探針卡的使用係在IC 製造過程當中的前段測試方法，藉由
此探針卡之探針與晶圓上之銲墊相接觸以獲得電路之電性。然而
隨著晶片被運用在不同的環境當中，為了確保晶片不受到環境溫
度來影響晶片之電性，因此利用探針卡進行晶圓之針測，來得到
晶圓在不同環境溫度下之電性性質。本研究主要目的是建立晶圓
針測溫控系統，將探針與銲墊放置在環境加熱爐中，觀察不同針
測行程之針測結果，並探討探針頭對銲墊之接觸力、銲墊之刮痕
大小與刮痕深度。本研究共分兩部份進行，首先建立環境溫控設
備與微拉力試驗機以量測探針之機械性質，以供日後帶入有限元
素分析模型來進行模擬。而後吾人利用此實驗設備探討針測行程
對不同環境溫度與不同探針材質之下對鋁銲墊進行針測實驗，並
且量測銲墊刮痕大小與刮痕深度。根據探針拉伸實驗結果得知探
針不隨環境溫度升高或下降來影響其材料性質，但根據探針針測
實驗結果發現鋁銲墊刮痕長度與深度皆隨著溫度之升高而增大，
也隨著溫度降低而減小。本文將針對鎢探針與鈹銅探針探討對鋁
銲墊在不同環境溫度下之針測。本研究之成果將有助於了解鋁銲
墊在不同環境溫度下受到探針之接觸的刮痕大小，進一歩了解晶
片在封裝製程中之可靠度影響。

Using the first period of method of testing of the department in
IC manufacture process of probe card, probe have kept in touch in
order to get bonding pad property of circuit. The chip is used in
different environments, in order to guarantee that the chip can not
influence the electricity of the chip by the environment temperature,
so utilize the probe to examine the bond pad and needle, to get the
electricity under different environment temperature. This purpose of
research to set up examine temperature controlled system, probe and
bonding pad are put in the temperature controlled system, observe the
contact force and mark length and mark depth. This research consist
of two parts and goes on altogether, set up the temperature controlled
equipment and MTS Tytron at the first. And then my utilizes this
experimental facilities to probe into the needle to examine the
bonding pad and carrying on the needle and examining the experiment
to the bonding pad under different environment temperature and
different probe materials , and quantity examines and welds the size
of scratch of the bonding pad and depth of scratch. According to the
experimental result and learn that the probe does not rise or drop to
influence its material properties, but the ones and find the length of
scratch of the bonding pad and depth to increase with rising of
temperature according to the probe needle, reduce as temperature is
reduced too. This text will probe into under different environment temperature of bonding pad to examine to the tungsten probe and
beryllium copper probe. This achievement can understand bonding
pad receive size of scratch of contact of probe under different
environment temperature to contribute. Understanding the reliability
of packaging in encapsulation influences.

中文摘要.....................................................................I
英文摘要.....................................................................II
目錄........................................................................IV
表目錄.................................................................... VII
圖目錄.................................................................... VIII
第一章 緒論................................................................1
1-1 研究動機................................................................ 1
1-2 研究目的............................................................. 4
1-3 文獻回顧.............................................................. 6
1-3-1 探針材料性質與電訊分析之探討........................... 6
1-3-2 探針針測與銲墊刮痕之損傷分析........................... 8
1-3-3 文獻回顧總結........................................................ 10
1-4 研究方法與流程......................................................... 12
第二章 探針卡之分類與應用........................................... 15
2-1 晶圓針測.............................................................. 15
2-1-1 晶圓針測發展概況................................................ 16
2-1-2 晶圓針測流程........................................................ 17
2-1-3 針測測試機............................................................ 19
2-2 探針卡之分類.......................................................... 20
2-2-1 懸臂樑式探針卡.................................................... 23
2-2-2 刀片式探針卡........................................................ 25
2-2-3 垂直式探針卡........................................................ 26
2-2-4 薄膜式探針卡........................................................ 28
2-2-5 微彈簧式探針卡.................................................... 30
2-2-6 微機電式探針卡.................................................... 32
2-3 探針幾何外型與環境溫度對銲墊刮痕之影響................ 33
2-3-1 探針與銲墊之材質與幾何外型............................. 34
2-3-2 不同環境溫度對材料性質與針測結果之影響..... 38
第三章 探針拉伸實驗....................................................... 40
3-1 實驗目的與設計........................................................ 40
3-1-1 試件之製作............................................................ 41
3-2 實驗設備與架構........................................................ 43
3-3 實驗方法與步驟........................................................ 44
3-4 實驗結果與討論........................................................ 46
第四章 溫控過程與溫控針測實驗.................................... 53
4-1 實驗設備與架構....................................................... 54
4-2 環境溫度之給定與量測條件........................................... 57
4-3 實驗方法與步驟........................................................ 58
4-4 實驗結果與討論........................................................ 62
4-4-1 鎢探針與鈹銅探針對鋁銲墊之針測壓力............. 62
4-4-2 鋁銲墊之刮痕長度................................................ 72
4-4-3 鋁銲墊之刮痕深度................................................ 77
第五章 相異溫控針測實驗方法........................................ 81
5-1 實驗設備與設計概念................................................... 81
5-2 熱電致冷晶片之工作原理............................................... 84
5-3 實驗方法與步驟.......................................................... 87
5-4 探針對鋁銲墊之相異針測參數分析結果與討論............. 88
第六章 結論與未來研究方向........................................... 93
6-1 結論.................................................................... 93
6-2 未來研究發展............ ............................................... 95
參考文獻.................................................................... 98

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