臺灣博碩士論文加值系統

在本篇論文中，主要是探討改變矩形微帶天線表面感應電流分佈形成不同激發源情況下的反射損失。感應電流變化主要是藉由改變輻射金屬片表面的介電材料和排列方式為主。不同的激發模態有三：第一是銅線方向性排列；第二為摻雜粉末樹脂；第三則是塗敷導電銀膠。
實驗結果顯示，在輻射輻射金屬片上方向性地排列銅線，發現銅線y方向排列比x方向排列有較好的寬頻效果，可達到兩個相鄰的共振模態彼此拉近而形成較寬的操作頻帶。
摻雜粉末方面，則是在高分子基材中分別添加銅與石墨的粒子，可發現其-10 dB頻寬比起微帶天線來得略大。因此，添加適量的石墨粒子，的確有助於增加頻寬。
在輻射金屬面上塗敷不同間距的銀膠條紋可改變阻抗頻寬，當條紋間距較大時，其頻寬也來得較寬。

ABSTRACT

In this paper, the return loss of the modified rectangular microstrip antenna with various the dielectric materials and patterns were investigated. Various materials and patternized paints were brush on the radiation patches for changing the induction current distribution. As a result, the patternized surface structures alter the exciting source for the reflection loss of the antenna.
The experimental results showed that the arrangement direction of Cu wires on the radiation patche widens the radiation band, especially for the y direction, because two adjacent resonant modes are adjacent to each other and form a wide operating bandwidth.
The hybrid Cu/polymer and graphite/polymer materials are paint on the patch. It was found that the modified patch antenna shows wide bandwidth at the level of -10dB, especially for the addition of appropriate graphite in polymer.
We coated different spacing of silver paste stripes on the radiation metallic patch. The experimental results indicated that the large spacing of stripes cause wide bandwidth.

誌謝 ii
摘要 iv
ABSTRACT v
目錄 vi
表目錄 ix
圖目錄 x
1. 緒論 1
1.1 前言 1
1.2 研究背景與動機 2
1.3 論文提要 3
2. 文獻回顧 5
2.1 傳統矩形微帶天線 5
2.1.1 概述 5
2.1.2 基本架構 7
2.1.3 饋入方式 7
2.1.4 矩形微帶天線之W及L 13
2.1.5 輸入阻抗匹配 13
2.1.6 輻射效率 15
2.2 微帶天線基本理論與分析方法 16
2.2.1 微帶天線的基本理論 16
2.2.2 微帶天線的分析 18
2.2.3 空腔模型理論 20
2.3 近場作用與激發源 27
2.3.1 交變電偶極與近遠場電磁場 27
2.3.2 奈米粒子電磁特性 29
3. 實驗設計方法與量測 35
3.1 微帶天線設計 35
3.2 實驗規劃 35
3.2.1 微帶天線製作 37
3.2.2 高分子基材製作 46
3.3 銅線方向性排列 48
3.4 摻雜石墨、銅、鋁、鐵粉粉末效應 49
3.4.1 環氧樹脂高分子基材摻雜石墨、銅、鋁、鐵粉粉末 49
3.4.2 不同高分子基材摻雜銅粉粉末與石墨粉末 49
3.5 導電銀膠條紋狀排列 50
3.6 分析儀器及量測原理 51
3.6.1 網路分析儀 51
3.6.2 量測步驟 53
4. 實驗結果 54
4.1 銅線排列激發 54
4.1.1 銅線y方向排列激發 54
4.1.2 銅線x方向排列激發 66
4.2 摻雜石墨、銅、鋁、鐵粉粉末效應 76
4.2.1 環氧樹脂高分子基材摻雜石墨、銅、鋁、鐵粉粉末 76
4.2.2 不同高分子基材摻雜銅粉粉末與石墨粉末 81
4.3 導電銀膠條紋狀排列 89
4.3.1 寬間距條紋結構 90
4.3.2 中間距條紋結構 91
4.3.3 細間距條紋結構 93
5. 討論 97
5.1 銅線y方向排列 97
5.2 銅線x方向排列 97
5.3 摻雜銅粉粉末 97
5.4 摻雜石墨粉末 98
5.5 導電銀膠條紋狀疏密排列 98
6. 結論 99
6.1 銅線方向性排列 99
6.2 摻雜粉末 99
6.3 導電銀膠條紋狀疏密排列 99
7. 未來研究方向 100
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