臺灣博碩士論文加值系統

本論文以有限元素法分析電子構裝銲錫接點在熱循環條件下，介
金屬化合物裂縫之力學行為。並利用有限元素法計算裂縫前端之應力
/應變場，進而求取相關之破裂力學參數：應力強度因子及能量釋放
率。論文中考量兩種不同之介金屬化合物裂縫位置：1.介金屬化合物
與銅墊片間的界面、2.介金屬化合物層的中間。另外，本論文並考慮
不同介金屬化合物厚度與不同裂縫長度對裂縫行為之影響。在有限元
素法模擬中，假設錫球的機械性質為與溫度及時間相關的彈塑性-黏
塑性-潛變；底膠材料性質則假設為黏彈性。本論文利用有限元素法
中全域模型及局部模型之技巧；並且為了避免在有限元素分析中元素
重疊現象發生與實際不符，利用了接觸對技巧來建構次局部模型。結
果指出兩種不同之介金屬化合物裂縫位置以裂縫長度為變數時，對於
破裂力學參數均有較佳之趨勢；然而當以介金屬化合物厚度為變數
時，對於破裂力學參數則均無明顯之影響。

The crack behavior of the intermetallic compounds (IMC) for the
solder joints of electronic packages under thermal cycling tests were
analyzed using the finite element method in this research. The finite
element method was employed to calculate the fracture-mechanics
parameters at the crack tip; such as stress intensity factor and energy
release rate. Two positions will be considered to initiate the crack: the
first one is at the interface between the IMC and the copper pad; and the
other one is at the inner part of IMC. Furthermore, the effects of crack
length and thickness of IMC on the crack tip parameters were also studied
in the research. In the simulated analysis, the property of the solder will
be assumed to be elastic-plastic-creep, and that of the underfill,
viscoelastic. The global-local modeling technique was used in the finite
element analysis to obtain the detailed stress/strain behavior near the
crack tips. It is found that for both the interfacial cracks and the IMC
cracks, the mode I stress intensity factor reduces with the length of crack.
The trend of decreasing for mode I stress intensity factor reaches a stable
value with the propagation of the crack. However, the mode II stress
intensity factor reduced significantly with the crack length. Furthermore,
the thickness of IMC has slight effect on the stress intensity factors under
the condition of fixed crack length.

中文摘要 Ⅰ
英文摘要 Ⅱ
致謝 III
章節目錄 IV
圖表目錄 VI
符號說明 .X
第一章 緒論 1
1-1 前言、研究動機和目的 1
1-2 研究方法 3
1-3 本文架構 4
第二章 文獻回顧 5
第三章 有限元素分析與破裂力學理論 15
3-1 有限元素分析 15
3-1-1 研究對象 15
3-1-2 模型簡介 18
3-1-3 材料性質與基本假設 19
3-1-4 邊界與負載條件 21
3-2 破裂力學理論 22
3-2-1 界面脫層之應力強度因子 22
3-2-2 單一材質裂縫之應力強度因子 25
第四章 結果與討論 27
4-1 數值模擬之收斂性 27
4-2 假設裂縫位於介金屬化合物與銅墊片界面處 28
4-2-1 改變裂縫長度對破裂力學參數之影響 28
4-2-2 改變介金屬化合物厚度對破裂力學參數之影響 29
4-3 假設裂縫位於介金屬化合物層的中間位置 29
4-3-1 改變裂縫長度對破裂力學參數之影響 29
4-3-2改變介金屬化合物厚度對破裂力學參數之影響 30
4-4 小結 30
第五章 結論 32
參考文獻 34

