臺灣博碩士論文加值系統

本研究運用機械切割方式對玻璃進行切割，在玻璃表面直接切下，產生大約為玻璃厚度10~20%的裂縫深度，再由機械應力的方式將玻璃扳裂，搭配ANSYS以有限元素法(FEM, Finite Element Method)，進行相關研究及比對，評估其未來切割條件的改變使得生產良率的提升之可行性。
本文研究目的主要為利用有限元素法找出切割後表面破片應力分佈狀態，並以實體基板切割後產生水平裂痕(Median crack)之結果，與切割參數調整刀壓及壓入深度之討論，比對有限元素分析後結果，作為切割後外觀品質好壞之探討，減少可能增加之外觀不良之風險。

This study is the method of using the mechanical type to cut the substrate of the glass , under the circumstances that the glass surface is cut directly, probably produced 10∼20% of the depth of crack that is the thickness of glass, and then pulled the glass and split by mechanical stress , use the ANSYS and finite element method carry on relevant research and compare, survey the perfect cutting parameter to increase the yield in the future.
This study is in order to find out the surface fracture stress distribution status after cutting and take advantage with the finite element method ,and compare with the result of median crack when glass substrate after cutting .It discuss with change parameter of the cutting pressure and Cutting depth ,than to compare with finite element method, it regard as discussing the quality after cutting to reduce the risk of surface defect.

第一章 緒論
1-1 前言
1-2 研究動機與目的
1-3 研究架構

第二章 文獻回顧
2-1 理論基礎探討
2-1-1 切割流程及技術
2-1-2 切割對於玻璃基板品質之影響
2-1-3 應力理論闡述
2-1-3-1 彈性應力應變之關係
2-1-3-2 平面應變問題
2-2 ANSYS分析軟體之應用

第三章 研究方法
3-1 實驗步驟
3-1-1 實驗條件參數
3-2 有限元素分析程序
3-2-1 材料參數及模型尺寸定義
3-2-2 有限元素模型建立
3-2-3 邊界條件設定
3-2-4 負載定義

第四章 結果與討論
4-1 分析說明
4-2 結果討論

第五章 結論
參考文獻

[1] Http://www.corning.com.tw
[2] S. Miwa, T. Onoda, S. Yamamoto, “Cutting of Non Alkali Glass Sheet OA-2 for AM-LCD,” Proc Japan Display ‘92,pp.807-808,1992.
[3] H. S. KANG, “A Study of Cutting Glass by Laser”, Proc. Spie Vol.4426, p367-370,2002.
[4] A. G. Jackson, W. M. Scott, “Precision scribing and breakout of soda-lime glass for display application,” Proceedings of Display Works ‘98,pp.47-48,1998.
[5] O. Toshihko, “Study on LCD Glass Substrate Cutting Using Scribe and Break Method”, Journal of Japanese precision engineering conference, pp11-17,2001.
[6] Y. Ikeda, “Laser breaking method of glass plate”, Journal of Japanese precision engineering conference, pp413-417,1996.
[7] C. H. Tsai ,H. W. Chen,”Laser cutting of thick ceramic substrates by controlled fracture technique”, Journal of Materials Processing Technology 136,pp.166–173,2003.
[8] C. Kurobe, “Method of cutting glass in FPD devices using YAG laser”, Journal of Japanese precision engineering conference Vol.63, No.7,pp-1018-1022,1997.
[9] K. H. Yamamoto, E. Ohmura, “Thermal Stress Analysis on Laser Scribing of Glass” Proceedings of the 23rd International Congress on Applications of Lasers and Electro-Optics2004, pp.38-34,2004
[10] B.S. Yilbas,”Laser cutting quality assessment and thermal efficiency analysis”,Journal of Materials Processing Technology 155–156,pp.2106–2115,2004
[11] B. L. Hoekstra, L. B. Glebow, O. M. Efimov,“Method and Apparatus for Separating Non-metallic Substrates Utilizing a Laser Initiated Scribe”, U.S. Patent No. 6,pp.488,2001.
[12] V. S. Kondratenko, “Method of Splitting Non- Metallic Materials”, U.S. Patent No. 5,pp.284,1997.
[13] J. C. Lapp, “Glass substrates for AMLCD applications: properties and implications”, SPIE Proc 3014. pp.2-9,1997.
[14] M.S. Kirugulige ,H.V. Tippur “Aixed-Mode Dynamic Crack Growth in Functionly Graded Glass-Filled Epoxy”, Experimental Mechanics 46,pp269-281,2006
[15] 賴育良、林啟豪、謝忠祐，“ANSYS 電腦輔助工程分析”，儒林圖書有限公司，1997 年初版
[16] 王新榮, 陳時錦, 劉亞忠, “有限元素法及其應用”, 中央圖書出版社, 1997.
[17] 王仁, 黃文彬, 黃築平, “塑性力學引論”, 北京大學出版社, 1992.
[18] V. M. Sglavo, D. J. Green. “Subcritical growth of indentation median cracks in soda-lime-silica glass,” Journal of the American Ceramic Society 78, No. 3, pp.650-656,1995.
[19] S.M. Wiederhom, A. Dretzke, J. Rodel “Crack Growth in Soda-Lime-Silicate Glass near the Static Fatigue Limit”,Journal of the American Ceramic Society 85,No.9,pp.2287-2291,2002
[20] M. H. Krohn, J. R. Hellmann,D. L. Shelleman, C. G. Pantano,G. E. Sakoske,” Effect of Enameling on the Strength and Dynamic Fatigue of Soda-Lime-Silica Float Glass”, Journal of the American Ceramic Society 85,No.10,pp.2507-2514,2002
[21] M. B. Abrams, D. J. Green, S. J, Glass”Fracture behavior of Engineered stress profile soda lime silicate glass” Journal of Non- Crystalline Solids 321,pp.10–19,2003
[22] G. Roggero,F. Scotti ,F. S. Sessa ,V. Piuri,” Quality Analysis Meas -urement for laser cutting”,IEEE Intemational Workshop on Virtual and Intelligent Measurement Systems Budapest, Hungaty, May 19-20,2001.
[23] K. Sugioka , K. Obata, K. Midorikawa ,M.H. Hong,D.J. Wu ,L. L. Wong ,Y.F. Lu ,T.C. Chong,“Advanced materials processing based on interaction of laser beam and a medium”,Journal of Photochemistry and Photobiology Chemistry 158,pp. 171–178,2003.
[24] L. Shanjin ,W. Yang,” An investigation of pulsed laser cutting of titanium alloy sheet”,Optics and Lasers in Engineering 44, pp.1067 -1077,2006.
[25] M. Nakamura, T. Sumomogi, T. Endo,” Evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope”,Surface and Coatings Technology 169 –170,pp.743–747,2003.