臺灣博碩士論文加值系統

目前LCD玻璃基板裂片技術的輔助方式已有很多，如劃線、冷卻和預彎。本文旨在探討LCD玻璃的雷射切割技術，提出一個新的彎曲輔助雷射裂片方法，以滾輪滾壓基板，產生三點彎曲應力來增加玻璃裂片速度。雷射沿切割路徑加載，滾輪緊跟於雷射之後同步移動，玻璃基板產生向下彎曲力，配合雷射加載產生的熱應力將玻璃裂斷。其破裂擴展模式，依據玻璃基板切割前端有無預製啓始裂紋，可分為兩種：有啓始裂紋之玻璃基板隨雷射與滾輪之加載，裂纹一開始落後滾輪，當滾輪加載至玻璃約2/3處時便超越滾輪達成破裂；無啓始裂紋之玻璃基板在滾輪加載至玻璃後端約1/10處時，裂紋會出現並一前一後擴展裂斷玻璃。本文所使用之雷射為CO2雷射並以離焦方式加載，此法不會對玻璃基板表面產生燒熔現象，所以斷面品質良好。本文探討其裂纹擴展機制及裂片原理，同時以有限元素軟體ANSYS，模擬滾壓雷射裂片之溫度與應力分佈，並根據應力結果解釋雷射滾壓裂片的破裂擴展機制。

The aim of this paper is to study the laser cutting technique for glass substrates. A new laser cutting method with the assistance of rolling-bending to enhance the breaking speed of the glass substrate was proposed. The glass substrate surface is heated using a CO2 laser, closely followed by a roller. The three-points-bending induced from the rolling device enables the glass substrate to generate tensile stress along the cutting path in the back-side of the substrate. The material separation is similar to crack propagation. For the case of pre-cracking in the substrate edge, the extension of the crack tip lags behind the roller. But if the substrate is crack free in the substrate edge, only a shallow-blind crack will be generated along the cutting path in the back-side of the substrate. The shallow-blind crack extends throughout the substrate immediately when the laser closes to the end of the cutting path. The SEM photographs of the breaking surface and the acoustic emission data were obtained to analyze the fracture mechanism during the laser cutting process. Finally, the finite element software ANSYS was employed to calculate the temperature and stress distributions to explain the phenomena of the breaking process.

摘要 I
Abstract II
目錄 III
表錄 V
圖錄 VI
第一章 緒論 1
1.1 研究動機 1
1.2 傳統玻璃切割技術 2
1.3 雷射切割玻璃技術 3
1.3.1 預製啓始裂紋之雷射切割玻璃技術 4
1.3.2 預彎輔助雷射切割玻璃技術 4
1.4 本文目的 6
第二章 雷射裂片系統與量測方法 17
2.1 雷射裂片系統 17
2.1.1 CO2雷射系統 17
2.1.2 滾輪系統 18
2.1.3 二軸定位平台 18
2.2 觀察與量測設備 19
2.2.1 工具顯微鏡 20
2.2.2 聲波感測器 20
2.2.3 掃描式電子顯微鏡 21
第三章 滾壓輔助雷射裂片原理 29
3.1 材料試片 29
3.2 雷射加載方式 30
3.3 預製啓始裂紋 31
3.4 滾壓效果 32
3.5 滾壓與雷射裂片程序 33
第四章 滾壓輔助之雷射裂片實驗 42
4.1 實驗參數 42
4.1.1 雷射功率與離焦距離之影響 42
4.1.2 滾輪荷重之影響 43
4.1.3 雷射與滾輪間距 43
4.1.4 試片大小之影響 44
4.1.5 二軸定位平台移動速度之影響 44
4.2 對稱裂片 45
4.2.1 預製啓始裂紋 45
4.2.2 無預製啓始裂紋 47
4.3 非對稱裂片 48
4.3.1 預製啓始裂紋 48
4.3.2 無預製啓始裂紋 49
4.4 滾壓之雷射裂片品質 51
4.5 LCD玻璃末端之探討 52
第五章 裂紋擴展過程之探討 78
5.1 預製啓始裂紋之裂紋擴展模式 78
5.1.1 無滾壓裂紋擴展模式 78
5.1.2 滾壓裂紋擴展模式 79
5.2 無預製啓始裂紋之裂紋擴展模式 80
5.2.1 無滾壓裂紋擴展模式 80
5.2.2 滾壓裂紋擴展模式 80
5.3 細微裂紋之探討 81
第六章 滾壓輔助雷射裂片之有限元素分析 93
6.1 基本假設 93
6.2 預製啓始裂纹分析 94
6.2.1 無滾壓分析 94
6.2.2 有滾壓分析 95
6.3 無預製啓始裂纹分析 95
6.3.1 無滾壓分析 96
6.3.2 有滾壓分析 96
第七章 結論 104
7.1 本文重要成果 104
7.2 未來研究方向 106
參考文獻 107
簡歷 110

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