[1]S. E. Yamada, “A Fracture Mechanics Approach to Soldered Joint Cracking,” IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 12, Issue 1, pp. 99-104, March 1989.
[2] J. H. Lau, “Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibrational Condition,” IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 19, No.4, pp. 728-735, November 1996.
[3]P. L. Tu, and Y. C. Chan, “Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints,” IEEE Transactions on Compounds, Packaging, and Manufacturing Technology B, Vol. 20, No. 1, pp. 87-93, February 1997.
[4]A. C. K. So, Y. C. Chan, and J. K. L. Lai, “Aging Studies of Cu-Sn Intermetallic Compounds in Annealed Surface Mount Solder Joints,” IEEE Transactions oc Components, Packaging, and Manufacturing Technology B, Vol. 20, No. 2, pp. 161-166, May 1997.
[5]Y. C. Chan, P. L. Tu, A. C. K. So, and J. K. L. Lai, “Effect of Intermetallic Compounds on the Shear Fatigue of Cu/63Sn-37Pb Solder Joints,” IEEE Transactions on Components, Packaging, and Manufacturing Technology B, Vol. 20, No. 4, pp. 463-469, November 1997.
[6]P. T. Vianco, J. J. Stephens, and J. A. Rejent, “Intermetallic Compound Layer Development During the Solid State Thermal Aging of 63Sn-37Pb Solder/Au-Pt-Pd Thick Film Couples,” IEEE Transactions on Components, Packaging, and Manufacturing Technology A, Vol. 20, No. 4, pp. 478-490, December 1997.
[7] T. Saitoh, H. Matsuyama, and M. Toya, “Linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in LSI PLASTIC Packages under Temperature Cyclic Loading,” IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 21, No.4, pp. 422-427, November 1998.
[8]S. Choi, T. R. Bieler, J. P. Lucas, and K. N. Subramanian, “Characterization of the Growth of Intermetallic Interfacial Layers of Sn-Ag and Sn-Pb Eutectic Solders and Their Composite Solders on Cu Substrate During Isothermal Long-Term Aging,” Journal of Electronic Materials, pp. 1209-1215, November 1999.
[9] S. Wiese, F. Feustel, S. Rzepka, and E. Meusel, “Creep and Crack Propagation in Flip Chip SnPb37 Solder Joints,” Electronic Components and Technology Conference, 1999.
[10]A. O. Ayhan and H. F. Nied, “Finite Element Analysis of Interface Cracking in Semiconductor Packages,” IEEE Transactions on Components and Packaging Technology Vol. 22, No.4, pp. 503-511, December 1999.
[11] J. H. Lau, and S. W. R. Lee, “Temperature Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method,” Transactions of the ASME Vol. 122, pp. 34-41,March 2000.
[12]W. Huang, O. A. Palusinski, and D. L. Dietrich, “Effect of Randomness of Cu-Sn Intermetallic Compound Layer Thickness on Reliability of Surface Mount Solder Joints,” IEEE Transactions on Advanced Packaging, Vol. 23, No. 2, pp. 277-284, May 2000.
[13]R. J. Coyle, and P. P. Solan, ”The Influence of Test Parameters and Package Design Features on Ball Shear Test Requirements,” IEEE/GPMP Int’l Electronics Manufacturing Technology Symposium, 2-3 pp.168-177, October 2000.
[14]P. L. Tu, Y. C. Chan, K. C. Hung, and J. K. L. Lai, “Comparative Study of Micro-BGA Reliability Under Bending Stress,” IEEE Transactions on Advanced Packaging, Vol. 23, No. 4, pp. 750-756, November 2000.
[15]K. L. Lin, and K. T. Hsu, “Manufacturing and Materials Properties of Ti/Cu/Electroless Ni/Solder Bump on Si,” IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 4, pp. 657-660, December 2000.
[16]J. H. Lau, S. W. R. Lee, and C. Chang, “Effect of Underfill Material Properties on the Reliablity of Solder Bumped Flip Chip on Board with Imperfect Underfill Encapsulants,” IEEE, 2000.
[17]L. L. Mercado, V. Sarihan, and T. Hauck, “An Analysis of Interface Delamination In Flip-Chip Packages,” Electronic Components and Technology Conference, 2000.
[18]Y. C. Chan, P. L. Tu, C. W. Tang, K. C. Hung, and J. K. L. Lai, “Reliability Studies of µBGA Solder Joints-Effect of Ni-Sn Intermetallic Compound,” IEEE Transactions on Advanced Packaging, Vol. 24, No. 1, pp. 25-32, February 2001.
[19]P. L. Tu, Y. C. Chan, and J. K. L. Lai, “Effect of Intermetallic Compounds on Vibration Fatigue of µBGA Solder Joint,” IEEE Transactions on Advanced Packaging, Vol. 24, No. 2, pp. 197-205, May 2001.
[20]H. Ezawa, M. Miyata, S. Honma, H. Inoue, T. Tokuoka, J. Yoshioka, and M. Tsujimura, “Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 275-281, October 2001.
[21]G. W. Xiao, P. C. H. Chan, A. Teng, J. Cai and M. M. F. Yuen, “Effect of Cu Stud Microstructure and Electroplating Process on Intermetallic Compounds Growth and Reliability of Flip-Chip Solder Bump,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 682-690, December 2001.
[22]J. W. Nah, and K. W. Paik, “Investigation of Flip Chip Under Bump Metallization Systems of Cu Pads,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp. 32-37, March 2002.
[23]S. Y. Jang, J. Wof, O. Ehrmann, H. Gloor, H. Reichl, and K. W. Paik, “Pb-Free sn/3.5Ag Electroplating Bumping Process and Under Bump Metallization (UBM),” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No. 3, pp. 193-202, July 2002.
[24]M. Li, K. Y. Lee, D. R. Olsen, W. T. Chen, B. T. C. Tan, and S. Mhaisalkar, “Microstructure, Joint Strength and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No. 3, pp. 185-192, July 2002.
[25]W. Huang, J. M. Loman, and B. Sener, “Study of the Effect of Reflow Time and Temperature on Cu-Sn Intermetallic Compound Layer Reliability,” Journal of Microelectronics Reliability, Vol. 42, Lssue 8, pp. 1229-1234, August 2002.
[26]Y. Uegai, A. Kawazu, Q. Wu, H. Matsushima, M. Yasunaga, and H. Shimamoto, “New Thermal Fatigue Life Prediction Method for BGA/FBGA Solder Joints with Basic Crack Propagation Study,” Electronic Components and Technology Conference, 2002.
[27]C. Kanchanomai, Y. Miyashita, and Y. Mutoh, “C*-parameter Approach to Low Cycle Fatigue Crack of Solders,” Electronic Components and Technology Conference, 2002.
[28]J. F. Gong, G. W. Xiao, P. H. Chan, R. S. W. Lee, M. M. I. Yuen, “A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties,” IEEE Electronic Components and Technology Conference, Proceedings, 53rd, pp. 685-691, May 2003.
[29]H. J. Albrecht, A. J. K. Muller, W. H. Muller, J. S. J. Villain, A Vogliano, “Interface Reactions in Microelectronic Solder Joints and Associated Intermetallic Compounds: An Investigation of their Mechanical Properties using Nanoindentation,” IEEE Electronic Packging and Technology, 5th Conference 10-12, pp. 726-731, December 2003.
[30]C. Kanchanomai, and Y. Mutoh, “Influence of Temperature on Low Cycle Fatigue and Fatigue Crack growth of Sn-Ag Eutectic Solder,” Electronic Components and Technology Conference, 2003.
[31]L.L. Mercado, Senior Member, and V. Sarihan, “Evaluation of Die Edge Cracking in Flip-Chip PBGA Packages,” Electronic Components and Technology Conference, 2003.


