臺灣博碩士論文加值系統

本論文主要目的在利用實體迴路(Hardware In the Loop, HIL)的概念，針對半導體製程中的化學機械研磨機台(Chemical Mechanical Polishing, CMP)，設計一套包含模擬器與控制器的平台。研究重點在於利用兩台獨立的工業電腦來設計CMP系統的模擬器與控制器，並以Windows XP及 Window 2000為發展平台，Matlab、BC++ Builder為開發工具，來完成此一架構。

論文中說明化學機械研磨機台的基本架構和主要參數，同時介紹Run To Run EWMA (Exponentially Weighted Moving Average)及FNN (Fuzzy Neural Network)控制模式，建構應用於化學機械研磨的單元控制器，並利用RS-232硬體介面來建構通訊模組將數據回傳做迴饋控制，經由修正製程設備控制系統的控制參數改善其功效。

In this thesis, we will develop a framework including simulator and controller for the Chemical Mechanical Polishing (CMP) equipment in the semiconductor industry by using the concept of Hardware-In-the-Loop (HIL). We use two independent computers to design simulator and controller for CMP process and adopt Matlab、BC++ Builder as the developing tools implemented on the Windows XP and Window 2000 platform.

We explain the basic architecture and the primary parameters for the CMP equipment. We also introduce Run to Run EWMA (Exponentially Weighted Moving Average) and FNN (Fuzzy Neural Network) concept to establish the controller for CMP process and use RS-232 hardware to build the communication module to pass the data back and forth for feedback control. As a result, the control system can be used to continuously improve the performance of the control system.

Chinese Abstract………………………………………………………Ⅰ

English Abstract………………………………………………………Ⅱ

Acknowledgement………………………………………………………Ⅲ

List of Figures………………………………………………………Ⅵ

List of Tables…………………………………………………………Ⅸ

Chapter 1 Introduction………………………………………………1

1.1 Motivation…………………………………………………………1

1.2 Literature Survey………………………………………………3

1.3 Objective of the Research……………………………………6

1.4 Thesis Outline……………………………………………………7

Chapter 2 Chemical Mechanical Planarization–An Introduction……………………………………………………………8

2.1 Development of CMP………………………………………………8

2.2 Introduction of CMP Structure…………………………………9

2.3 CMP Process Parameters…………………………………………11

2.3.1 Mechanical Parameters…………………………………11

2.3.2 Chemical Parameters……………………………………13

2.4 Model of Chemical Mechanical Planarization………………14

2.4.1 Preston Equation…………………………………………15

2.4.2 Luo and Dornfeld Equation……………………………15

Chapter 3 Run-to-Run Control Law…………………………………17

3.1 Introduction of Run-to-Run control…………………………17

3.2 History of the Development of Run-to-Run Control………18

3.3 EWMA based Run-to-Run Control System………………………19

3.4 Fuzzy Neural Network based Run-to-Run Control System…22

3.4.1 Radial Basis Function based Fuzzy Neural Network…………………………………………………………………22

3.4.2 The Training of the Network…………………………24

3.4.3 The Concept of Zero Error Tracking Control………27

Chapter 4 Simulation and Analysis for CMP Controller………31

4.1 Simulations using Preston Equation for SiO2 CMP Process…………………………………………………………………31

4.1.1 EWMA controller for Preston Equation………………31

4.1.2 Zero Error Tracking Fuzzy-Neural Network Controller for Preston Equation…………………………………32

4.1.3 Comparison of Simulation Results……………………33

4.2 Simulations using Luo and Dornfeld Equation for Copper CMP Process……………………………………………………………34

4.2.1 EWMA Controller for Luo and Dornfeld Equation…34

4.2.2 Zero Error Tracking Fuzzy-Neural Network Controller for Luo and Dornfeld Equation………………………35

4.2.3 Comparison of Simulation Results …………………36

4.3 Summary of Simulations…………………………………………36

Chapter 5 Run-To-Run Controller Implementation………………37

5.1 Hardware and Module Descriptions……………………………37

5.2 Program Design Flow……………………………………………38

5.3 Introduction of Run-To-Run Operator Process
Interface………………………………………………………………40

5.4 Summary and Contribution………………………………………42

Chapter 6 Conclusion and Future Work……………………44

Reference…………………………………………………………72

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