臺灣博碩士論文加值系統

本研究主要目的在於探討捲帶式晶粒接合技術中之內引腳接合製程。由於在接合過程中壓合力量與各元件尺寸所造成的內引腳彎曲結果變化，造成內引腳彎曲處斷裂，對於封裝產品之品質影響甚鉅。本文以 ANSYS 為分析工具，根據產業界實際生產製程之數據進行參數化單引腳不含晶片模型之模擬探討，所選取的參數為引腳突出凸塊量、壓頭突出凸塊量與引腳寬度。引腳彎曲處的應力會隨著凸塊下沉量的增加而先增後減，引腳彎曲處的應力隨著引腳突出凸塊左端的增加而變大，降低壓頭右端突出凸塊量可降低引腳彎曲處的應力，增加引腳截面寬度造成引腳彎曲處應力先增後減。
進而再以整組模型含晶片之四分之一方式進行模擬分析，觀察每支引腳彎曲處的應力及其應力改變情形，由結果可知，最大應力皆發生在長、短邊的第一支，但短邊的第二、三支的相對改變量最大。同樣進行尺寸參數化之分析探討，由模擬結果可知，當增加壓頭右端突出凸塊的距離時，將增加引腳彎曲處的應力值，但第二、三支的應力改變量會降低。若是改變壓頭右端突出凸塊的變化，短邊及長邊引腳彎曲處的應力與應力差會大幅度的降低。引腳寬度的增加並不會降低引腳彎曲處的應力，但會降低引腳彎曲處每一支的應力差。

The geometric layout of TAB and the bonding condition have a great impact on the Inner Lead Bonding (ILB) process of the Tape Automated Bonding (TAB) technology. The subject of this thesis is to investigate how the stress variation of lead is influenced by lead length, bond length and lead width. The ANSYS software is selected as the main analysis tool to simulate the ILB process. Firstly, one uses of ANSYS software to analyze typical ILB process parameters of single-lead model from literature. This can help to validate the reliability of ANSYS software. Secondly, to analyze a physical ILB parameters obtained from semiconductor industry. One explores the relation between parameters (lead length, bond length and lead width) and lead stress distributions. In the last part, a quarter multiple-lead modeling is created to completely simulate the ILB process. According to the results, the maximum stress occurs at the first lead and the stress distribution is smaller from outside to the inner. Also, the stress variation between each lead occurs at the second and the third lead that is why the broken of second or third lead perplexed the industry.
Based on the simulation results, it is possible to provide the industry a way to find out an optimal set of parameters for ILB process.

誌 謝…………………………………………………………………I
中文摘要……………………………………………………………… II
英文摘要………………………………………………………………III
目 錄……………………………………………………………… IV
表 目 錄……………………………………………………………… VI
圖 目 錄………………………………………………………………VII
第一章 緒論
1.1 前言……………………………………………………1
1.2 研究動機與研究目的…………………………………3
1.3 文獻回顧………………………………………………5
1.4 研究內容與方向…………………………………… 12
第二章 TAB製程簡介…………………………………………………… 13
第三章 ANSYS有限元素分析討論
3.1 針對單引腳模型進行驗證討論 ………………………… 23
3.2 A 廠 TAB 製程有限元素模擬分析……………………… 36
3.3 以整組引腳模型方式進行模擬分析討論………………… 53
第四章 結論與建議
4.1 結論…………………………………………………………………68
4.2 建議…………………………………………………………………69
參考文獻……………………………………………………………………… 70

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