[32] K. Harada, S. Baba, Q. Wu, H. Matsushima, T. Matsunaga, and Y. Uegai, “Analysis of Solder Joint Fracture under Mechanical Bending Test,” Electronic Components and Technology Conference, 2003.
[33]P. Gupta, R. Doraiswami, and R. Tummala, “Effect of Intermetallic Compounds on Reliability of Sn-Ag-Cu Flip Chip Solder Interconnects for Different Substrate Pad Finishes and Ni/Cu UBM,” IEEE Electronic Components and Technology Conference, Vol. 1, 1-4, pp. 68-74, June 2004.
[34]C. t. Pang, C. T. Kuo, K. N. Chiang, “Experimental Characterization and Mechanical Behavior Analysis on Intermetallic Compounds of 96.5Sn-3.5Ag and 63Sn-37Pb Solder Bump with TI-CU-NI UBM on Copper Chip,” IEEE Electronic Components and Technology Conference, Vol. 1, 1-4, pp. 90-97, June 2004.
[35] Z. Chen, “Lifetime of Solder Joint and Delamination in Flip Chip Assemblies, ”Business of Electronic Product Reliability and Liability Conference , 2004.
[36] C. Andersson, D. R. Andersson, P. E. Tegehall, and J. Liu, “Effect of Different Temperature Cycle Profiles on the Crack Propagation and Microstructural Evolution of Lead Free Solder Joint of Different Electronic Components,” Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems Conference, 2004.
[37] S. Ridout, M. Dusek, C. Bailey, and C. Hunt, “Finite Element Modelling of Crack Detection Test,” Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems Conference, 2004.
[38] J. Auersperg, D. Vogel, and B. Michel, “Crack and Delamination Risk Evaluation of Thin Silicon Applications Based on Fracture Mechanics Approaches,” Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems Conference, 2004.
[39]李英舜, “塑封球柵陣列電子構裝之破裂延伸,” 國立清華大學碩士論文, 2000.
[40]黃詩翔, “利用有限元素法分析介金屬化合物對電子構裝在熱循環測試下銲錫接點疲勞壽命之影響,” 中華大學碩士論文,2005.