臺灣博碩士論文加值系統

中文摘要

　　本文目的乃於應用微機電製程技術之表面微細加工技術製作成可撓式微型壓阻式壓力感測器。微型感測器除了較一般傳統感測器有更小的體積外，也因其尺寸的微型化而更易達到精密的量測與較佳的靈敏度。而不管是何種元件在與量測電路或儀器作整合時，微小的尺寸更易達到良好的整合與方便的攜帶性。本研究是利用沉積一層白金做為感測層，而金則是做為導線，再利用聚醯亞胺(polyimide)進行上下的保護層，而基底利用鑽數個不同孔徑大小的PDMS軟墊,在量測上，藉由不同砝碼的重量及不同孔徑的大小，觀察到的電阻值及靈敏度都有所不同。本研究之實驗結果顯示孔徑和重量越大所量到的電阻值越大，利用同一組砝碼重量及不同孔徑所量測的數據，觀察其靈敏度，發現孔徑越小靈敏度越小，孔徑越大靈敏度越大，故以簡單的構造與材料之特性即可達到量測壓力的效果。

關鍵字 : 聚醯亞胺，壓力感測器，PDMS，微機電系統

ABSTRACT

The purpose of this paper is to apply Surface Micromachining of MEMS techniques to manufacture a micro flexible piezoresistive pressure sensor. Micro sensors not only have a smaller physical size than their traditional counterparts, but also provide a greater measurement accuracy and a higher sensitivity. MEMS components integrate with measured circuit or devices and miniature dimension is easier to get well to be conveniently portable. In this study, a platinum layer is deposited to form resistors and a Au layer is deposited on the resistors to serve as an electrode and to provide electrical leads, which are sandwiched between two polyimide layers as flexible substrates. Then we manufacture a bottom plate of PDMS which be broached five different diameters of holes. When we apply a weight on the pressure sensor placed on the PDMS, bottom plate we can measure the resistance variation to determine the pressure. The experimental data indicate that sensing sensitivity increases with the diameters of holes of PDMS plates and the applied pressure. Therefore it is easily to measure pressure by simplified structure and characters of materials.

Keywords：polyimide，press sensor，PDMS，MEMS

目錄

封面內頁
簽名頁
授權書...................................................................................................iii 中文摘要..............................................................................................iv英文摘要................................................................................................v
誌謝.......................................................................................................vi
目錄......................................................................................................vii
圖目錄...................................................................................................x
表目錄..................................................................................................xii
符號說明.............................................................................................xiii

第一章　諸論
1.1前言...................................................................................1
1.2微機電系統.......................................................................2
1.2.1元件與應用............................................................4
1.3壓力感測器之介紹...........................................................5
1.3.1壓力感測器的種類................................................7
1.3.2壓力感測器的基本特性........................................9
1.4壓力感測器研究動機與目的.........................................12
1.5 文獻回顧 ............................................................13 1.5.1可撓式感測器發展現況..............................................13
第二章　微壓力感測器理論與設計
2.1微壓力感測器原理 ......................................................17
2.2 微壓力感測器之尺寸設計...........................................18
2.3 不同孔徑尺寸大小之設計...........................................18
第三章 薄膜結構製作與製程處理
3.1簡介
3.2壓阻式壓力感測器製程介紹
3.2.1晶圓選擇與準備.................................................20
3.2.2蒸鍍犧牲層..........................................................21
3.2.3下保護層之成形..................................................21
3.2.4定義白金電感測電阻圖案..................................21
3.2.5定義金電極圖案..................................................22
3.2.6上保護層之成形..................................................23
3.2.7蝕刻......................................................................23
3.2.8 PDMS製程..........................................................23
3.3相關製程技術簡介.........................................................24
3.3.1晶片清潔..............................................................24
3.3.2微影製程..............................................................26
3.3.3蒸鍍......................................................................29
3.3.4金屬層剝離(Lift-off)...........................................30
3.3.5蝕刻......................................................................31
3.4製程儀器.........................................................................32
3.4.1電子束蒸鍍機......................................................32
3.4.2加熱盤..................................................................33
3.4.3曝光機..................................................................33
3.4.4烘箱......................................................................35
3.5製程與討論.....................................................................35
第四章 實驗結果與討論
4.1實驗數據討論................................................................37
4.2微壓力感測器量測結果................................................37
4.2.1感測器電阻值對壓力的變化.............................37
4.2.2不同孔徑大小對電阻值變化..............................38
第五章 結論與未來展望
5.1結論................................................................................39
5.2未來展望........................................................................39
第六章 參考文獻..............................................................................40

