參考文獻
【1】竹內芳美， “マイクロ3次元切削加工”，型技術，第十七卷，第3號，pp.18-23，3月號，2002..
【2】早乙女康典，秦誠一， “超塑性複合加工によるマイクロ2段齒車の創成”，塑性と加工，40，pp.49，2000.
【3】大森整，片平和俊，林偉民，上原嘉宏，鈴木享，小茂鳥潤， “ナノレベル表面機能を実現する超精密金型のマイクロ研削技術”， 型技術，第十七卷，第3號，pp.24-28，3月號，2002.
【4】R. A. Normann, P. K. Campbell, and K. E. Jones, “A silicon based electrode array for intracortical stimulation: structural and electrical properties,” IEEE Engineering in medicine & biology society, Nov, 1989, pp 939-940.
【5】M. O, Heuschkel, M. Fejtl, M. Raggenbass, D. Bertrand, and P. Renaud , “A three-dimensional multi-electrode array for multi-site stimulation and recording in acute brain slices,” Journal of Neuroscience Methods, 114, pp 135 - 148 .2002.
【6】P. Griss, P. Enoksson, H. K. Tolvanen-Laakso, P. Merilainen, S. Ollmar, and G Stemme, “Micromachined electrodes for biopotential measurements,” Journal Of Microelectromechanical System, 10, pp 10-16,2001.
【7】Q. Bai, K.D. Wise, and D. J. Anderson, “A high-yield microassembly Structure For three-dimensional microelectrode arrays,” IEEE Transactions On Biomedical Engineering, 47, pp 281-289, 2000.
【8】D. M. Allen, A. Lecheheb . “Micro electro-doscharge machining of ink jet nozzles : optimum selection of material and machining parameters” , Journal of Materials Processing Technology , 58 , pp. 53-66, 1996.
【9】Domoiniek Reynaerts,Paul-Herni’s Heeren ,Hendrik Van Bmssel,“Microstructuring of silicon by elelctro - discharge machining(EDM) Part I: theory”, Sensors and actuators，A60，pp212-218，1997.
【10】L.Kuo and T.Masuzawa， “A Micro – Pipe Fabrication Process”,Proc. Of IEEE MEMS’91,pp.80-85,1991..
【11】山本真嗣，宇野義幸，窪田真一郎， “YAG レ-ザを併用した超硬合金への微細深穴放電加工-併用加工における加工能率の向上に関する研究”，電気加工学会全国大会講演論文集，pp.57-60，2001
【12】許東亞，増沢隆久， “電極供給の自動化に関する研究”， 電気加工学会誌，Vol.36，No.81，pp.7-14，2002.
【13】Takahata, K.; Shibaike, N.; Guckel, H., “A novel micro electro- discharge machining method using electrodes fabricated by the LIGA process”,1Micro Electro Mechanical Systems, IEEE , pp. 238 -243 Jan. 1999.
【14】Takahata, K.; Gianchandani, Y.B., “Batch mode micro-EDM for high- density and high-throughput micromachining”,Micro Electro Mechanical Systems, IEEE ,pp. 72 -75 Jan 2001.
【15】張建偉，”應用超音波技術於微小孔徑之沖壓成形研究”，國立中興大學，機械工程研究所，碩士論文，91年。【16】李湘台，”超音波振動研磨對微放電孔精度之影響”，國立中央大學，機 械工程研究所，碩士論文，88年。【17】顏炳華，”利用微細放電及超音波振動研磨製作精密微孔之技術研發”，國立中央大學，機械工程學系，專題計畫成果報導，89年。
【18】Mohri, N., Saito, N., Takawashi, T., Kobayashi, K., “Mirror-like finishing by EDM,” Proceedings of the 25th Machine Tool Design and Research Conference, p 329, 1985.
【19】齋藤長男 監修，小林和彥、仙北谷英次 著，ワイヤカツト放電加工技術，日刊工業新聞社，1983
【20】真鍋明、葉實雄一郎，機械加工現場診斷シリ－ズ5 形雕放電加工，日刊工業新聞社，1997
【21】Kunieda, M., Muto, H., “Development of multi-spark EDM,” Ann CIRP, 49(1), p119, 2000.
【22】Fuzhu, Han., Masanori Kunieda., “Development of parallel spark electrical discharge machining,” Precision Engineering, pp. 65-72, 2004.
