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研究生:劉瑞弘
研究生(外文):Jui-hung Liu
論文名稱:雷射光纖構裝中光纖元件的製作與量測
論文名稱(外文):Fabrication and Characterization of the Fiber Component in Laser Module Packaging
指導教授:曾逸敦
指導教授(外文):Yih-tun Tseng
學位類別:博士
校院名稱:國立中山大學
系所名稱:機械與機電工程學系研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2006
畢業學年度:94
語文別:中文
論文頁數:158
中文關鍵詞:透鏡光纖頭端研磨焊錫固定定位控制收發模組光纖元件構裝熔接面檢測
外文關鍵詞:Splicing PlaneLensed FiberSoldering MechanismLaser ModulePositioningFiber Component Packaging
相關次數:
  • 被引用被引用:4
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  • 收藏至我的研究室書目清單書目收藏:3
在光纖通訊系統中,光收發模組對於系統的效能有決定性的影響,因此收發模組的構裝品質也決定了其通訊性能的好壞。在模組中,由於光訊號是透過雷射與光纖來發送,所以兩者之間能否有效的傳遞光線,也就是雷射光纖構裝的耦光效率便顯得非常重要。加上這些元件本身的尺寸都非常微小,只有µm的等級,因此在定位、固定以及對準的精度要求都非常高,容許的誤差非常小,使得整個構裝製程面臨許多問題。這其中又以雷射光纖的構裝製程最為複雜,本文針對雷射光纖構裝中的光纖元件做深入研究,提出許多改善技術來確保收發模組的性能。

光纖元件的構裝主要可分為光纖-焊錫-套管元件的固定對準以及光纖的加工兩個部份。在光纖焊錫套管元件的構裝中,本文提出了定位與固定的技術來改善製程;在定位方面,透過兩階段控制法則的建立,讓光纖可以快速準確的定位於套管幾何中心,在0.25秒的時間內完成誤差1µm以內的定位動作,符合維持高耦光效率95%的要求。另外針對了光纖焊錫套管固定機制提出改善,將原本人工操作的方式,改由主動的焊錫注射方式,提高了焊錫固定的穩定性以及良率,可由原本的25%提升至83%。

在光纖頭端的加工上,本文針對光纖研磨製程,分析目前良率不佳的原因,搭配力量感測方式收集研磨資訊,提出研磨策略以得到良好研磨效果,實驗結果可將頭端的偏心誤差有效控制在1.5µm之內,確保研磨頭端的耦光效率。接著,為了組裝具高耦光效率的多段串接式光纖,在影像分析上利用干涉現象的資訊做為檢測依據,對串接光纖的熔接面做檢測,精確的找出熔接面,將精度提升至1µm,以利切割製程精度的改善。

以上構裝製程的改善,皆為了讓收發模組構裝後的耦光效率能夠提升或維持在理論上所設計出來的結果,將理論與實際的差距縮小,並且透過自動化的定位、感測等技術,將構裝的穩定性與重複性提高、有效縮短加工時間,提升整體良率產能,非常具實用性價值。
Optical transceiver module plays an important role in the optical communication system. The packaging quality of the module decides the ability of the communication. Since the light signal is transferred from a laser diode to an optical fiber, the light transfer efficiency between these two components becomes a very important work to be done. The micrometer dimension and the ultra-high performance requirement of these components lead to many problems in module packaging process. Among all the problems, the packaging of the fiber components is the most complicated. In this research, many key technologies are proposed to solve or improve the problems in the packaging of the fiber components. Thus, the performance of the module can be ensured. Two main topics of the fiber component packaging will be introduced here, the fiber-solder-ferrule (FSF) packaging and the machining of the fiber.