第六章 參考文獻

[1] .Sedra,A.S and Smith,K.C. Microelectronics Circuits, Holt, Rinehart, andWinston. ,1987.
[2]. Ken-ichi YOSHIDA, Hiroshi TANIGAWA, “Development of a force sensor for minute load measurement”, Electronic Manufacturing Technology Symposium, 1989,Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International, pp. 201-204,1989.
[3] K. E. Peterson, “Silicon as A Mechanical Material,” Proceeding of the IEEE, 70.5, pp. 420, 1982.
[4] H. Guckel, and D. Burns, Planar Processed Polysilicon Sealed Cavitiesfor Pressure Transducers Array, pp. 223-225, IEDM, 1984
[5].蓋永鋒，微型壓阻式壓力感測器製作之研究，國立成功大學工程科學系碩士論文(2000)
[6] D.J.Beebe,D.D.Denton,J.G. Webster,R.G.Radwin,”A Polyimide Packaging Process For A Semiconductor Diaphragm Tactile Sensor,”Proceedings of the 12 Annual International Conference of the IEEE,University of Wisconsin,USA,pp.1058-1059,1990
[7] D.J.Beebe,D.D.Denton,”A Flexible Polyimide-based Package for Silicon sensors,”Sensors and Actuators A,vol. 44,pp57-64,1994
[8] M.H.Li,J.J.Wu,and Y.B.Gianchandani,”High Performance Scanning Thermal Probe Using a low Temperature Polyimide- Based Micromachining Process,”Micro Electro Mechanical Systems,2000.The Thirteenth Annual International Conference of the IEEE 2000. Wisconsin Univ .Madison,WI,USA,pp763-768,2000
[9]T.Stieglitz,H.Beutel,R.Keller,M.Schuettler,J.U.Meyer,Flexible,polyimide-basedneuralinterfaces,” Proceedings Of the Seventh Intermational Conference of the IEEE 1999.Sanktingbert,Germany,pp. 112-119,1999
[10] G.B.Lee,Y.F.Gai,H.C.wu,Y.C.Lin,J.H.Chou,J.J.Miau,and C.Y.Wei,”Development of a Surface-Micromachined PressureSensor on a Flexible Substrate,”The3 Nano Engineering and Micro System Technology Workshop,May,1999.
[11] F. Jiang, G. B. Lee,Y.C.Tai,C.M.Ho,”A flexible micromachine-baesd shear-stress sensor array and its application to separation-point detection,”Sensors and Actuators A,vol.79,pp.194-203,2000.
[12] F.Jiang,Y.C.Tai,K.Walsh,T.Tsao,G.B.Lee,C.M.Ho,”A flexible MEMS technology and its first application to shear Stress sensor skin,”Micro Electro Mechanical Systems,1997.Proceedings,IEEE.,10 Annual InternationalWorkshop,Pasadena,CA,USA,pp.465-470, 1997.
[13] Wen J.Li,John D.Mai,C.M.Ho,”Sensors and Actuators on
Non-planar substrates,”Sensors and Actuators A, vol.73, pp.80-88,1999.
[14] M.G.Allen,M.Scheidl,R.L.Smith,”Design and fabrication of movable silicon plates suspended by flexible supports,”Micro Electro Mechanical Systems,1989, Proceedings,An Investigation of MicroStructures, Sensors,Actuators,Machines and Robots.IEEE, MA,USA,PP.76-81,1989.
[15] M.Uesaka,K.Hakuta,K.Miya,K.Aoki,A.Tankahashi,”
Eddy-Current testing by flexible microloop magnetic
sensor Array,”Magnetics,IEEE Transactions,Japan,
vol.34, Issue 4 Part 2.pp.2287-2297,July 1998
[16] R.H.Lin,M.J.Vasile, D.J.Beebe,”The fabrication of Nonplanar spin-on glass microstructures,”Microelectromechanical Systems,USA,vol.8,Issue2,pp. 146-151,June 1999.
[17] 工研院機械工業研究所,微機電系統之技術現況與發展,工業技術研究院, p. 89, 86 年8 月修訂
[18] 莊達仁, VLSI 製造技術, pp. 183-186, 高立, 臺北, 民國87 年
[19] 吳智豪,可撓式溫度感測器陣列, 國立成功大學工程科學系士論文(2001)
[20] 李正中，薄膜光學與鍍膜技術，2 版，藝軒圖書出版社，
90 年元月
[21].台灣日真電子束蒸鍍機操作手冊