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研究生:李秉錡
研究生(外文):Ping-Chi Lee
論文名稱:脈衝電壓對電化學加工精度之影響
指導教授:洪勵吾
指導教授(外文):Lih-Wu Hourng
學位類別:碩士
校院名稱:國立中央大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2006
畢業學年度:94
語文別:中文
論文頁數:75
中文關鍵詞:微電化學加工電雙層電雙層充電行為
外文關鍵詞:electric double layerelectrochemical micromachiningdouble layer charging
相關次數:
  • 被引用被引用:3
  • 點閱點閱:320
  • 評分評分:
  • 下載下載:99
  • 收藏至我的研究室書目清單書目收藏:0
摘要
近年來微電化學加工的應用在電化學加工過程中扮演著非常重要的角色,若在微電化學加工系統中施以極短的脈衝電壓,藉著金屬與電解液界面上的電雙層電容器的充電行為,能夠將電化學反應侷限於電極間隙較小的區域,亦即電化學鑽孔加工中的鑽孔區。除了能提高加工精確度之外,對於加工效率的提升也有相當大的幫助。本文即利用電雙層電容器的充電行為,來模擬電化學加工後的電位分佈與工件外型,由此來觀察脈衝電壓對電化學加工的影響,發現到若減少脈衝期間或脈衝期間可以降低過切量的發生,進而提升加工的精確度。
ABSTRACT
Electrochemical micromachining is becoming more and more important in the field of electrochemical machining in recent years. By applying ultra-short pulse voltage in electrochemical machining systems, electrical reactions can be confined to electrode regions in close proximity because of the double layer charging on the metal/electrolyte interface. Therefore, the precision can be increased as well as the efficiency of machining. This article simulated the double layer charging in electrochemical micromachining by using ultra-short pulse voltage, and the influence of pulse voltage would be also discussed.
目錄

中文摘要…………………………………………………………………Ⅰ
英文摘要…………………………………………………………………Ⅱ
目錄………………………………………………………………………Ⅲ
表目錄…………………………………………………………………Ⅴ
圖目錄……………………………………………………………………Ⅵ
第一章 緒論……………………………………………………………1
1-1 前言………………………………………………………..1
1-2 文獻回顧…………………………………………………..2
1-3 研究目的…………………………………………………..5
第二章 電雙層理論……………………………………………………….6
2-1 電極的電容值與電荷…….………………………………6
2-2 電雙層的基本觀念……………………………………….7
2-3 電雙層結構的理論模型………………………………..10
2-4 等效電路……………………………………………….12
第三章 微電化學加工之數值模擬模式………………………………15
3-1 電場分佈與加工間隙的變化………………………….15
3-2 時間常數與電極間隙的關係………………………...18
第四章 數值方法……………………………………………………21
4-1 體適合法…..……..…………………………………..21
4-2 工件外型預估的計算流程…………………………..23
第五章 結果與討論……………………………………………….25
5-1 脈衝期間的影響………………………..……..…….26
5-2 刀具進給速率的影響………...……………………..28
5-3 加工電位的影響……………...……………………..29
5-4 脈衝週期的影響………...…………………………..30
5-5 有無脈衝電壓的比較..……..………….…………...31
第六章 結論與未來展望……………………………………………….32
參考文獻…………………………………………………………………35
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