臺灣博碩士論文加值系統

本研究旨在應用影像處理技術及類神經網路理論於Array電路工程瑕疵檢測，首先利用二維的傅立業轉換及反傅立業轉換再使用二值化影像分割技術將瑕疵凸顯出來。並經由點標示(Pixel Labeling)、瑕疵缺口偵測(Defective Breach Detection)及膨脹(Dilation)等處理還原瑕疵點的原貌。再由瑕疵圖形的特性選取面積、周長、圓滑度、包含物體的最小長方形、瑕疵點所佔四方向區域面積及細線化後瑕疵點所佔四方向區域面積等六種圖形特徵，做為該瑕疵點的特徵值。
最後以特徵值當做類神經網路輸入訓練及測試參考，經由自組織映射(Self-Organizing Map Neural Network, SOM)及蟻群為基礎之自組織映射圖網路變形之系統(Ant-Based Growing SOM)、倒傳遞(BPN)及監督式自組織映射(supervised SOM)。針對Array電路工程最常見的三種金屬殘留瑕疵：圓形殘、中空圓形殘、不規則殘以及刮痕共四種瑕疵類型，並加入無瑕疵樣本進行辨識。從實驗結果可明顯地看出此四類系統可以正確的辨識出五種Array電路工程瑕疵種類，辨識率皆為100% 。我們可以將此研究實際應用於Array電路工程瑕疵檢測的線上辨識系統，以降低人為檢測的誤差。

The purpose of this research is to apply image processing technology and neural network to the defective detection of array panel. Firstly, two-dimensional Fourier transform and inverse Fourier transform are utilized and then let defects be even conspicuous by the use of binary image segmentation technology. By the help of pixel labeling, defective breach detection and dilation and some other processing techniques to make the defective spots returned to the original condition. According to the image characteristics, we identify six graphic features: area, perimeter, roundness, length and width of the least rectangle covering whole spot, four-directional areas of defective spot, and four-directional areas of defective spot after thinning, that serve as feature values of that defective spot. All the six image characteristics are served as the characteristic values for that defected spot detection.
In conclusion, the feature values can be employed as input training and testing data for neural network paradigms. The recognition process can then conducted by the application of Self-Organizing Map (SOM) neural network, ant-based SOM, BPN and supervised SOM for three common metal residue defects, such as round residue, concentric residue, irregular residue, and scrape. Samples without defects are also added to do recognition. Experimental findings clearly show that these four neural network paradigms are capable of recognizing five kinds of defects in the array panel. The recognition correctness rate can achieve 100%. We may apply this research result to the online recognition system for defective detections of the array panel to reduce human detection errors.

誌 謝....................I
摘 要....................II
Abstract..................III
目 錄.....................IV
表目錄.....................VII
圖目錄.....................VIII
第一章 諸論.................1
1.1研究背景及動機............1
1.2研究目的.................2
1.3研究範圍與限制............4
1.4研究流程..................4
第二章 文獻探討...............7
2.1 TFT-LCD製程簡介..........7
2.2圖形識別系統..............14
2.3圖形辨識―特徵選取..........18
2.4瑕疵檢測..................22
2.4.1瑕疵類型................22
2.4.2轉換法..................25
2.4.3 TFT-LCD的瑕疵檢測法.....28
2.5類神經網路理論.............31
2.5.1類神經網路...............31
2.5.2類神經網路的運作過程......32
2.5.3類神經網路的架構..........34
2.5.4隱藏層處理單元數目之選定...35
第三章 研究方法................38
3.1二維傅立葉轉換..............39
3.2影像分割：二值化.............46
3.3瑕疵點還原..................48
3.3.1點標示....................48
3.3.2瑕疵缺口偵測...............49
3.3.3膨脹......................51
3.4特徵值選取...................52
3.4.1面積......................52
3.4.2周長......................52
3.4.3包含物體的最小長方形........53
3.4.4圓滑度或稠密度.............54
3.4.5 瑕疵點所佔四方向面積.......54
3.4.6 細線化後瑕疵點所佔四方向面積...54
3.5分類器(Classifier)：類神經網路...57
3.5.1非監督式類神經網路.............57
3.5.2監督式類神經網路...............59
3.5.2.1倒傳遞類神經網路訓練及測試.....61
3.5.2.2 Supervised SOM類神經網路訓練及測試...62
第四章 研究結果與分析.................63
4.1瑕疵影像處理各參數變動對於瑕疵偵測之影響.....63
4.1.1選擇濾除寬度範圍w................64
4.1.2保留半徑r 範圍...................65
4.1.3二值化門檻值範圍n.................67
4.2瑕疵點還原及特徵選取影像處理各階段結果..68
4.2.1瑕疵點還原影像處理結果.............68
4.2.2特徵值選取影像處理結果.............70
4.3類神經網路辨識結果...................73
4.3.1 Kohonen SOM及ABSOM類神經網路聚類效能比較.....73
4.3.2倒傳遞類神經網路辨識結果............75
4.3.3 sSOM類神經網路辨識結果............76
4.3.4 BPN及sSOM最佳模式辨識結果比較......79
4.3.5瑕疵點還原前BPN及sSOM辨識結果.......80
第五章 結論及建議........................82
參考文獻................................84
一、英文文獻.............................84
二、中文文獻.............................88
附錄一...................................92
附錄二..................................100
附錄三..................................108
附錄四..................................111
附錄五..................................114

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