In the packaging of the FSF, a positioning and a soldering technology are proposed to improve the packaging yield. For the positioning, a novel control strategy is constructed to shorten the positioning time and improve the positioning accuracy. Thus, the position of the fiber can be positioned at the center of the ferrule fast and precisely. The controller successfully completes the positioning command in 0.25sec with 1µm accuracy. And finally, the coupling efficiency can be hold. For the soldering of the FSF, an active soldering mechanism is developed to replace the passive manual operation. The mechanism successfully proofs the stability of the soldering and raises the yield from the 25% to 83%.

In machining of the fiber, a fiber end polishing issue and a fiber inspection topic are addressed. For the fiber end polishing, an online force sensing mechanism is implemented. The force sensing mechanism can control the polished fiber tip offset within 1.5µm. So the fiber coupling efficiency can be maintained. A control strategy is designed to solve the polishing problems and reach the polishing requirement. At last, an interference-based fiber inspection method is proposed to find the splicing plane between two spliced fibers. The accuracy of the fiber cleaving in a cascaded fiber fabrication improves from 10µm to 1µm by observing the fiber splicing plane precisely.

All the improvements of the above packaging technologies are proposed to raise or keep the performance of the transceiver module. So, the error between theories and experiments can be minimized. Meanwhile, a high stability and repeatability of the packaging can be achieved due to the automation of the positioning, force sensing, and inspection.
謝誌 i
目錄 ii
圖目錄 iv
表目錄 vii
符號說明 viii
中文摘要 1
英文摘要 3
第1章 緒論 5
1-1 光纖通訊簡介 5
1-2 光收發模組構裝 7
1-3 光纖元件構裝 10
1-4 研究目的 15
第2章 光纖套管構裝 19
2-1 精密定位:光纖偏心誤差的控制 19
2-1-1 光纖偏心誤差 19
2-1-2 光纖焊錫套管構裝製程 23
2-1-3 製程問題分析 25
2-1-4 微觀定位文獻回顧 27
2-1-5 運動系統描述 28
2-1-5-1 巨觀動態模式建立 29
2-1-5-2 微觀動態模型探討 34
2-1-6 控制器設計 36
2-1-6-1 巨觀階段控制器 37
2-1-6-2 微觀階段控制器 38
2-1-6-3 動態切換條件 42
2-1-7 實驗步驟與結果 45
2-1-8 結論 48
2-2 焊錫固定: 主動式焊錫注射技術 50
2-2-1 焊錫固定問題 50
2-2-2 毛細現象分析 53
2-2-3 主動式注射機構 55
2-2-4 焊錫注射機構設計 57
2-2-4-1 規格要求 57
2-2-4-2 焊錫注射機構設計 58
2-2-5 實驗步驟與結果 64
2-2-6 結論 68
第3章 高耦光效率光纖的製作 69
3-1 研磨加工:透鏡光纖頭端研磨 69
3-1-1 透鏡光纖耦光理論 69
3-1-2 橢圓透鏡光纖介紹 71
3-1-3 研磨製程描述與問題說明 74
3-1-3-1 四面錐形光纖頭端製程說明 74
3-1-3-2 研磨問題描述 75
3-1-4 光纖受力分析 78
3-1-5 機構設計 83
3-1-5-1 懸臂樑尺寸 85
3-1-5-2 懸臂樑材料 85
3-1-5-3 應變規挑選與測量原理 86
3-1-5-4 小結 91
3-1-6 研磨策略 93
3-1-6-1 磨盤接觸點偵測 93
3-1-6-2 研磨速度控制 94
3-1-6-3 研磨深度控制 95
3-1-7 實驗雜訊分析與結果 99
3-1-7-1 雜訊來源分析 100
3-1-7-2 研磨實驗 104
3-1-8 結論 112
3-2 檢測技術:多段串接光纖熔接面檢測 113
3-2-1 多段串接光纖 113
3-2-2 多段串接光纖製程 118
3-2-3 熔接面檢測策略 122
3-2-4 干涉現象模擬 127
3-2-5 實驗 132
3-2-6 結論 135
第4章 總結 137
參考文獻 140
作者簡介 146
著作清單 147
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