臺灣博碩士論文加值系統

探針卡從1969年開始發展至今，主要的基本製造技術仍然以探針與環氧樹酯(needle/epoxy)的組裝方式成型。然而，利用上述傳統方式製作的探針卡，受限於裸晶數目越驅複雜化及其電極板的間距縮小化，已無法滿足現有的高效能積體電路裸晶測試規格。然而，透過矽微加工製程的批量製造方式，在基材上製作數千個小於數百微米的微探針結構，便能有效的達到晶片測試的要求。目前為止，已有許多研究團隊利用微機電技術製作具有不同功能之微探針卡，但是受限於矽微加工的製程條件，其探針卡的設計存在著許多缺點，包括接觸力太小、位移行程不足、以及製程步驟較複雜等，換言之，微機電技術製作之微探針卡主要面臨的問題是每個獨立探針無法有效的刺穿金屬電極板表面的氧化層，進而降低測試的可靠度。因此，為了改善目前的技術瓶頸以達到較佳的晶片測試結果，本計畫擬提出一個微機電式微探針卡，利用體型微加工及電鑄鎳微製程技術製造具有出平面預變形的電鑄鎳微懸臂探針陣列，以滿足小間距電極板之裸晶的高頻訊號測試。

The first probe card, called a needle/epoxy ring probe card, was developed in 1969 and the same basic technology is still used today. However, the implementation of high performance probe becomes difficult with the conventional technology, because the number of per die increases and the pitch between pads decreases. In order to achieve those requirements, there have been several attempts to fabricate probe structure with batch silicon microfabrication process, since the dimensions of micromachined structures can easily be smaller than a few hundreds of micrometers. Some groups have so far developed MEMS type probe cards with various structures. However, those probes have several limitations: low contact force, short overdrive, complex process steps, and poor reliability. In other words, the critical problem of the micromachined probe cards is that each probe can not endures or produces the force required to break oxide on metal surface. In order to improve the above bottlenecks existing for getting better die test results, this research proposed a MEMS probe card that is composed of an array of Ni microprobes with out-of-plane predeformation using bulk micromachining and electroplating fabrication to solve the limitation of fine pitch and high frequency, and problem of silicon process.

目錄

中文摘要........................................................................................................................I
Abstract……………………………………………………………………………...II
目錄………………………………………………………………………………...III
圖目錄..........................................................................................................................V
表目錄……………………………………………………………………………VIII
第一章 緒論..................................................................................................................1
1.1 研究背景及動機……………………………………………………………….1
1.2 研究目的及其重要性………………………………………………………….2
1.3 國內外相關研究.................................................................................................4
第二章 微探針結構設計………………….………………………………………20
2.1 結構設計與測試機制………………………………………………………21
2.2 理論分析…………………………………………………………………...22
2.3 ANSYS模擬…..………………………………………………………22
第三章 製程規劃……………………………………………………………….30
3.1實驗進行步驟…..…………………………………………………………30
3.1.1製程設計……..……………………………..……………………………31
3.1.2光罩設計…………………………………………..……………………35
第四章 實驗結果與討論……………….…………………………………….43
4.1製程參數粹取…..…..………………………………………………………43
4.1.1 微影……………….……………………………………………………43
4.1.2 蝕刻……………….……………………………………………………44
4.1.3 薄膜沉積………………….……………………………………………45
4.2微探針結構……………..………………………………………………..46
4.3電極板製作………………………………………………………………..49
第五章 結論…………………………….…………………………………….67
5.1 結論…….………………………………………………………………..67
5.2後續研究工作………………………………………………………..68
5.2.1 機械特性量測…….……………………………………………………68
5.2.2 電性特性量測…….……………………………………………………69
5.2.3 訊號測試………….……………………………………………………69
參考文獻……………………………………………………………………………..74
附錄A.....................................................................................................79












