臺灣博碩士論文加值系統

光纖陣列模組在構裝時，須事先將光纖陣列與雷射陣列做對準動作，以找到最佳的耦合效率位置，接著再光纖陣列固定在上載具上，目前在固定光纖陣列的方式常使用黏膠、軟銲、雷射焊接等方式。然而利用這些固定方式時，由於材料在加熱與凝固的過程中會發生膨脹與收縮的現象，所以會發生六個自由度的偏移。也由於有這六個自由度的偏移，讓事先做好的最佳耦合率對準位置發生變動，而使得光纖的耦合率降低。
我們在量測偏移量時，由於光纖與雷射陣列的距離過於狹小，所以無法以正常在X、Y、Z的方向架設CCD，需利用鏡面的反射取像方式，來取得空間中的座標，藉由座標偏移來量測出偏移量。接著設計出一個減少偏移量的發生載具，將偏移量降到最低，以提高光纖陣列整體的耦合率。

For getting the position which can obtain the maximum coupling efficiency, fiber array and laser array need to be adjusted while the module of fiber array is packaging, than fastening it on the base. Nowadays, there are some methods for fastening the fiber array like adhesive, soldering and laser welding. But the material will discover some phenomenons like expansion and contraction during the process of heating and solidification. Those phenomenons will lead the system to deviate on the six degree of freedom (D.O.F). Because of the fiber array system will confront with the situation of deviation, the magnitude of coupling efficiency will drop down. It is because that the technique of laser welding will cause smaller deviation than other methods just mentioned, so the research choose the method of laser welding for packaging.
The distance between fiber and laser array is too small to fasten the CCD on the directions of X, Y and Z axes while the research measures the deviation. So the research uses a mirror to reflect the image for obtaining the correct position of the space and Post-Weld-Shift measurement the deviation of system. Afterward, the research designs a structure for reducing the deviation and increasing the coupling efficiency of system.

目錄
謝誌..............................................I
目錄.............................................II
圖目錄...........................................IV
表目錄..........................................VII
中文摘要.......................................VIII
Abstract.........................................IX
第一章 序論.......................................1
1.1 前言..........................................1
1.2 陣列模組構裝流程與接合特性....................4
1.3 研究動機與目的................................9
第二章 文獻回顧..................................10
2.1陣列光纖構裝接合方式..........................10
2.2 雷射銲接流程參數控制.........................14
2.3構裝後偏移量的量測方式........................18
第三章 研究方法..................................22
3.1 楔型陣列光纖容忍度分析.......................22
3.2 陣列光纖雷射銲接.............................28
3.3 銲後位移量測.................................33
第四章 實驗結果與討論............................37
4.1 軟體與硬體架構...............................37
4.2 雷射銲接流程.................................42
4.3 位移量測實驗結果.............................46
第五章 貢獻與未來展望............................52
參考文獻.........................................53

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