奈米壓印技術是提昇製造更微小結構的重要方法之一，但現階段對於奈米尺度的許多現象尚無法充分掌握。在奈米壓印製成的冷卻過程中過大的壓力將使模仁轉角處產生應力集中，造成材料破壞；但壓力太小又會因拘束不足而使轉印效果變差，所以施加的壓力值可參考高分子完全充填所需的最小壓力。如此即可有效的減少實驗的次數，並利用實驗進一步改善轉印效果。本研究利用有限元素法將高分子假設為橡膠彈性體，並以此模型來模擬壓印製程中，高分子在模穴中的充填情形。目的是希望能透過電腦模擬，預估在不同壓力下，不同的模穴寬度、間距與區塊距離，壓印後的充填狀況。並以實驗得到高分子成型後的形狀，與模擬做比對後，進一步得到高分子欲完全充填所需的最小壓力。

Nanoimprint lithography is one of the most important methods to improve the precision of micro fabrication process, however the manufacturing parameters such as imprinting pressure, mold temperature, aspect ratio of the recessed groove, and initial thickness of polymer are difficult to determine. The higher imprinting pressure creates a stress concentration at the corner of the polymer and then induce the defect of the polymer at the cooling process. On the other hand, incomplete filling ratio is observed if imprinting pressure is not higher enough and perfect pattern will then not be formed on the surface of the polymer. A finite element software MARC is applied in this paper to investigate the correlation among these manufacturing parameters. The computer simulation was based on a rubber elastic model and the profile obtained from the simulation agreed well with the experimental data. The minimum imprinting pressure which cause 100% filling ratio and prevent the specimen defects is found and further reduce the time of trial and error.

中文摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
表目錄 vi
圖目錄 vii
符號說明 ix

第一章 緒論 1
1.1 前言 1
1.2 文獻回顧 3
1.2.1 微熱壓成形之有限元素分析 3
1.2.2 微熱壓成形之實驗研究 6
1.3 本文架構 6
第二章 有限元素分析 10
2.1 有限元素之基本理論 10
2.2 非線性求解之演算法 10
2.3 接觸判定與處理 11
2.4 網格重建之選擇 12
2.5 熱壓成形之材料本質方程 13
第三章 實驗設備與步驟 18
3.1 實驗設備 18
3.1.1 手套箱 18
3.1.2 旋轉塗佈機 18
3.1.3 液壓動力熱壓機 18
3.1.4 氣液壓動力熱壓機 19
3.1.5 原子力顯微鏡 19
3.1.6 光學顯微鏡 19
3.1.7 電子顯微鏡 20
3.2 實驗步驟 20
3.2.1 模仁製作 20
3.2.2 PMMA高分子旋轉塗佈 20
3.2.3 沉積抗黏著層 21
3.2.4 微熱壓試壓 22
3.2.5 微熱壓成形 24
3.2.6 微結構量測 24
第四章 結果與討論 41
4.1 模擬與相關文獻比較 41
4.2 實驗結果與討論 43
4.3 模擬與實驗比較 44
第五章 結論與建議 81
5.1 結論 81
5.2 建議 81
參考文獻 83

1.S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Imprint of sub-25 nm vias and trenches in polymer, Appl. Phys. Lett., Vol. 67, 3114-3116, 1995.
2.X.-J. Shen, Li-Wei Pan, and Liwei Lin, Microplastic embossing process: experimental and theoretical characterizations, Sensors and Actuators A, 428-433, 2002.
3.Yoshihiko Hirai, Satoshi Yoshida, and Nobuyuki Takagi, Defect analysis on thermal nanoimprint lithography, J.Vac. Sci. Technol., B.21.6, 2765-2770, 2003.
4.Treloar, L.R.G, The physics of rubber elasticity, Oxford University Press,1958
5.Mooney, M., A Theory of large elastic deformation, J. Applied Physics Vol. 11, 582, 1940.
6.R. S. Rivin, Philos., Large elastic deformation of isotropic materials. VI. Further Results in the Theory of Torsion , Shear and Flexure Ser., A.242, 173, 1949.
7.Ogden, R. W., Large deformation isotropic elasticity on the correlation of theory and experiment for compressible rubberlike solids, Proc. R. Soc. Lond. A. ,vol.328, 567-583, 1972.
8.Maerker, J. M. and W. R. Schowalter, Biaxial extension of an elastic liquid, rheology Acta, vol.13, 627-638, 1974.
9.Yoshihiko Hirai, Masaki Fujiwara, Takahiro Okuno, and Yoshio Tanaka, Study of resist deformation in nanoimprint lithography, J.Vac. Sci. Technol., B19.6, 2811-2815, 2001.
10.C.-R. Lin, R.-H. Chen and C. Hung, The characterization and finite-element analysis of a polymer under hot pressing, Int. J. Adv. Manuf. Technol., vol.20, 230-235, 2002.
11.Yi-Je Juang, L. James Lee, and Kurt W. Koelling, Hot embossing in microfabrication. Part II: Rheological characterization and process analysis, Polym. eng. sci., 551-566, 2002.
12.陳仁浩和王培良，塑膠微熱壓成形之研究，國立交通大學機械工程研究所碩士論文，民國八十七年。
13.L.J. Heydrmn, H. Schift, C. David, J. Gobercht, and T. Schweizer, Flow behavior of thin polymer films used for hot embossing lithography, Microelectron. eng. vol.54, 229-245, 2000.
14.MARC training guide, MARC analysis research corporation, 21-24, 1999.
15.MARC Analysis Research Corporation, Volume A, Version K7, 1999.
16.F. Hurtado-Laguna, and J. V. Aleman, Longitudinal volume viscosity of poly(methyl methacrylate), J. Polym. Sci., Part A：Polym. Chem. Vol. 26, 2631-2649, 1988.