【23】Seong.S.Choi , Jung , D.W.Kim , M.A.Yakshin , J.Y.Park , .Kuk ,“Frabrication and microelectron gun arrays using laser micromachining” , Microelectronic Engineering , 41/42 ,pp.l67-170, 1998.
【24】D. M. Allen, A. Lecheheb . “Micro electro-doscharge machining of ink jet nozzles : optimum selection of material and machining parameters” , Journal of Materials Processing Technology , 58 , pp. 53-66, 1996.
【25】T., Masuzawa, J., Tsukamoto, and M., Fujino, “Drilling of Deep Microholes by EDM,” Annals of the CIRP, Vol. 38, No. 1, pp. 195-198, 1989 .
【26】K.Kagaya , Y.Oishi.K.Yada , “Micro-electrodischarge machining Using Water as a working Fluid-2: Narrow Slit Fabrication”, Precision Engineering , 12, 4, pp.213-217 , 1990.
【27】W. Ehrfeld and H. Lehr , “ Deep X-Ray Lithography for the production of three-dimensional microstructures from metals, polymers and ceramics” , Radiat .Phys.Chem Vol.45 No.3, pp.349-365 , 1995.
【28】Domoiniek Reynaerts,Paul-Herni’s Heeren ,Hendrik Van Bmssel,“Microstructuring of silicon by elelctro - discharge machining(EDM) Part I: theory”, Sensors and actuators，A60，pp212-218，1997.
【29】郭佳儱， “微精密機械生產製造系統發展簡介”，科儀新知，第十八卷，第三期，pp.59-67，1996.【30】吳清沂 ， 鍾震桂 ， “微機電系統技術簡介”， 科儀新知 ， 第十八卷 ， 第三期，pp.26-40 ， December ， 1996.【31】郭佳儱， “微放電加工技術於MEMS之應用”，機械月刊，第二十五卷，第十一期，pp.304-313，1999【32】Masuzawa, T., Fujino, M., and Kobayashi, K., “Wire Electro-Discharge Grinding for Micro-Machining,” Annals of the CIRP, Vol. 34, No. 1, pp. 431-434, 1985.
【33】Tu, Z.Y., Masuzawa, T., Fujino, M., “Micro-EDM for Three-Dimensional Cavities-Development of Uniform Wear Method,” Annals of the CIRP, Vol. 47, No. 1, pp. 169-172, 1998.
【34】L.Kuo and T.Masuzawa， “A Micro – Pipe Fabrication Process”,Proc. Of IEEE MEMS’91,pp.80-85,1991.
【35】A.C.Wang, B.H.Yan , X.T.Li , F.Y.Huang , Use of micro ultrasonic vibration lapping to enhance the precision of microholes drllled by micro electro – discharge machining , International Journal of Machine Tools and Manufacture,Vo1.42 , pp.915-923 , 2002.
【36】C.T.Yang, S.S.Ho and B.H.Yan, Micro Hole Machining of Borosilicate Glass though Electrochemical Discharge Machining, Key Engineering Materials,Vol.196,pp.149-166,2001.
【37】T.MASUAZWA ,1Masatoshi FUFINO, Masaki YAMANOTO and, “Micro Punch System as an application of WEDG”，生產研究所39卷6號，P277-P280，東京大學生產研究所，1987.
【38】T.Masuzawa，“An Approach to Micromachnining through Machine
Tool Technology”,Annals of the CIRP,34,1,pp.419-425,1985.
【39】山本真嗣，宇野義幸，窪田真一郎， “YAG レ-ザを併用した超硬合金への微細深穴放電加工-併用加工における加工能率の向上に関する研究”，電気加工学会全国大会講演論文集，pp.57-60，2001.
【40】Egashira, K., Masuzawa, T., “Microultrasonic Machining by the Application of Workpiece Vibration,” Annals of the CIRP, Vol. 48, No. 1, pp. 131-134, 1999.
【41】Xi-Oing Sun, Masuzawa, T., Fujino, M., “Micro Ultrasonic Machining and Self-Aligned Multilayer Machining/Assembly Technologies for 3D Micromachines,” Proceedings of IEEE Micro Electro Mechanical Systems, pp. 312-317, 1996.
【42】Masuzawa, T., “ Micro-EDM,” ISEM, Vo1.1, No. 1, pp. 3-19, 2001
【43】黃俊德、郭佳龍，整合微放電加工與雷射焊接製程進行微精密元件組裝，雲林科技大學博士論文，2002.