball Grid Array Packages, Pb/Sn solder WL-CSP and lead free solder TF-BGA, are simulated by FEM software to predict the thermal fatigue of solder ball under thermal cycling loading. The convergence of solder mesh model is considered to assure the accuracy of the simulation. The material model of solder is set to be elastic-plastic-creep. The equation to predict the fatigue life of solder is based on both inelastic strain energy density and accumulated creep energy. The predicted fatigue life is compared with experimental data to verify the accuracy of the FEM model. The effect of geometric dimensions and material properties on the fatigue life of solder is discussed. Furthermore, the slice model of FEM is compared with the symmetric model to discuss the feasibility of using the slice model to predict the inelastic behavior of solder.
中文摘要
英文摘要
誌謝
目錄
表目錄
圖目錄
符號說明
第一章 緒論
1-1 前言
1-2 探討之BGA構裝
1-2-1 WLCSP
1-2-2 TFBGA
1-3 文獻回顧
1-4 研究動機與目的
1-5 本文架構
第二章 理論基礎
2-1 線性分析理論
2-2 非線性分析理論
2-3 降伏準則
2-4 應變硬化模型
2-5 潛變模型
2-6 錫球疲勞壽命預測公式
第三章 溫度循環測試實驗簡介
3-1 實驗簡介
3-1-1 烘烤
3-1-2 吸濕試驗
3-1-3 接著
3-1-4 迴銲預熱與迴銲
3-1-5 迴銲情形檢視
3-1-6 溫度循環測試
3-1-7 偉伯分佈圖
第四章 BGA構裝可靠度模擬
4-1 WL-CSP熱疲勞可靠度分析
4-1-1 WL-CSP模型建立說明
4-1-2 Critical Ball模型網格化說明與分析
4-1-3 三維Slice模型分析探討
4-2 TF-BGA 熱疲勞可靠度分析
4-2-1 TF-BGA模型建立說明
4-2-2 Critical Ball模型網格化說明與分析
4-2-3 Slice模型模擬分析
第五章 結論與未來展望74
5-1 結論
5-2 未來展望參考文獻
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33.ANSYS Release 9.0 Documentation.
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