臺灣博碩士論文加值系統

本文使用有限元素分析法探討三維覆晶式塑膠球柵陣列(FC-PBGA)構裝全域模型在等溫熱循環測試(TCT)下之應力與應變行為，並以次結構模型技術(Sub modeling technique)進一步建立最易破壞的錫球分析錫球潛變行為及疲勞壽命。
在對於錫球的分析研究中，吾人使用Double Power Law Model、Hyperbolic Sine Law Model及Norton’s Model三種潛變模式模擬錫球潛變狀態，並將其結果代入疲勞壽命公式以進行可靠度分析。
最後將所得數據相互比對其趨勢、潛變行為及疲勞壽命，進行分析與討論，讓希望使用此結構之使用者透過事前分析預測其結果、更瞭解此結構之特性，進而對於此類封裝結構進行最佳化設計。

The three dimension of FC-PBGA solder Joint of Thermal Cycling Test analyzed by Finite Element Method was investigated in papers. This papers were used simplified model to study the stress and strain behavior of solder joint in order to decrease the analysis time. A more convenient procedure was used in some paper, we will create a FC-PBGA package global model and use equivalent material property to model the solder bump and solder ball layer in this model, and we can use the sub-modeling approach to create a sub-model and use the displacement result of global model to be sub-model constrains. This approach could let us create a detail structure we didn’t create in global model in sub-model to improve the analysis time and find the similar result with model which create all structure. This kind of procedure can instead of the simplified model and analyze the more
complicated structure.
In this study, we will use this procedure to simulate the stress/strain behavior of 63Sn/37Pb eutectic solder joint for flip-chip plastic ball grid array (FC-PBGA) packages. The solder joint were considered three kinds of creep models and a temperature dependent stress-strain curve in the simulation. In this study, we were compare the mechanical behavior and fatigue life by the different creep model, the layer of solder joint and the
thermal fatigue life prediction models.

中文摘要 Ⅰ
英文摘要 Ⅱ
誌謝 Ⅲ
章節目錄 Ⅳ
表目錄 Ⅵ
圖目錄 Ⅶ
符號說明 ⅩⅡ
第一章 緒論 1
1-1 前言 1
1-1-1 電子構裝簡介 1
1-1-2 本文採用封裝型式簡介 7
1-2 研究動機與目的 14
1-3 研究方法 16
1-4 章節概要 19
第二章 文獻回顧 20
第三章 研究方法 24
3-1 有限元素分析 26
3-1-1 全域模型之建立 27
3-1-2 次模型之建立 32
3-1-3 定義材料性質 37
3-1-4 束制條件定義 39
3-1-5 負載條件設定 41
3-1-6 硬體環境 42
3-2 非線性分析理論 42
3-3 潛變模型 46
3-4 疲勞破壞模型 49
3-5 分析種類 51
第四章 結果與討論 53
4-1 全域模型等效層驗證 53
4-2 全域模型結構分析 59
4-3 次模型結構分析 74
4-3-1 球柵陣列層錫球結構分析 81
4-3-2 覆晶封裝層錫球結構分析 100
4-4 疲勞壽命比較 118
第五章 結論 121
參考文獻 123

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