圖目錄

圖1.1 國內半導體產業產值………………………………………………………11
圖1.2傳統式環氧樹脂環探針卡……………….………………………………...11
圖1.3 2003具代表性MEMS公司的產值比較………………………………..12
圖1.4傳統探針結構示意圖……………………………….…….………………...12
圖1.5傳統式探針卡...........................................................................................13
圖1.6周圍排列(peripheral)跟陣列式(array)電極板之測試示意圖…..13
圖 1.7 加熱致動型微探針結構圖..…………………………………...……..…......14
圖 1.8 利用SOI 晶片所製作之微探針型式............................................................14
圖1.9具有凸塊之探針卡示意圖.............................................................................15
圖1.10於各種尺寸下之捲曲式結構成形圖...........................................................15
圖1.11三維微探針結構………………………………….……………………….16
圖1.12電鑄鎳之微機電探針結構………………………………………………..16
圖1.13懸臂樑探針矩陣……………………..…………………………………..17
圖1.14葉片型式的微探針卡………………………..…………………………..17
圖1.15 S-shape 的彈簧結構探針卡……………………………………………18
圖1.16雙層薄膜之微機電探針卡………………………………………………18
圖1.17經退火處理之微探針SEM圖…………………………………………19
圖2.1微探針結構示意圖………………………………………….……………..24
圖2.2微探針卡應用在晶片測試之示意圖(a)測試前(b)測試過程中…………..25
圖2.3微探針結構的兩種典型結構設計(a)微懸臂樑(b)V型微結構…………26
圖 2.4 Ti/SiO2薄膜製作之雙層微懸臂結構(a)SEM影像圖(b)長度與出平面形變
量關係圖………………………………………..……………….…….27
圖2.5微懸臂結構長度與出平面變形的幾何關係…………………..…………..28
圖2.6微探針結構之機械特性模擬結果…………………………….…………..29
圖3.1電鑄鎳微探針結構之製造流程圖（方法一）………………..…………..38
圖3.2電鑄鎳微探針結構之製造流程圖（方法二）………………..…………..39
圖3.3電鑄鎳微探針結構之製造流程圖（方法三）………………..…………..40
圖3.4微探針主結構與訊號量測電極板之結構設計圖……………..…………..41
圖3.5電鑄鎳出平面微探針結構之光罩設計圖（mask #1）……..…………..41
圖3.6電鑄鎳出平面微探針結構之光罩設計圖（mask #2）……..…………..42
圖3.7電鑄鎳出平面微探針結構之光罩設計圖（mask #3）……..…………..42
圖4.1簡易光罩所製作之距齒狀微探針圖…….…………………..…………..53
圖4.2微探針結構（a）BOE 蝕刻後（b）過蝕刻之圖形………..…………..54
圖4.3 KOH 蝕刻之實驗架構圖……..………….………………….…………..55
圖4.4 KOH 蝕刻之實驗結果圖（a）底部平整（b）底部形成凸塊………..….56
圖4.5蒸鍍鋁金屬時微探針往下位移變形圖………………….........…………..57
圖4.6蒸鍍厚度不均勻時的微探針…………………………………….………..57
圖4.7二氧化矽微探針結構之SEM圖……………………………...…………..58
圖4.8於二氧化矽表面蒸鍍Ti之微機械探針結構SEM圖………….………..58
圖 4.9電鑄鎳5 �慆（a）與10 �慆（b）後再進行矽微加工之微機械探針結構
SEM圖……………………………………………………………………..59
圖 4.10 先進行矽微加工再電鑄鎳(a) 5 �慆 (b) 10 �慆厚之微機械探針結構
SEM圖…….………………..…………..………………………………..60
圖4.11電鑄鎳30�慆厚之微機械探針結構（a）微探針矩陣（b）局部放大..61
圖4.12出平面形變量隨長度的變化關係圖…………………………..…………..62
圖4.13微機械探針結構（a）遮蔽式光罩（b）局部放大…………………..…..63
圖4.14使用遮蔽式光罩下所蒸鍍之電極板圖形…………………….…………..64
圖4.15對準後的微探針矩陣…………………………..……………..…………..64
圖4.16蒸鍍鈦金屬後的微探針矩陣………….…………..………..…………..65
圖4.17 Lift-off所製作出的微機械探針圖……………..…….…..…………..65
圖4.18雷射切割後所實現之獨立電極板圖…………..…….…..…………..66
圖4.19雷射切割槽寬度為10 μm的微機械探針圖…..…….…..…………..66
圖5.1微探針結構之機械特性量測(a)集中力測試(b)側向力測試….…………..72
圖5.2微探針結構之電性特性量測示意圖…………………………..…………..73
圖A.1晶圓針測流程……………………………………………………….…….87
圖A.2 ATE銷售分佈情形……………………………………..…………………87


















表目錄

表1.1半導體技術演進比較……..……………………………………….………….10
表1.2全球十大探針卡廠商…………………………………………………………10
表3.1探針卡尺寸概略…………………………………………..…….…………….37
表3.2光罩尺寸設計規格………………………………………..……………….….37
表4.1製程參數表…………...…………………………………..……….…….…….51
表4.2微機械探針蒸鍍鈦金屬厚度變化關係表………………..…………….…….51
表4.3電鑄鎳微機械探針結構使用之製程參數………………..…………….…….52
表5.1目前探針卡的規格……………………..…………….……………………….71

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