臺灣博碩士論文加值系統

本論文實驗探討P4（Pentium4）RHE 散熱模組之熱管結合散熱鰭
片的散熱性能分析。在設定熱管熱傳導率，熱管相關尺寸，風扇性能
曲線，鰭片相關尺寸（如長度、間距、厚度）及片數、材質等條件下
分析散熱鰭片形狀參數，以期獲得RHE 較佳散熱效果。
本文所欲探討的散熱鰭片形狀共有A、B、C、D、E 組的形狀，其
中A 組為RHE 散熱鰭片43 片規則外形，B 組為RHE 新形散熱鰭片43
片，C 組為RHE 新形散熱鰭片31 片，D 組為RHE 新形散熱鰭片20 片，
E 組為RHE 新形散熱鰭片10 片。
在散熱設計中，不論是利用自然對流或是強制對流，一般最終透
過散熱鰭片，將CPU 所產生的熱能，由周遭的空氣帶走。而整個傳
熱過程中，散熱鰭片與空氣間之熱傳效果，常是最具關鍵之設計所
在。故在五種不同外形散熱鰭片下尋找最佳散熱效果。
實驗分析發現，因改變外型下鰭片沒有足夠的熱擴散面積，間接
的降低RHE 的散熱效率。在改變RHE 散熱模組鰭片外形後，模組溫
度約上升2~4.6℃，散熱效率下降16.7~28.6％。

The experiment of this thesis explores the cooling
capability of the heat pipe of P4 (Pentium4) RHE thermal module
in combination with cooling fins. Under the conditions of
established heat pipe thermal conductivity rate, heat
pipe-related size, fan capability curve, fin-related size
(such as length, spacing, thickness, number of fins and
material, We analyzed the cooling fin shape parameters, to
achieve bester RHE cooling effect.
The cooling fin shapes explored in this thesis have shapes
of A, B, C, D, and E. Of which are 43 regularly shaped A RHE
cooling fins, 43 new model B RHE cooling fins, 31 new model C
RHE cooling fins, 20 new model D RHE cooling fins, and 10 new model E RHE cooling fins.
III
Cooling designs, regardless of free convection or forced
convection, generally employ cooling fins to dissipate CPU heat
to the air. The key in the design is usually the convection
effect between cooling fins and the air. Therefore, the best
cooling effect is sought among the five cooling fins with different shapes.
Research analysis finds that a modified fin without
sufficient thermal diffusion surface will indirectly lower the
cooling efficiency of RHE. In the modified RHE thermal module
fin shape, the temperature of the RHE thermal module increased
between 2 to 4.6℃, the cooling efficiency decreased between
16.7 to 28.6%.

V
誌謝···························································································I
中文摘要············································································· II
英文摘要············································································ III
目錄··················································································· V
表目錄··············································································· VIII
圖目錄··················································································IX
符號說明···········································································XII
第一章緒論························································································· 1
1-1 前言····························································································· 1
1-2 文獻回顧····················································································· 2
1-3 研究目的與動機········································································· 5
第二章實驗方法與設備·························································· 6
2-1 實驗方法····················································································· 6
2-2 實驗模型····················································································· 9
2-3 散熱鰭片··················································································· 11
2-4 熱管特性··················································································· 22

2-5 熱管的構造與作動原理·························································· 23
2-6 熱管性能之限制····································································· 24
2-6-1 飛散界線····································································· 24
2-6-2 音速界限····································································· 24
2-6-3 沸騰界限····································································· 25
2-6-4 毛細管構造界限························································· 25
2-6-5 黏性界限····································································· 25
2-7 熱管的使用與應用································································· 26
2-8 散熱膏···················································································· 27
2-9 冷卻風扇················································································ 27
2-9-1 鰭片與風扇之操作點理論分析·································· 29
2-10 實驗設備·············································································· 34
2-10-1 電源供應器································································ 35
2-10-2 熱電偶········································································ 36
2-10-3 溫度紀錄器································································ 37
2-10-4 熱阻抗量測機···························································· 37
2-10-5 HEAT FLUX·································································· 38
2-10-6 PRESS LOAD APPARATUS ············································ 39
2-11 溫度擷取裝置········································································ 40

2-11-1 紅外線熱像儀···························································· 40
2-12 實驗參數·············································································· 41
第三章實驗結果與討論·························································46
3-1 RHE 散熱鰭片43 片規則外形（A 組）與RHE 新形散熱鰭片
（B 組）、（C 组）、（D 組）、（E 組）結果比較與討論
·······················································································46
第四章結論與建議·········································································· 48
4-1 結論························································································ 48
4-2 建議························································································ 49
參考文獻······························································································ 59
附錄······································································································· 61

【1】黨一為,林唯耕,[熱管結合散熱鰭片之效能模擬與分析],2004,
清華大學工科所論文.
【2】Bejan and E. Sciubba, “The Optimal Spacing of Parallel
Plates Cooled by Forced Convection”, Int. J. Heat Mass
Transfer, Vol. 35, No. 12, pp. 3259-3264, 1992.
【3】Shaukatullah, H., Storr, W.R., Hansen, B.J., and Gaynes,
M.A.,“Design and Optimization of Pin Fin Heat Sinks for
Low Velocity Applications”, IEEE Transactions on
Components, Vol.19, No. 4,1996.
【4】Jose R. Rujano, Rafael Cardenas, Muhammad M. Rahman,
Wilfrido Moreno, “Development of a Thermal Management
Solution for a Ruggedized Pentium Based Notebook
Computer”, IEEE InterSociety Conference on Thermal
Phenomena, pp. 8-14, 1998.
【5】Stephen Shuler, “Thermal Management: Understanding How
to Incorporate Effective Thermal Strategies into
Overall Portable Electronic Design for Better
Performance”, Material and Design, VOL. 21, pp. 39-44,2000.
【6】Kwang-Soo Kim, Myong-Hee Won, Jong-Wook Kim, Byung-Joon
Back, “Heat Pipe Cooling Technology for Desktop PC CPU”,
Applied Thermal Engineering, VOL. 23, pp. 1137-1144,2003.
【7】Charles E. Johnson, “Evaluation of Correlations for
Natural Convection Cooling of Electronic Equipment”,
Heat Transfer Engineering, Vol. 7(1-2),pp.36-45, 1986.
【8】Carill Sharpe, “Cooling Systems for Electronic
Equipment” , Design Engineering, pp. 99-100, January ,1986.
【9】David Copeland,”Optimization of Parallel Heatsinks for
Forced Convection,”Sixteenth IEEE Semi-Therm, symposue, 2000.
【10】Simons,R.E.,”Estimating Parallel Plate-Fin Heat Sink
ThermalResistance,”ElectronicsCooling,
Vol.9,No.1,pp.8-9,2003.