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研究生:余鎮利
研究生(外文):CHEN-LI YU
論文名稱:電子構裝銲錫接點介金屬化合物裂縫之破裂力學分析
論文名稱(外文):Fracture Mechanics Study on The Intermetallic Compound Crack Behavior for The Solder Joint of Electronic Packages
指導教授:任貽明
指導教授(外文):Yi-Ming Jen
學位類別:碩士
校院名稱:中華大學
系所名稱:機械與航太工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2006
畢業學年度:94
語文別:中文
論文頁數:80
中文關鍵詞:裂縫有限元素法介金屬化合物熱循環測試破裂力學
外文關鍵詞:Crack
相關次數:
  • 被引用被引用:0
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  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
本論文以有限元素法分析電子構裝銲錫接點在熱循環條件下,介
金屬化合物裂縫之力學行為。並利用有限元素法計算裂縫前端之應力
/應變場,進而求取相關之破裂力學參數:應力強度因子及能量釋放
率。論文中考量兩種不同之介金屬化合物裂縫位置:1.介金屬化合物
與銅墊片間的界面、2.介金屬化合物層的中間。另外,本論文並考慮
不同介金屬化合物厚度與不同裂縫長度對裂縫行為之影響。在有限元
素法模擬中,假設錫球的機械性質為與溫度及時間相關的彈塑性-黏
塑性-潛變;底膠材料性質則假設為黏彈性。本論文利用有限元素法
中全域模型及局部模型之技巧;並且為了避免在有限元素分析中元素
重疊現象發生與實際不符,利用了接觸對技巧來建構次局部模型。結
果指出兩種不同之介金屬化合物裂縫位置以裂縫長度為變數時,對於
破裂力學參數均有較佳之趨勢;然而當以介金屬化合物厚度為變數
時,對於破裂力學參數則均無明顯之影響。
The crack behavior of the intermetallic compounds (IMC) for the
solder joints of electronic packages under thermal cycling tests were
analyzed using the finite element method in this research. The finite
element method was employed to calculate the fracture-mechanics
parameters at the crack tip; such as stress intensity factor and energy
release rate. Two positions will be considered to initiate the crack: the
first one is at the interface between the IMC and the copper pad; and the
other one is at the inner part of IMC. Furthermore, the effects of crack
length and thickness of IMC on the crack tip parameters were also studied
in the research. In the simulated analysis, the property of the solder will
be assumed to be elastic-plastic-creep, and that of the underfill,
viscoelastic. The global-local modeling technique was used in the finite
element analysis to obtain the detailed stress/strain behavior near the
crack tips. It is found that for both the interfacial cracks and the IMC
cracks, the mode I stress intensity factor reduces with the length of crack.
The trend of decreasing for mode I stress intensity factor reaches a stable
value with the propagation of the crack. However, the mode II stress
intensity factor reduced significantly with the crack length. Furthermore,
the thickness of IMC has slight effect on the stress intensity factors under
the condition of fixed crack length.
中文摘要 Ⅰ
英文摘要 Ⅱ
致謝 III
章節目錄 IV
圖表目錄 VI
符號說明 .X
第一章 緒論 1
1-1 前言、研究動機和目的 1
1-2 研究方法 3
1-3 本文架構 4
第二章 文獻回顧 5
第三章 有限元素分析與破裂力學理論 15
3-1 有限元素分析 15
3-1-1 研究對象 15
3-1-2 模型簡介 18
3-1-3 材料性質與基本假設 19
3-1-4 邊界與負載條件 21
3-2 破裂力學理論 22
3-2-1 界面脫層之應力強度因子 22
3-2-2 單一材質裂縫之應力強度因子 25
第四章 結果與討論 27
4-1 數值模擬之收斂性 27
4-2 假設裂縫位於介金屬化合物與銅墊片界面處 28
4-2-1 改變裂縫長度對破裂力學參數之影響 28
4-2-2 改變介金屬化合物厚度對破裂力學參數之影響 29
4-3 假設裂縫位於介金屬化合物層的中間位置 29
4-3-1 改變裂縫長度對破裂力學參數之影響 29
4-3-2改變介金屬化合物厚度對破裂力學參數之影響 30
4-4 小結 30
第五章 結論 32
參考文獻 34
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